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XC6SLX25T-3CSG324I
+BOMIC FPGA 190 I/O 324CSBGA
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제조업체AMD
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제조업체 부품 #XC6SLX25T-3CSG324I
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사양
| 속성 | 가치 |
| Series | Spartan®-6 LXT |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 24051 |
| Total RAM Bits | 958464 |
| Number of I/O | 190 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 324-LFBGA, CSPBGA |
| Supplier Device Package | 324-CSPBGA (15x15) |
| Base Product Number | XC6SLX25 |
| Number of LA Bs / CL Bs | 1879 |
개요
Description
The "-3" denotes the speed grade, indicating its performance level, while the "CSG324" refers to the package type, a 324-ball Fine-Pitch Ball Grid Array (FBGA) which is compact and efficient for space-constrained designs. The "I" at the end indicates its industrial-grade temperature range, suitable for operating in harsher environments from -40°C to 100°C.
Spartan-6 FPGAs are known for their cost-effectiveness, making them ideal for consumer electronics, automotive, and networking systems. The XC6SLX25T-3CSG324I offers integrated transceiver support, enhanced clocking, and power management capabilities, providing flexibility and reliability for designers aiming to optimize their products.
Equivalent
1. Intel (Altera) Cyclone IV series, such as EP4CE22.
2. Lattice ECP3 or MachXO2 series.
3. Microsemi (Microchip) IGLOO2 or SmartFusion2 series.
Always verify the specific requirements and features to ensure compatibility with your application.
Features
1. Logic Cells: It contains approximately 24,051 logic cells.
2. I/O Pins: The device supports up to 218 user I/O pins.
3. Memory: Features 936 Kbits of block RAM.
4. DSP Slices: Equipped with 38 DSP slices for efficient signal processing tasks.
5. Clock Management: Includes 4 CMTs (Clock Management Tiles), each containing a phase-locked loop (PLL) for clock management.
6. Configuration Options: Offers multiple configuration options, including JTAG and serial flash.
7. Power: Designed for low power consumption, suitable for energy-efficient applications.
8. Temperature Range: The “I” suffix indicates it is designed for industrial temperature ranges (-40°C to 100°C).
9. Package: Comes in a 324-ball BGA package.
The XC6SLX25T-3CSG324I is ideal for applications requiring a balance between performance, cost, and power efficiency, such as automotive, consumer electronics, and telecommunications.
Pinout
The main functions and features of the XC6SLX25T-3CSG324I include:
1. Logic Cells: It contains approximately 24,051 logic cells, providing ample capability for complex designs.
2. DSP Slices: The device includes 38 DSP slices, useful for signal processing applications.
3. Block RAM: It features 936 Kbits of block RAM, enabling efficient data storage and retrieval.
4. I/O Pins: The FPGA has a significant number of I/O pins to facilitate connectivity with other devices and components.
5. Clock Management: It supports digital clock managers (DCMs) and phase-locked loops (PLLs) for enhanced clock management.
This FPGA is suitable for a range of applications, including industrial automation, automotive, and consumer electronics, offering a balance of performance, power efficiency, and cost-effectiveness.
Manufacturer
Application
1. Embedded Systems: Provides flexibility for custom logic implementations.
2. Communication Systems: Supports high-speed serial connectivity and data processing.
3. Industrial Automation: Used for control systems and signal processing.
4. Consumer Electronics: Enables product differentiation in audio/video devices.
5. Automotive Electronics: Facilitates infotainment systems and advanced driver-assistance.
6. Medical Devices: Supports imaging and diagnostic equipment.
Its programmable nature allows for customization across diverse technological fields, offering scalability and integration capabilities.