사양
| 속성 | 가치 |
| Supplier | AMD Xilinx |
| Package / Case | Tray |
| Series | Virtex®-4 LX |
| Part Status | Active |
| Number of LABs/CLBs | 4608 |
| Number of Logic Elements/Cells | 41472 |
| Total RAM Bits | 1769472 |
| Number of I/O | 448 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
개요
Description
The XC4VLX40-10FFG668I is a Xilinx Virtex-4 LX FPGA device. It belongs to the LX family (logic-centric) and provides around 40k logic cells in a 668‑pin Fine‑Pitch Grid Array (FFG) package. The “-10” is the speed grade, and “I” indicates industrial temperature range (-40 to 85 C). Features include substantial programmable logic, BRAM/DRAM resources, DSP slices, clock management (DCMs/PLLs), and multi‑bank I/O with several standards. The FFG668 package offers dense pin count for wide I/O and high‑speed interfaces. It’s suitable for mid‑size embedded, DSP, and signal‑processing applications needing a balance of logic, memory, and I/O in a single device. Common design flows use Xilinx ISE/PlanAhead with standard HDL-based workflows.
Equivalent
Do you want Xilinx-only equivalents (same Virtex-4 LX family) or cross-vendor equivalents? If Xilinx-only, specify whether you need the exact same package (FFG668I) or just similar capacity/speed, and I’ll list closest LX40/LX60 options. If cross-vendor, I can provide Altera/Lattice parts with comparable resources.
Features
XC4VLX40-10FFG668I is a Virtex-4 LX40 FPGA. Key features:
- 668-pin Fine-Pitch FFG package (668-ball BGA)
- Speed grade -10
- Industrial temperature range (-40°C to 85°C)
- Approximately 40K logic cells (Virtex-4 LX40)
- On-chip resources: DSP slices (DSP48A1), Block RAM, distributed RAM
- Clocking: multiple DCMs and PLLs for flexible timing
- I/O banks supporting various standards (LVCMOS/LVTTL, SSTL/HSTL, LVDS, etc.)
- JTAG and configuration options; support for on-chip reconfiguration
- Power: 1.2V internal core; I/O banks typically 2.5V/3.3V
- Suitable for high-throughput logic, DSP, and memory-intensive designs in a rugged package
- 668-pin Fine-Pitch FFG package (668-ball BGA)
- Speed grade -10
- Industrial temperature range (-40°C to 85°C)
- Approximately 40K logic cells (Virtex-4 LX40)
- On-chip resources: DSP slices (DSP48A1), Block RAM, distributed RAM
- Clocking: multiple DCMs and PLLs for flexible timing
- I/O banks supporting various standards (LVCMOS/LVTTL, SSTL/HSTL, LVDS, etc.)
- JTAG and configuration options; support for on-chip reconfiguration
- Power: 1.2V internal core; I/O banks typically 2.5V/3.3V
- Suitable for high-throughput logic, DSP, and memory-intensive designs in a rugged package
Pinout
- Pin count: 668 pins (FFG668 package)
- Function: Xilinx XC4VLX40-10FFG668I is a Virtex-4 LX40 FPGA in a 668-pin flip-chip BGA package; a 40k-type programmable logic device with DSP blocks and block RAM for digital logic/design implementations.
- Function: Xilinx XC4VLX40-10FFG668I is a Virtex-4 LX40 FPGA in a 668-pin flip-chip BGA package; a 40k-type programmable logic device with DSP blocks and block RAM for digital logic/design implementations.
Manufacturer
Manufacturer: Xilinx, Inc. (now part of AMD).
Xilinx is a fabless semiconductor company that designs and markets programmable logic devices, mainly FPGAs (and also CPLDs/SoCs), plus the associated design software and IP used to develop on their devices.
Xilinx is a fabless semiconductor company that designs and markets programmable logic devices, mainly FPGAs (and also CPLDs/SoCs), plus the associated design software and IP used to develop on their devices.
Application
XC4VLX40-10FFG668I is a Virtex-4 LX device suitable for high-speed DSP and embedded processing. Typical applications include:
- Telecommunications and networking (packet processing, PHY/SerDes, SONET/SDH, Fibre Channel)
- Digital signal processing (radar, SDR, wireless baseband, DSP acceleration)
- Video and image processing (HD/SD pipelines, codecs)
- Embedded systems and prototyping (MicroBlaze/PowerPC cores, custom SOCs)
- Industrial/automation and motor control
- Data acquisition and measurement equipment
- Defense/aerospace signal processing
- Telecommunications and networking (packet processing, PHY/SerDes, SONET/SDH, Fibre Channel)
- Digital signal processing (radar, SDR, wireless baseband, DSP acceleration)
- Video and image processing (HD/SD pipelines, codecs)
- Embedded systems and prototyping (MicroBlaze/PowerPC cores, custom SOCs)
- Industrial/automation and motor control
- Data acquisition and measurement equipment
- Defense/aerospace signal processing
Package
Package type: FFG668I — Flip-Chip Fine-Pinech Ball Grid Array, 668 balls, industrial temperature range (-40°C to 85°C).
