사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 5831 |
| Number of Logic Elements/Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 408 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
개요
Description
The XC6SLX75-2FGG676I is a model from Xilinx's Spartan-6 FPGA family, designed for delivering efficient and cost-effective solutions in various applications. Key features of the XC6SLX75 include 74,376 logic cells, providing ample resources for complex digital designs. It comes in a FGG676 package, which denotes a Fine-Pitch Ball Grid Array (FBGA) with 676 pins, facilitating high-density connectivity and integration.
The "-2" in the part number indicates the speed grade, with lower numbers signifying higher performance. This FPGA is designed to operate in the industrial temperature range, as denoted by the "I" at the end of the part number, making it suitable for applications requiring robust environmental performance.
The Spartan-6 series is known for delivering excellent power efficiency, enhanced DSP capabilities, and abundant I/O options, making the XC6SLX75-2FGG676I suitable for a wide range of applications including communications, automotive, industrial, and consumer electronics, where cost and performance are crucial.
The "-2" in the part number indicates the speed grade, with lower numbers signifying higher performance. This FPGA is designed to operate in the industrial temperature range, as denoted by the "I" at the end of the part number, making it suitable for applications requiring robust environmental performance.
The Spartan-6 series is known for delivering excellent power efficiency, enhanced DSP capabilities, and abundant I/O options, making the XC6SLX75-2FGG676I suitable for a wide range of applications including communications, automotive, industrial, and consumer electronics, where cost and performance are crucial.
Equivalent
The XC6SLX75-2FGG676I is a Xilinx Spartan-6 FPGA. Equivalent products might include other FPGAs with similar logic capacity and I/O features from different manufacturers. Consider:
1. Altera (now Intel) Cyclone IV FPGAs (e.g., EP4CE75).
2. Lattice ECP3 series (e.g., LFE3-70EA).
3. Microsemi (now Microchip) IGLOO or SmartFusion series with comparable capabilities.
Ensure to compare specific features like I/O count, memory, and performance to find a suitable equivalent.
1. Altera (now Intel) Cyclone IV FPGAs (e.g., EP4CE75).
2. Lattice ECP3 series (e.g., LFE3-70EA).
3. Microsemi (now Microchip) IGLOO or SmartFusion series with comparable capabilities.
Ensure to compare specific features like I/O count, memory, and performance to find a suitable equivalent.
Features
The XC6SLX75-2FGG676I is a member of the Xilinx Spartan-6 FPGA family. Key features include:
1. Logic Cells: It has approximately 74,880 logic cells, making it suitable for moderate complexity designs.
2. I/O Pins: The FPGA comes with 396 I/O pins, providing flexibility for interfacing with various peripherals.
3. Memory: It includes 3,096 Kbits of block RAM for efficient data storage and processing.
4. DSP Slices: The device contains 132 DSP slices, useful for high-performance signal processing applications.
5. Clock Management: It features 6 CMTs (Clock Management Tiles), each with one PLL and two DCMs for robust clock management.
6. Power Efficiency: Built on a 45nm process technology, it offers improved power efficiency.
7. Temperature Range: The "-2" speed grade indicates a balance between performance and power, and the "I" signifies an industrial-grade temperature range, suitable for harsh environments.
8. Package: It is housed in a FGG676 package, which is a fine-pitch ball grid array.
These features make it a versatile choice for various applications, including communications, automotive, and industrial systems.
1. Logic Cells: It has approximately 74,880 logic cells, making it suitable for moderate complexity designs.
2. I/O Pins: The FPGA comes with 396 I/O pins, providing flexibility for interfacing with various peripherals.
3. Memory: It includes 3,096 Kbits of block RAM for efficient data storage and processing.
4. DSP Slices: The device contains 132 DSP slices, useful for high-performance signal processing applications.
5. Clock Management: It features 6 CMTs (Clock Management Tiles), each with one PLL and two DCMs for robust clock management.
6. Power Efficiency: Built on a 45nm process technology, it offers improved power efficiency.
7. Temperature Range: The "-2" speed grade indicates a balance between performance and power, and the "I" signifies an industrial-grade temperature range, suitable for harsh environments.
