사양
| 속성 | 가치 |
| Supplier | AMD Xilinx |
| Package / Case | Tray |
| Series | Virtex®-5 LX |
| Part Status | Active |
| Number of LABs/CLBs | 6480 |
| Number of Logic Elements/Cells | 82944 |
| Total RAM Bits | 3538944 |
| Number of I/O | 440 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
개요
Description
XC5VLX85-1FFG676C is a Xilinx Virtex-5 LX FPGA. It belongs to the LX family (mid-density) and provides a mix of logic cells, DSP blocks, Block RAM, and multiple I/O banks for custom digital designs. The device comes in a 676-pin Fine Pitch Flip-Chip Grid Array package (FFG676) with a -1 speed grade (fast timing). It supports various I/O standards, clocking resources (PLLs), and is suitable for DSP, communications, and embedded control applications. Design flow uses Xilinx tools (ISE/WebPACK or Vivado, as supported) to produce a bitstream (.bit) for configuration, via JTAG or configuration memory. For exact resource counts (logic cells, RAM, DSP slices) and timing specs, consult the official XC5VLX85-1FFG676C datasheet and user guide on Xilinx’s website.
Features
Here are concise features of XC5VLX85-1FFG676C (Virtex-5 LX, -1 speed, FG676 package):
- FPGA: Virtex-5 LX family, optimized for DSP/logic
- Logic resources: ~85K logic cells
- Package: 676-pin FineLine BGA (FFG676)
- Speed grade: -1 (fast)
- Memory: on-chip block RAM and distributed RAM
- DSP: dedicated DSP slices for high-speed math
- Clocking: clock management tiles with PLLs/DCMs
- I/O: multiple I/O banks with varied voltage domains and plenty of I/O
- High-speed serial: RocketIO/Gigabit transceivers for multi-Gbps links
- Configuration: SRAM-based configuration with JTAG and security options
- Power/thermal: optimized for low power in mid-to-high-performance designs
Note: exact RAM/DSP counts and transceiver speeds vary by variant; refer to the Xilinx datasheet for precise specs.
- FPGA: Virtex-5 LX family, optimized for DSP/logic
- Logic resources: ~85K logic cells
- Package: 676-pin FineLine BGA (FFG676)
- Speed grade: -1 (fast)
- Memory: on-chip block RAM and distributed RAM
- DSP: dedicated DSP slices for high-speed math
- Clocking: clock management tiles with PLLs/DCMs
- I/O: multiple I/O banks with varied voltage domains and plenty of I/O
- High-speed serial: RocketIO/Gigabit transceivers for multi-Gbps links
- Configuration: SRAM-based configuration with JTAG and security options
- Power/thermal: optimized for low power in mid-to-high-performance designs
Note: exact RAM/DSP counts and transceiver speeds vary by variant; refer to the Xilinx datasheet for precise specs.
Pinout
- Pin count: 676 pins (FFG676 FineLine BGA package)
- Function: Xilinx Virtex-5 LX FPGA device (XC5VLX85), general-purpose programmable logic with ~85k logic cells, DSP slices, RAM/BRAM, and I/O banks for digital design and signal processing.
- Function: Xilinx Virtex-5 LX FPGA device (XC5VLX85), general-purpose programmable logic with ~85k logic cells, DSP slices, RAM/BRAM, and I/O banks for digital design and signal processing.
Manufacturer
Manufacturer: Xilinx, Inc. (now part of AMD as AMD Xilinx).
What kind of company: A semiconductor company that designs and sells programmable logic devices, mainly FPGAs and CPLDs, along with related IP and adaptive compute products. It is/was a fabless company that outsources manufacturing to external foundries.
What kind of company: A semiconductor company that designs and sells programmable logic devices, mainly FPGAs and CPLDs, along with related IP and adaptive compute products. It is/was a fabless company that outsources manufacturing to external foundries.
Application
XC5VLX85-1FFG676C is a Virtex-5 LX FPGA suited for:
- Digital signal processing and communications (modems, baseband, DSP acceleration)
- Imaging, video, and vision systems (real-time processing, encoding/decoding)
- Networking and data processing (packet handling, high-speed interfaces)
- Embedded systems and accelerators (soft/hard processors, IP integration)
- Aerospace/defense and automotive sensing (radar/sonar processing, sensor fusion)
- Industrial automation and instrumentation (motor control, data acquisition)
- Prototyping and R&D (rapid FPGA-based accelerators and prototyping)
- Digital signal processing and communications (modems, baseband, DSP acceleration)
- Imaging, video, and vision systems (real-time processing, encoding/decoding)
- Networking and data processing (packet handling, high-speed interfaces)
- Embedded systems and accelerators (soft/hard processors, IP integration)
- Aerospace/defense and automotive sensing (radar/sonar processing, sensor fusion)
- Industrial automation and instrumentation (motor control, data acquisition)
- Prototyping and R&D (rapid FPGA-based accelerators and prototyping)
Package
Package type: 676-ball Fine-Pitch Flip-Chip Ball Grid Array (FFG676); Commercial temperature range (C) for XC5VLX85-1FFG676C.