사양
| 속성 | 가치 |
| Supplier | AMD Xilinx |
| Package / Case | Tray |
| Series | Artix-7 |
| Part Status | Active |
| Number of LABs/CLBs | 16825 |
| Number of Logic Elements/Cells | 215360 |
| Total RAM Bits | 13455360 |
| Number of I/O | 400 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
개요
Description
XC7A200T-3FBG676E is a Xilinx Artix-7 FPGA (7-series) device. The “200T” denotes mid-to-high density with about 200k logic cells; the “-3” is a mid-range speed grade. The “FBG676E” package code indicates a 676-ball flip-chip BGA, RoHS-compliant. Built on a 28 nm process for low power, it offers abundant resources: thousands of LUTs/FFs, multiple Block RAM blocks, and DSP slices, plus multiple I/O banks supporting a range of standards. It includes clock-management tiles (MMCMs/PLLs) for flexible timing and high-density I/O, with moderate transceiver capabilities for general-purpose logic, DSP, and embedded control tasks. Ideal for cost- and power-sensitive applications such as motor control, industrial automation, imaging, and communications. Design flow: Vivado (recommended) or ISE for legacy designs, with device-specific constraints in XDC files and support for IP cores.
Features
Key features of XC7A200T-3FBG676E (Artix-7):
- Family/device: 7-series Artix-7, XC7A200T
- Package: FBG676E (676-ball Fine-Pitch BGA, extended temperature)
- Speed grade: -3 (industry standard speed)
- Process: 28 nm CMOS
- Logic density: ~215k logic cells
- RAM: substantial BRAM resources for memory-intensive designs
- DSP: hundreds of DSP slices for MAC operations
- Clocking: flexible MMCM/PLL-based clock management
- I/O: numerous I/O banks in the 676-ball package with various I/O standards
- Power: optimized for low power in dense implementations
Common use: high-density, cost-efficient FPGA solutions requiring DSP, memory, and flexible I/O in a single device.
- Family/device: 7-series Artix-7, XC7A200T
- Package: FBG676E (676-ball Fine-Pitch BGA, extended temperature)
- Speed grade: -3 (industry standard speed)
- Process: 28 nm CMOS
- Logic density: ~215k logic cells
- RAM: substantial BRAM resources for memory-intensive designs
- DSP: hundreds of DSP slices for MAC operations
- Clocking: flexible MMCM/PLL-based clock management
- I/O: numerous I/O banks in the 676-ball package with various I/O standards
- Power: optimized for low power in dense implementations
Common use: high-density, cost-efficient FPGA solutions requiring DSP, memory, and flexible I/O in a single device.
Pinout
- Pin count: 676 pins (FBG676 676‑ball BGA)
- Function: Xilinx Artix‑7 FPGA device (XC7A200T) providing ~200K logic cells, DSP slices, BRAM, and high‑speed I/O for configurable digital logic.
- Function: Xilinx Artix‑7 FPGA device (XC7A200T) providing ~200K logic cells, DSP slices, BRAM, and high‑speed I/O for configurable digital logic.
Manufacturer
Manufacturer: Xilinx (now a subsidiary of AMD).
What kind of company: American semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (and related SoCs), plus software and IP.
What kind of company: American semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (and related SoCs), plus software and IP.
Application
XC7A200T-3FBG676E is a mid-to-high density Artix-7 FPGA optimized for low power and cost. Typical application areas:
- Industrial automation, motor control, robotics
- Automotive electronics (body systems, sensor interfaces)
- Embedded vision and imaging (camera interfaces, DSP)
- Communications and networking (SERDES, baseband processing)
- Data acquisition, instrumentation, test & measurement
- Medical and portable devices
- Edge computing and DSP acceleration for consumer electronics
Concise use-case fit: balance of logic density, DSP resources, and low power for cost-sensitive, embedded FPGA designs.
- Industrial automation, motor control, robotics
- Automotive electronics (body systems, sensor interfaces)
- Embedded vision and imaging (camera interfaces, DSP)
- Communications and networking (SERDES, baseband processing)
- Data acquisition, instrumentation, test & measurement
- Medical and portable devices
- Edge computing and DSP acceleration for consumer electronics
Concise use-case fit: balance of logic density, DSP resources, and low power for cost-sensitive, embedded FPGA designs.
Package
Fine-pitch Ball Grid Array (FBGA) package, 676 balls (FBG676).
