XC6SLX25T-3CSG324I

이미지는 참조용입니다.

XC6SLX25T-3CSG324I

+BOM

IC FPGA 190 I/O 324CSBGA

  • 제조업체AMD

  • 제조업체 부품 #XC6SLX25T-3CSG324I

  • 재고7388

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Series Spartan®-6 LXT
Part Status Active
Digi Key Programmable Not Verified
Number of Logic Elements / Cells 24051
Total RAM Bits 958464
Number of I/O 190
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 324-LFBGA, CSPBGA
Supplier Device Package 324-CSPBGA (15x15)
Base Product Number XC6SLX25
Number of LA Bs / CL Bs 1879

개요

Description

The XC6SLX25T-3CSG324I is a model from Xilinx's Spartan-6 FPGA family, designed for a range of applications requiring efficient performance and low power consumption. It features a 45 nm process technology, offering a balance between cost and performance. With 24,051 logic cells and 1,066 KB of block RAM, it is suitable for various digital signal processing tasks, embedded computing, and connectivity applications.
The "-3" denotes the speed grade, indicating its performance level, while the "CSG324" refers to the package type, a 324-ball Fine-Pitch Ball Grid Array (FBGA) which is compact and efficient for space-constrained designs. The "I" at the end indicates its industrial-grade temperature range, suitable for operating in harsher environments from -40°C to 100°C.
Spartan-6 FPGAs are known for their cost-effectiveness, making them ideal for consumer electronics, automotive, and networking systems. The XC6SLX25T-3CSG324I offers integrated transceiver support, enhanced clocking, and power management capabilities, providing flexibility and reliability for designers aiming to optimize their products.

Equivalent

The XC6SLX25T-3CSG324I is a Xilinx Spartan-6 FPGA. Equivalent products are typically from other FPGA families or manufacturers that offer similar logic density and features. Alternatives could include:
1. Intel (Altera) Cyclone IV series, such as EP4CE22.
2. Lattice ECP3 or MachXO2 series.
3. Microsemi (Microchip) IGLOO2 or SmartFusion2 series.
Always verify the specific requirements and features to ensure compatibility with your application.

Features

The XC6SLX25T-3CSG324I is a part of the Xilinx Spartan-6 FPGA family. Key features include:
1. Logic Cells: It contains approximately 24,051 logic cells.
2. I/O Pins: The device supports up to 218 user I/O pins.
3. Memory: Features 936 Kbits of block RAM.
4. DSP Slices: Equipped with 38 DSP slices for efficient signal processing tasks.
5. Clock Management: Includes 4 CMTs (Clock Management Tiles), each containing a phase-locked loop (PLL) for clock management.
6. Configuration Options: Offers multiple configuration options, including JTAG and serial flash.
7. Power: Designed for low power consumption, suitable for energy-efficient applications.
8. Temperature Range: The “I” suffix indicates it is designed for industrial temperature ranges (-40°C to 100°C).
9. Package: Comes in a 324-ball BGA package.
The XC6SLX25T-3CSG324I is ideal for applications requiring a balance between performance, cost, and power efficiency, such as automotive, consumer electronics, and telecommunications.

Pinout

The XC6SLX25T-3CSG324I is a member of the Xilinx Spartan-6 FPGA family. It comes in a CSG324 package, which means it has a pin count of 324. This model is specifically designed for industrial-grade applications.
The main functions and features of the XC6SLX25T-3CSG324I include:
1. Logic Cells: It contains approximately 24,051 logic cells, providing ample capability for complex designs.
2. DSP Slices: The device includes 38 DSP slices, useful for signal processing applications.
3. Block RAM: It features 936 Kbits of block RAM, enabling efficient data storage and retrieval.
4. I/O Pins: The FPGA has a significant number of I/O pins to facilitate connectivity with other devices and components.
5. Clock Management: It supports digital clock managers (DCMs) and phase-locked loops (PLLs) for enhanced clock management.
This FPGA is suitable for a range of applications, including industrial automation, automotive, and consumer electronics, offering a balance of performance, power efficiency, and cost-effectiveness.

Manufacturer

The XC6SLX25T-3CSG324I is manufactured by Xilinx, Inc. Xilinx is a technology company that specializes in the development of programmable logic devices. These devices include field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs), which are used in a variety of applications such as telecommunications, automotive, industrial, and consumer electronics. FPGAs are known for their flexibility and ability to be configured by the customer after manufacturing, allowing for a wide range of uses and customization. Xilinx was a pioneer in developing these types of programmable logic devices and has been a leader in the industry. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), another leading semiconductor company known for its processors and graphics processing units (GPUs). This acquisition aims to enhance AMD's position in the industry by integrating Xilinx's expertise in FPGAs and adaptive computing.

Application

The XC6SLX25T-3CSG324I is a member of Xilinx's Spartan-6 FPGA family, suitable for various applications due to its balance of performance, cost, and power efficiency. Key application areas include:
1. Embedded Systems: Provides flexibility for custom logic implementations.
2. Communication Systems: Supports high-speed serial connectivity and data processing.
3. Industrial Automation: Used for control systems and signal processing.
4. Consumer Electronics: Enables product differentiation in audio/video devices.
5. Automotive Electronics: Facilitates infotainment systems and advanced driver-assistance.
6. Medical Devices: Supports imaging and diagnostic equipment.
Its programmable nature allows for customization across diverse technological fields, offering scalability and integration capabilities.

Package

The XC6SLX25T-3CSG324I is a FPGA from Xilinx's Spartan-6 family. It comes in a CSG324 package, which is a Ball Grid Array (BGA) package with 324 balls. This type of package is designed for high-density and high-performance applications, offering a compact form factor suitable for various electronic devices.

XC6SLX25T-3CSG324I과 관련된 제품