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XC7A75T-2FTG256I
+BOMIC FPGA 170 I/O 256FTBGA
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제조업체AMD
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제조업체 부품 #XC7A75T-2FTG256I
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재고2792
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사양
| 속성 | 가치 |
| Series | Artix-7 |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Total RAM Bits | 3870720 |
| Number of I/O | 170 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
| Base Product Number | XC7A75 |
| Number of Logic Elements / Cells | 75520 |
| Number of LA Bs / CL Bs | 5900 |
개요
Description
The XC7A75T integrates digital signal processing (DSP) slices, block RAM, and extensive I/O capabilities, enabling complex data processing and flexible connectivity options. It operates at a voltage range of 0.95V to 1.15V and supports various communication protocols, including PCIe and Ethernet.
With tools such as Vivado Design Suite, engineers can quickly develop and deploy designs targeting the XC7A75T. Its combination of performance, power efficiency, and versatility makes it ideal for applications requiring adaptable processing capabilities.
Equivalent
Features
- Logic Cells: 75,000 logic cells, supporting complex designs.
- DSP Slices: 90 DSP slices for high-performance digital signal processing, each capable of performing 18x25 multiplications.
- Memory: Up to 4.9 Mb of block RAM for data storage and buffering.
- I/O Pins: 120 I/O pins with support for various I/O standards, enabling versatile interfacing options.
- Transceivers: Integrated 12.5 Gbps transceivers for high-speed communication.
- Power Efficiency: Low static and dynamic power consumption, making it suitable for power-sensitive applications.
- Configuration: Configurable via SPI or JTAG, allowing flexibility in design implementation.
The XC7A75T-2FTG256I is ideal for applications in telecommunications, automotive, and industrial automation, among others, due to its robust performance and versatility.
Pinout
The primary functions of the XC7A75T include:
1. Logic Cells: It contains around 75,000 logic cells, enabling complex digital designs.
2. DSP Slices: It has 90 DSP slices for high-performance signal processing tasks.
3. Block RAM: It provides up to 4.9 Mb of block RAM for data storage.
4. I/O Pins: The device supports various I/O standards, allowing for flexibility in interfacing with other components.
5. Configuration: It can be configured for different applications in communications, automotive, industrial, and more.
This FPGA is optimized for high performance and low power, making it suitable for a wide range of applications.
Manufacturer
Xilinx caters to various industries, including telecommunications, automotive, aerospace, and industrial automation, providing tools and devices that allow for a wide range of applications, from signal processing to machine learning. In 2020, Xilinx was acquired by AMD, further expanding its influence in the semiconductor market. As a leader in programmable logic and adaptive technology, Xilinx remains an essential player in enabling the next generation of smart, connected devices.
Application
1. Digital Signal Processing: For tasks such as audio and video processing.
2. Embedded Systems: Integration in microcontroller and microprocessor designs.
3. Communications: Used in networking equipment and wireless systems.
4. Industrial Automation: For control systems and robotics.
5. Automotive: In advanced driver-assistance systems (ADAS).
6. Consumer Electronics: In devices requiring custom logic implementation.
7. Image Processing: For applications in medical imaging and security systems.
Its versatility and performance make it suitable for a wide range of applications across different industries.