사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Spartan®-3 |
| Part Status | Active |
| Number of LABs/CLBs | 8320 |
| Number of Logic Elements/Cells | 74880 |
| Total RAM Bits | 1916928 |
| Number of I/O | 633 |
| Number of Gates | 5000000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
개요
Equivalent
The XC3S5000-4FGG900I is a Spartan-3 FPGA. Equivalent alternatives include:
- Spartan-3E (XC3S500E-4FGG900I) – Lower power, improved features.
- Spartan-6 (XC6SLX150T-3FGG900I) – Higher performance, more logic.
- Lattice ECP5 (LFE5UM-85F-8MG900C) – Competitive alternative.
- Microsemi (now Microchip) ProASIC3 (A3P3000-FGG900) – Flash-based FPGA.
For modern replacements, consider Artix-7 (XC7A200T-2FBG900I) or iCE40 UltraPlus (Lattice) for lower-cost options. Verify pin compatibility and features for your design.
- Spartan-3E (XC3S500E-4FGG900I) – Lower power, improved features.
- Spartan-6 (XC6SLX150T-3FGG900I) – Higher performance, more logic.
- Lattice ECP5 (LFE5UM-85F-8MG900C) – Competitive alternative.
- Microsemi (now Microchip) ProASIC3 (A3P3000-FGG900) – Flash-based FPGA.
For modern replacements, consider Artix-7 (XC7A200T-2FBG900I) or iCE40 UltraPlus (Lattice) for lower-cost options. Verify pin compatibility and features for your design.
Pinout
The XC3S5000-4FGG900I is a Spartan-3 FPGA with:
- Pin count: 900 (FGG900 package, Fine-Pitch Ball Grid Array).
- Key functions:
- Logic cells: ~5 million system gates.
- I/O pins: 622 user I/Os (supports LVCMOS, LVTTL, HSTL, SSTL).
- Block RAM: 1,728 Kb.
- DSP slices: None (Spartan-3 lacks dedicated DSP blocks).
- Clock management: Four Digital Clock Managers (DCMs).
- Speed grade: -4 (moderate performance).
Designed for high-volume, cost-sensitive applications like embedded systems and communications.
- Pin count: 900 (FGG900 package, Fine-Pitch Ball Grid Array).
- Key functions:
- Logic cells: ~5 million system gates.
- I/O pins: 622 user I/Os (supports LVCMOS, LVTTL, HSTL, SSTL).
- Block RAM: 1,728 Kb.
- DSP slices: None (Spartan-3 lacks dedicated DSP blocks).
- Clock management: Four Digital Clock Managers (DCMs).
- Speed grade: -4 (moderate performance).
Designed for high-volume, cost-sensitive applications like embedded systems and communications.
Application
The XC3S5000-4FGG900I, a high-performance Spartan-3 FPGA from Xilinx, is used in:
1. Embedded Systems – For control and interfacing.
2. Communications – Signal processing, networking, and protocol bridging.
3. Industrial Automation – Motor control, sensor interfacing.
4. Military/Aerospace – Rugged, reliable processing in harsh environments.
5. Medical Devices – Real-time data acquisition and processing.
6. Consumer Electronics – Video/image processing and display control.
Its 500K system gates, 900-pin BGA package, and 4ns speed grade make it suitable for cost-sensitive, mid-range applications requiring flexibility and performance.
1. Embedded Systems – For control and interfacing.
2. Communications – Signal processing, networking, and protocol bridging.
3. Industrial Automation – Motor control, sensor interfacing.
4. Military/Aerospace – Rugged, reliable processing in harsh environments.
5. Medical Devices – Real-time data acquisition and processing.
6. Consumer Electronics – Video/image processing and display control.
Its 500K system gates, 900-pin BGA package, and 4ns speed grade make it suitable for cost-sensitive, mid-range applications requiring flexibility and performance.
Package
The XC3S5000-4FGG900I is a Spartan-3 series FPGA from Xilinx. It comes in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package, designated as FGG900. This package type offers high-density interconnects and is suitable for space-constrained applications. The "I" suffix indicates an industrial-grade operating temperature range (-40°C to +100°C).
