XC7A200T-1FBG676C

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XC7A200T-1FBG676C

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IC FPGA 400 I/O 676FCBGA

  • 제조업체AMD Xilinx

  • 제조업체 부품 #XC7A200T-1FBG676C

  • 패키지 FCBGA-676

  • 재고4558

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

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사양

속성 가치
Package / Case Tray
Series Artix-7
Part Status Active
Number of LABs/CLBs 16825
Number of Logic Elements/Cells 215360
Total RAM Bits 13455360
Number of I/O 400
Voltage - Supply 0.95V ~ 1.05V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)

개요

Description

The XC7A200T-1FBG676C is a model within the Xilinx 7 Series FPGAs, specifically from the Artix-7 family. These FPGAs are designed to deliver a balance of performance and cost-effectiveness, making them suitable for a wide range of applications, including consumer, automotive, and industrial markets. The "200T" in the model name indicates a capacity of around 200,000 logic cells.
Key features of the XC7A200T-1FBG676C include:
1. Logic Cells: Approximately 200,000 logic cells for complex designs.
2. I/O Pins: The package supports a substantial number of input/output connections.
3. Package Type: FBG676, a ball grid array package that facilitates high-density design.
4. Speed Grade: The "-1" denotes a specific speed/power performance, targeting the middle range of the series.
5. Temperature Range: The "C" suggests its suitability for commercial temperature ranges.
Ideal for scenarios requiring efficient power usage without compromising on performance, the XC7A200T-1FBG676C provides flexible development capabilities for engineers and designers across various sectors.

Equivalent

The XC7A200T-1FBG676C chip is part of the Xilinx 7 Series of FPGAs, specifically the Artix-7 family. Equivalent products may include similar FPGA models from competing brands, such as Altera (now Intel) Cyclone series, Lattice Semiconductor's ECP5 series, or Microsemi (now Microchip) IGLOO2 series. The specific model comparisons depend on the required logic cells, I/O pins, and other technical specifications, but these families are generally aligned in terms of performance and capabilities.

Features

The XC7A200T-1FBG676C is a member of Xilinx's 7 Series FPGAs, specifically from the Artix-7 family. It features approximately 215,360 logic cells and 740 DSP slices, making it suitable for a wide range of applications requiring moderate to high logic density. This FPGA has 676 pins in a FBG (fine-pitch ball grid array) package. The device includes 13,140 Kbits of block RAM and supports various I/O standards with up to 285 user I/Os. With a -1 speed grade, it offers a balanced performance for general-purpose applications. The Artix-7 family is known for low power consumption and cost-effectiveness, making it ideal for applications in areas such as communication, automotive, and video processing. Additionally, it benefits from the 28 nm process technology, ensuring efficient performance and power management.

Pinout

The XC7A200T-1FBG676C is a part of the Xilinx 7 Series FPGAs, specifically from the Artix-7 family. This model comes in an FBG676 package, which has 676 pins. These pins are used for various functions such as:
1. I/O Pins: For general-purpose input/output functions.
2. Power and Ground Pins: To supply power to the FPGA and provide ground connections.
3. Configuration Pins: Used during the FPGA configuration process.
4. Clock Pins: For clock input and outputs, vital for synchronous operations.
5. Dedicated Pins: For specific tasks like JTAG, and GTX transceiver functions.
Artix-7 FPGAs, including the XC7A200T, are designed for high-performance applications with low power consumption. They are often used in areas such as communications, industrial, consumer electronics, and automotive systems due to their balance of performance, low power, and cost efficiency.

Manufacturer

The XC7A200T-1FBG676C is manufactured by Xilinx, which is a company that specializes in the production of programmable logic devices. Xilinx is known for its field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and adaptive compute acceleration platforms (ACAPs). The company was founded in 1984 and has been a leader in the semiconductor industry, providing flexible and powerful solutions for a variety of applications, including telecommunications, automotive, aerospace, defense, and consumer electronics. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding its reach and capabilities in the semiconductor market. Xilinx's products are particularly valued for their ability to be reprogrammed to meet specific application requirements, making them highly versatile and suitable for a wide range of uses.

Application

The XC7A200T-1FBG676C is a member of the Xilinx 7 Series FPGAs, specifically the Artix-7 family. It is used in applications that require high performance and low power consumption, including:
1. Communications: Infrastructure for optical transport networks, wireless backhaul, and data centers.
2. Broadcast and Video: Video processing and transmission, including compression and decompression.
3. Automotive: Advanced Driver Assistance Systems (ADAS) and infotainment systems.
4. Industrial: Motor control, factory automation, and machine vision.
5. Medical: Imaging and diagnostic equipment.
6. Aerospace and Defense: Secure communications and radar.
Its balance of performance and power makes it suitable for applications requiring efficiency and flexibility.

Package

The XC7A200T-1FBG676C is a BGA (Ball Grid Array) package type. Specifically, it is a Fine-Pitch Ball Grid Array with 676 balls, used for housing a Xilinx 7 Series Artix-7 FPGA. The 'C' denotes the commercial temperature range, and the package is designed for efficient electrical performance and compact footprint applications.

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