사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 25475 |
| Number of Logic Elements/Cells | 326080 |
| Total RAM Bits | 16404480 |
| Number of I/O | 400 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
개요
Description
The XC7K325T-1FBG676C is a member of Xilinx's Kintex-7 FPGA family, built on a 28nm process. Key features:
- Logic Cells: 326,080
- DSP Slices: 840
- Block RAM: 16,020 Kb
- I/O Pins: 400 (supports multiple standards like LVDS, LVCMOS)
- Package: 676-pin FBGA (Fine-Pitch Ball Grid Array)
- Speed Grade: -1 (moderate performance)
Designed for high-performance applications, it balances power efficiency and processing capability, making it suitable for wireless, medical imaging, and aerospace.
Key Interfaces:
- PCIe Gen2, Gigabit Ethernet, DDR3 memory support.
Development Tools:
- Vivado Design Suite for programming and debugging.
This FPGA is ideal for complex digital designs requiring high throughput and flexibility.
- Logic Cells: 326,080
- DSP Slices: 840
- Block RAM: 16,020 Kb
- I/O Pins: 400 (supports multiple standards like LVDS, LVCMOS)
- Package: 676-pin FBGA (Fine-Pitch Ball Grid Array)
- Speed Grade: -1 (moderate performance)
Designed for high-performance applications, it balances power efficiency and processing capability, making it suitable for wireless, medical imaging, and aerospace.
Key Interfaces:
- PCIe Gen2, Gigabit Ethernet, DDR3 memory support.
Development Tools:
- Vivado Design Suite for programming and debugging.
This FPGA is ideal for complex digital designs requiring high throughput and flexibility.
Equivalent
The XC7K325T-1FBG676C is a Kintex-7 FPGA from Xilinx (now AMD). Equivalent alternatives include:
- Intel (Altera): Stratix IV EP4SGX230KF40C2 or Cyclone 10 GX 10CX085.
- Lattice Semiconductor: ECP5-85F or Certus-NX NX-17K.
- Microchip (Microsemi): SmartFusion2 M2S090.
These offer similar logic capacity, performance, or features. For exact replacements, check vendor cross-reference tools or parametric searches.
- Intel (Altera): Stratix IV EP4SGX230KF40C2 or Cyclone 10 GX 10CX085.
- Lattice Semiconductor: ECP5-85F or Certus-NX NX-17K.
- Microchip (Microsemi): SmartFusion2 M2S090.
These offer similar logic capacity, performance, or features. For exact replacements, check vendor cross-reference tools or parametric searches.
Features
The Xilinx Kintex-7 XC7K325T-1FBG676C is a mid-range FPGA with:
- Logic Cells: 326,080
- DSP Slices: 840
- Block RAM: 16,020 Kb
- Transceivers: 16 GTX (6.6 Gbps each)
- I/O Pins: 400 (supports LVDS, LVCMOS, etc.)
- Package: 676-pin FineLine BGA (FBG676)
- Speed Grade: -1 (moderate performance)
- Power Efficiency: 28nm process, optimized for cost-performance balance.
Ideal for high-speed serial connectivity, DSP, and embedded applications.
- Logic Cells: 326,080
- DSP Slices: 840
- Block RAM: 16,020 Kb
- Transceivers: 16 GTX (6.6 Gbps each)
- I/O Pins: 400 (supports LVDS, LVCMOS, etc.)
- Package: 676-pin FineLine BGA (FBG676)
- Speed Grade: -1 (moderate performance)
- Power Efficiency: 28nm process, optimized for cost-performance balance.
Ideal for high-speed serial connectivity, DSP, and embedded applications.
Pinout
The XC7K325T-1FBG676C is a Kintex-7 FPGA from Xilinx (now AMD) in a 676-pin FineLine BGA (FBG676) package.
### Key Features:
- Pin Count: 676 pins (including power, ground, I/O, and configuration pins).
- I/O Pins: ~400 user I/Os (varies by configuration).
- Functions:
- Supports high-speed transceivers (up to 12.5 Gbps).
- Configurable logic blocks (CLBs), DSP slices, and block RAM.
- Multiple power and ground pins for stable operation.
- JTAG, configuration (SPI, BPI, SelectMAP), and clock management pins.
This FPGA is used in high-performance applications like networking, DSP, and embedded systems.
### Key Features:
- Pin Count: 676 pins (including power, ground, I/O, and configuration pins).
- I/O Pins: ~400 user I/Os (varies by configuration).
- Functions:
- Supports high-speed transceivers (up to 12.5 Gbps).
- Configurable logic blocks (CLBs), DSP slices, and block RAM.
- Multiple power and ground pins for stable operation.
- JTAG, configuration (SPI, BPI, SelectMAP), and clock management pins.
This FPGA is used in high-performance applications like networking, DSP, and embedded systems.
Application
The XC7K325T-1FBG676C, a Kintex-7 FPGA from Xilinx (now AMD), is widely used in:
- High-speed communications (5G, optical networking, radar)
- Aerospace & defense (avionics, secure comms, EW systems)
- Industrial automation (motor control, robotics, machine vision)
- Medical imaging (ultrasound, MRI processing)
- Data centers (accelerators, networking, storage)
- Scientific research (high-energy physics, signal processing)
Its high logic density, DSP slices, and SerDes support make it ideal for demanding, high-throughput applications.
- High-speed communications (5G, optical networking, radar)
- Aerospace & defense (avionics, secure comms, EW systems)
- Industrial automation (motor control, robotics, machine vision)
- Medical imaging (ultrasound, MRI processing)
- Data centers (accelerators, networking, storage)
- Scientific research (high-energy physics, signal processing)
Its high logic density, DSP slices, and SerDes support make it ideal for demanding, high-throughput applications.
Package
The XC7K325T-1FBG676C is a Kintex-7 FPGA from Xilinx (now AMD). It comes in a 676-pin FineLine BGA (FBG676) package. This package type is a ball grid array (BGA) with a fine-pitch layout, designed for high-density applications. The "C" suffix indicates a commercial temperature range (0°C to +85°C). Suitable for high-performance, low-power designs.
