사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 1879 |
| Number of Logic Elements/Cells | 24051 |
| Total RAM Bits | 958464 |
| Number of I/O | 186 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
개요
Equivalent
The XC6SLX25-3FTG256I is a Spartan-6 FPGA. Equivalent alternatives include:
- Lattice ECP5 (e.g., LFE5UM-25F-6BG256C)
- Microsemi (Microchip) IGLOO2 (e.g., M2GL025-FGG256)
- Intel (Altera) Cyclone IV (e.g., EP4CE22F17C6N)
These offer similar logic density (~25K LUTs) and package compatibility (256-pin BGA). For exact replacements, verify specs like speed grade, power, and I/O requirements.
- Lattice ECP5 (e.g., LFE5UM-25F-6BG256C)
- Microsemi (Microchip) IGLOO2 (e.g., M2GL025-FGG256)
- Intel (Altera) Cyclone IV (e.g., EP4CE22F17C6N)
These offer similar logic density (~25K LUTs) and package compatibility (256-pin BGA). For exact replacements, verify specs like speed grade, power, and I/O requirements.
Features
The XC6SLX25-3FTG256I is a Spartan-6 FPGA with key features:
- Logic Cells: 24,576
- DSP Slices: 38 (18x18 multipliers)
- Block RAM: 1,728 Kb (54 x 36 Kb)
- Max I/O Pins: 186 (supports LVCMOS, LVDS, etc.)
- Speed Grade: -3 (performance-optimized)
- Package: 256-pin FTG (Fine-Pitch BGA)
- Operating Temp: Industrial (-40°C to +100°C)
- Power: Low-power 45nm process
- Clocking: 6 MMCMs & 8 PLLs
Ideal for cost-sensitive, low-power embedded applications.
- Logic Cells: 24,576
- DSP Slices: 38 (18x18 multipliers)
- Block RAM: 1,728 Kb (54 x 36 Kb)
- Max I/O Pins: 186 (supports LVCMOS, LVDS, etc.)
- Speed Grade: -3 (performance-optimized)
- Package: 256-pin FTG (Fine-Pitch BGA)
- Operating Temp: Industrial (-40°C to +100°C)
- Power: Low-power 45nm process
- Clocking: 6 MMCMs & 8 PLLs
Ideal for cost-sensitive, low-power embedded applications.
Pinout
The XC6SLX25-3FTG256I is a Spartan-6 FPGA with 256 pins in a FTG256 (Fine-Pitch Ball Grid Array) package.
### Key Features:
- Pin Count: 256 (User I/O varies based on configuration).
- Logic Cells: ~24,576.
- I/O Standards: Supports LVCMOS, LVTTL, HSTL, SSTL, and differential standards (LVDS, RSDS).
- Memory: 1,728 Kb block RAM, 16 DSP slices.
- Clock Management: Up to 6 mixed-mode clock managers (MMCMs).
- Package Type: Lead-free, RoHS-compliant FTG256 (1.0mm ball pitch).
### Primary Functions:
- General-purpose FPGA for embedded, industrial, and consumer applications.
- Supports high-speed interfaces (PCIe, Gigabit Ethernet).
- Configurable via JTAG, SPI, or BPI flash.
### Key Features:
- Pin Count: 256 (User I/O varies based on configuration).
- Logic Cells: ~24,576.
- I/O Standards: Supports LVCMOS, LVTTL, HSTL, SSTL, and differential standards (LVDS, RSDS).
- Memory: 1,728 Kb block RAM, 16 DSP slices.
- Clock Management: Up to 6 mixed-mode clock managers (MMCMs).
- Package Type: Lead-free, RoHS-compliant FTG256 (1.0mm ball pitch).
### Primary Functions:
- General-purpose FPGA for embedded, industrial, and consumer applications.
- Supports high-speed interfaces (PCIe, Gigabit Ethernet).
- Configurable via JTAG, SPI, or BPI flash.
Manufacturer
The XC6SLX25-3FTG256I is a Spartan-6 series FPGA manufactured by Xilinx, now part of AMD following its acquisition in 2022.
Xilinx (now AMD) is a leading semiconductor company specializing in programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System-on-Chip), and adaptive computing solutions. Their products are widely used in telecommunications, automotive, aerospace, and industrial applications.
The XC6SLX25-3FTG256I is a mid-range FPGA with 24,576 logic cells, designed for cost-sensitive, high-performance applications. The "FTG256" denotes a 256-pin Fine-Pitch Ball Grid Array (FBGA) package.
Key features:
- Low-power 45nm process
- High-speed connectivity (GTP/GTX transceivers)
- Embedded DSP slices & block RAM
AMD (Xilinx) remains a dominant player in programmable logic, competing with Intel (Altera).
Xilinx (now AMD) is a leading semiconductor company specializing in programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System-on-Chip), and adaptive computing solutions. Their products are widely used in telecommunications, automotive, aerospace, and industrial applications.
The XC6SLX25-3FTG256I is a mid-range FPGA with 24,576 logic cells, designed for cost-sensitive, high-performance applications. The "FTG256" denotes a 256-pin Fine-Pitch Ball Grid Array (FBGA) package.
Key features:
- Low-power 45nm process
- High-speed connectivity (GTP/GTX transceivers)
- Embedded DSP slices & block RAM
AMD (Xilinx) remains a dominant player in programmable logic, competing with Intel (Altera).
Application
The XC6SLX25-3FTG256I, a Spartan-6 FPGA, is used in:
- Embedded Systems – Control and interfacing applications.
- Industrial Automation – Motor control, PLCs, and sensor processing.
- Communications – Protocol bridging and signal processing.
- Consumer Electronics – Display controllers and multimedia devices.
- Medical Devices – Portable diagnostic equipment.
- Automotive – Infotainment and driver assistance systems.
Its low power, cost-effectiveness, and moderate logic density (~24K logic cells) make it ideal for these applications.
- Embedded Systems – Control and interfacing applications.
- Industrial Automation – Motor control, PLCs, and sensor processing.
- Communications – Protocol bridging and signal processing.
- Consumer Electronics – Display controllers and multimedia devices.
- Medical Devices – Portable diagnostic equipment.
- Automotive – Infotainment and driver assistance systems.
Its low power, cost-effectiveness, and moderate logic density (~24K logic cells) make it ideal for these applications.
Package
The XC6SLX25-3FTG256I is a Spartan-6 FPGA from Xilinx, packaged in a 256-pin Fine-Pitch Ball Grid Array (FTG256). This 1.0 mm pitch, Pb-free package is designed for space-constrained applications, offering high-density interconnects. The "3" in the part number indicates its speed grade (-3), suitable for moderate performance needs. Ideal for embedded and cost-sensitive designs.
