사양
| 속성 | 가치 |
| Supplier | AMD Xilinx |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 5831 |
| Number of Logic Elements/Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 408 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
개요
Description
XC6SLX75-2FGG676C is a Xilinx Spartan-6 LX75 FPGA in a high-pin-count FG676 ball-grid package. The “-2” is the speed grade, and the trailing “C” indicates commercial temperature range.
Key points:
- Mid-range FPGA in the Spartan-6 family: suitable for cost‑sensitive, moderate‑performance digital logic.
- Resources: thousands of logic cells (via CLBs), DSP slices for arithmetic, and Block RAM for data storage, plus multiple I/O banks.
- Clocking and timing: on-chip PLLs and clock networks; supports various digital interfaces and prototyping needs.
- Packaging: 676-ball FG676 BGA offers many I/O pins for complex designs, but higher pin-count packages require careful PCB layout and heat management.
- Tools and flow: typically programmed with Xilinx ISE Design Suite (older generation tooling; Vivado supports newer families but not Spartan-6 comprehensively).
- Applications: embedded control, data acquisition, basic DSP, I/O bridging, and hardware accelerators in cost‑sensitive products.
If you need precise resource counts, consult the device's datasheet for LX75 specifics.
Key points:
- Mid-range FPGA in the Spartan-6 family: suitable for cost‑sensitive, moderate‑performance digital logic.
- Resources: thousands of logic cells (via CLBs), DSP slices for arithmetic, and Block RAM for data storage, plus multiple I/O banks.
- Clocking and timing: on-chip PLLs and clock networks; supports various digital interfaces and prototyping needs.
- Packaging: 676-ball FG676 BGA offers many I/O pins for complex designs, but higher pin-count packages require careful PCB layout and heat management.
- Tools and flow: typically programmed with Xilinx ISE Design Suite (older generation tooling; Vivado supports newer families but not Spartan-6 comprehensively).
- Applications: embedded control, data acquisition, basic DSP, I/O bridging, and hardware accelerators in cost‑sensitive products.
If you need precise resource counts, consult the device's datasheet for LX75 specifics.
Features
XC6SLX75-2FGG676C is a Xilinx Spartan-6 LX75 FPGA in a 676‑ball FGG676 package with speed grade -2. Key features:
- 75K logic cells (LUT4-based slices) for large, complex designs.
- Rich I/O with multiple banks and wide I/O standards support (LVTTL/LVCMOS, PCIe-like options, etc.).
- DSP resources for high‑speed signal processing (MAC/arithmetics blocks).
- Block RAM and distributed RAM for on‑chip memory.
- Clock management: multiple PLLs and DCMs for flexible clocking.
- Low‑power, 90 nm technology typical of Spartan-6 family.
- On‑chip configuration with options for security (bitstream encryption) and various config interfaces.
- Suitable for applications requiring high I/O density, mixed‑signal interfaces, and mid‑ to high‑end logic capacity in an affordable FPGA.
Note: For exact counts (RAM, DSP blocks, I/O pins) refer to the official datasheet.
- 75K logic cells (LUT4-based slices) for large, complex designs.
- Rich I/O with multiple banks and wide I/O standards support (LVTTL/LVCMOS, PCIe-like options, etc.).
- DSP resources for high‑speed signal processing (MAC/arithmetics blocks).
- Block RAM and distributed RAM for on‑chip memory.
- Clock management: multiple PLLs and DCMs for flexible clocking.
- Low‑power, 90 nm technology typical of Spartan-6 family.
- On‑chip configuration with options for security (bitstream encryption) and various config interfaces.
- Suitable for applications requiring high I/O density, mixed‑signal interfaces, and mid‑ to high‑end logic capacity in an affordable FPGA.
Note: For exact counts (RAM, DSP blocks, I/O pins) refer to the official datasheet.
Pinout
- Pin count: 676 pins (FGG676 package)
- Function: Xilinx Spartan-6 LX75 FPGA (75K logic cells) in a 676-ball BGA package, a reconfigurable digital logic device.
- Function: Xilinx Spartan-6 LX75 FPGA (75K logic cells) in a 676-ball BGA package, a reconfigurable digital logic device.
Manufacturer
- Manufacturer: Xilinx, Inc. (now part of AMD).
- What kind of company: An American multinational semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (e.g., Spartan-6), CPLDs, and related products.
- What kind of company: An American multinational semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (e.g., Spartan-6), CPLDs, and related products.
Application
XC6SLX75-2FGG676C is a mid‑range Spartan‑6 FPGA suitable for:
- Digital signal processing (filters, FFT, audio/video)
- Embedded control and glue logic for microprocessors
- Interface and protocol bridging (high-density I/O, memory interfaces)
- Data acquisition, instrumentation, and test/measurement equipment
- Prototyping, development boards, and education
- Automotive/industrial control and motor-control applications requiring cost-effective FPGAs
- Digital signal processing (filters, FFT, audio/video)
- Embedded control and glue logic for microprocessors
- Interface and protocol bridging (high-density I/O, memory interfaces)
- Data acquisition, instrumentation, and test/measurement equipment
- Prototyping, development boards, and education
- Automotive/industrial control and motor-control applications requiring cost-effective FPGAs
Package
It’s a Flip-Chip Ball Grid Array package: FGG676 (676-ball). The “C” suffix indicates commercial temperature range.
