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XC6SLX45-2CSG324I
+BOMIC FPGA 218 I/O 324CSBGA
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제조업체AMD Xilinx
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제조업체 부품 #XC6SLX45-2CSG324I
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패키지 324-LFBGA,CSPBGA
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재고7547
365 1일 품질 보증
7*24 영업 시간 서비스 보증
90-판매 후 1일 보증
정품 보증
사양
| 속성 | 가치 |
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 3411 |
| NumberofLogicElements/Cells | 43661 |
| TotalRAMBits | 2138112 |
| NumberofI/O | 218 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 324-LFBGA, CSPBGA |
개요
Description
Key features include a rich set of configurable logic blocks (CLBs), abundant RAM blocks, DSP slices for signal processing applications, and multiple I/O standards, enabling versatile interfacing options. The FPGA supports Xilinx's proprietary development tools, such as Vivado or ISE, allowing for efficient design implementation and debugging.
The XC6SLX45 is commonly used in applications like telecommunications, automotive systems, and consumer electronics due to its balance between cost, performance, and power efficiency. It is also favored for educational purposes and prototyping because of its comprehensive feature set and accessibility.
Equivalent
Features
1. Logic Cells: It contains approximately 43,661 logic cells.
2. System Gates: Offers around 221,184 equivalent system gates.
3. Memory: Features 2,088 Kbits of block RAM.
4. DSP Slices: Includes 58 DSP slices for signal processing tasks.
5. I/O Pins: Provides 232 user I/O pins.
6. Performance: Operates with a speed grade of -2, balancing power consumption and performance.
7. Package: Comes in a compact 324-ball grid array (CSG324) package.
8. Temperature Range: Industrial-grade device, supporting temperatures from -40°C to +100°C.
9. Power Management: Includes advanced low-power features.
10. Connectivity: Supports various I/O standards and protocols, enhancing interfacing capabilities.
These features make the XC6SLX45-2CSG324I suitable for applications requiring moderate logic density, efficient power management, and robust performance across challenging environmental conditions.
Pinout
This FPGA is designed for a wide range of applications that require low power consumption and high performance. The XC6SLX45-2CSG324I includes features such as:
1. Logic Cells: Approximately 43,661 logic cells are available for implementing custom logic.
2. Memory: It includes 2,088 Kbits of block RAM for storing data.
3. DSP Slices: The FPGA has 58 DSP slices for high-speed arithmetic operations.
4. I/O Pins: It supports 218 user I/O pins for interfacing with other devices.
5. Clock Management: It has 4 clock management tiles, each with a phase-locked loop (PLL) for precise clock generation.
6. Temperature Range: It is specified for an industrial temperature range.
The XC6SLX45-2CSG324I is suitable for applications in areas like digital signal processing, embedded systems, and communication systems, where balance between performance, power, and cost is crucial.
Manufacturer
Application
1. Embedded Systems: Utilized for custom computing tasks and hardware acceleration.
2. Industrial Automation: Employed in control systems and robotics.
3. Communications: Used in data processing for networking equipment.
4. Consumer Electronics: Integrated into devices for processing and interfacing needs.
5. Automotive Systems: Applied in infotainment and advanced driver-assistance systems (ADAS).
6. Medical Devices: Used for processing and control in diagnostic equipment.
These applications benefit from its configurable logic, high-speed interfaces, and low power consumption.