8. Package: It is housed in a FGG676 package, which is a fine-pitch ball grid array.
These features make it a versatile choice for various applications, including communications, automotive, and industrial systems.
Pinout
The XC6SLX75-2FGG676I is a Xilinx Spartan-6 FPGA. It comes in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. This FPGA is part of the Spartan-6 family, which is designed to provide a balance of performance, power efficiency, and cost-effectiveness, making it suitable for a wide range of applications, including communications, consumer electronics, industrial, and automotive systems.
The XC6SLX75-2FGG676I offers a variety of functions, including:
1. Logic Resources: It is equipped with 11,662 logic slices, each with four 6-input LUTs and eight flip-flops, enabling complex combinational and sequential logic designs.
2. Memory: It includes 2,520 Kbits of Block RAM, allowing for storage of data and quick access.
3. DSP Slices: Equipped with 132 DSP slices, it is capable of efficient signal processing tasks.
4. I/O Pins: The device supports numerous I/O standards and has multiple I/O pins for interfacing with other components and systems.
5. Clock Management: It features advanced clock management capabilities, including PLLs for frequency synthesis and clock distribution.
This FPGA is ideal for applications requiring robust processing capabilities with a moderate pin count.
The XC6SLX75-2FGG676I offers a variety of functions, including:
1. Logic Resources: It is equipped with 11,662 logic slices, each with four 6-input LUTs and eight flip-flops, enabling complex combinational and sequential logic designs.
2. Memory: It includes 2,520 Kbits of Block RAM, allowing for storage of data and quick access.
3. DSP Slices: Equipped with 132 DSP slices, it is capable of efficient signal processing tasks.
4. I/O Pins: The device supports numerous I/O standards and has multiple I/O pins for interfacing with other components and systems.
5. Clock Management: It features advanced clock management capabilities, including PLLs for frequency synthesis and clock distribution.
This FPGA is ideal for applications requiring robust processing capabilities with a moderate pin count.
Manufacturer
The XC6SLX75-2FGG676I is manufactured by Xilinx, Inc., which is now a part of AMD following its acquisition in February 2022. Xilinx is renowned for its development and production of programmable logic devices, primarily known for its field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs). These products are crucial in numerous applications, allowing for customized digital circuit implementations. Xilinx's technology finds widespread use across various industries, including telecommunications, automotive, aerospace, and consumer electronics, due to its flexibility and capability to be reprogrammed for diverse tasks.
Application
The XC6SLX75-2FGG676I is a field-programmable gate array (FPGA) from the Xilinx Spartan-6 family. Key application areas include:
1. Industrial Automation: Used for control systems, robotics, and machine vision.
2. Consumer Electronics: Supports high-definition video processing and image enhancement.
3. Telecommunications: Facilitates data processing, signal routing, and communication systems.
4. Automotive: Employed in infotainment systems and advanced driver-assistance systems (ADAS).
5. Medical Devices: Supports imaging systems and diagnostic equipment.
6. Aerospace and Defense: Used in radar systems, avionics, and secure communications.
Its reconfigurable architecture allows for customization across various applications, providing flexibility and scalability.
1. Industrial Automation: Used for control systems, robotics, and machine vision.
2. Consumer Electronics: Supports high-definition video processing and image enhancement.
3. Telecommunications: Facilitates data processing, signal routing, and communication systems.
4. Automotive: Employed in infotainment systems and advanced driver-assistance systems (ADAS).
5. Medical Devices: Supports imaging systems and diagnostic equipment.
6. Aerospace and Defense: Used in radar systems, avionics, and secure communications.
Its reconfigurable architecture allows for customization across various applications, providing flexibility and scalability.
Package
The XC6SLX75-2FGG676I is a Xilinx Spartan-6 FPGA, housed in a Fine-Pitch Ball Grid Array (FBGA) package, specifically with 676 pins. This type of packaging allows for a high density of connections and is suitable for complex electronic designs requiring a large number of I/O pins.