사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Spartan®-6 LXT |
| Part Status | Active |
| Number of LABs/CLBs | 1879 |
| Number of Logic Elements/Cells | 24051 |
| Total RAM Bits | 958464 |
| Number of I/O | 190 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
개요
Description
XC6SLX25T-3CSG324C is a Xilinx Spartan-6 FPGA (LX25T) in a 324-ball BGA package (CSG324). It offers about 25K logic cells, LUT-based logic blocks, distributed and block RAM, DSP slices, and clock-management resources. The “-3” speed grade indicates a slower operating speed. In the CSG324 package it provides tens to a few hundred user I/O pins, suitable for cost-sensitive, moderately dense designs. It supports common I/O standards and includes PLLs for clocking. Typical uses include embedded control, motor control, signal processing, and peripheral interfacing. Development is done with Xilinx ISE (or related WebPACK flows) and standard Spartan-6 IP. Note: Spartan-6 is an older generation, largely superseded by 7-series and newer families, but remains viable for legacy designs and cost-focused projects.
Features
XC6SLX25T-3CSG324C is a Spartan-6 LX25T FPGA in a 324-ball CS-G324 package, speed grade -3. Key features:
- ~25k logic cells with 4-input LUT-based logic slices
- 18x18 DSP multipliers for DSP workloads
- Block RAM plus distributed RAM for on-chip memory
- Flexible clocking: global clock networks and multiple PLLs/DCMs
- I/O: hundreds of user I/O across multiple banks; 3.3V I/O with a 1.2V core
- Configuration: JTAG, Slave Serial, and SPI configuration options; optional bitstream encryption
- Low power and general-purpose FPGA fabric suitable for mixing logic, memory, and DSP
Package: CS-G324C 324-ball BGA. Suitable for cost-sensitive, mid-density embedded applications.
- ~25k logic cells with 4-input LUT-based logic slices
- 18x18 DSP multipliers for DSP workloads
- Block RAM plus distributed RAM for on-chip memory
- Flexible clocking: global clock networks and multiple PLLs/DCMs
- I/O: hundreds of user I/O across multiple banks; 3.3V I/O with a 1.2V core
- Configuration: JTAG, Slave Serial, and SPI configuration options; optional bitstream encryption
- Low power and general-purpose FPGA fabric suitable for mixing logic, memory, and DSP
Package: CS-G324C 324-ball BGA. Suitable for cost-sensitive, mid-density embedded applications.
Pinout
- Pin count: 324 pins (324-ball BGA, package CS G324C)
- Function: Xilinx Spartan-6 LX25T FPGA (25K logic cells) – a programmable logic device with I/O banks, block RAM, DSP slices, and other FPGA fabric for implementing digital circuits.
- Function: Xilinx Spartan-6 LX25T FPGA (25K logic cells) – a programmable logic device with I/O banks, block RAM, DSP slices, and other FPGA fabric for implementing digital circuits.
Manufacturer
- Manufacturer: Xilinx (now a subsidiary of AMD)
- Company type: A multinational semiconductor company specializing in programmable logic devices, primarily FPGAs and CPLDs, plus related design tools and IP.
- Company type: A multinational semiconductor company specializing in programmable logic devices, primarily FPGAs and CPLDs, plus related design tools and IP.
Application
XC6SLX25T-3CSG324C is a Spartan‑6 device aimed at cost‑effective, mid‑range FPGA tasks. Typical application areas include:
- DSP and signal processing (audio, video, filtering)
- Embedded control and data acquisition (MicroBlaze-based systems)
- Communications and networking interfaces and protocol processing
- Image/video processing and display pipelines
- Industrial automation, instrumentation, and motor control
- Prototyping, education, and other cost‑sensitive custom logic designs
- DSP and signal processing (audio, video, filtering)
- Embedded control and data acquisition (MicroBlaze-based systems)
- Communications and networking interfaces and protocol processing
- Image/video processing and display pipelines
- Industrial automation, instrumentation, and motor control
- Prototyping, education, and other cost‑sensitive custom logic designs
Package
324-ball Ceramic Ball Grid Array (CSG324) package.
