XC7VX330T-2FFG1157C

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XC7VX330T-2FFG1157C

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IC FPGA 600 I/O 1157FCBGA

  • 제조업체AMD

  • 제조업체 부품 #XC7VX330T-2FFG1157C

  • 재고6649

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사양

속성 가치
Series Virtex®-7 XT
Part Status Active
Digi Key Programmable Not Verified
Number of Logic Elements / Cells 326400
Total RAM Bits 27648000
Number of I/O 600
Voltage - Supply 0.97V ~ 1.03V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1157-FCBGA (35x35)
Base Product Number XC7VX330
Number of LA Bs / CL Bs 25500

개요

Description

The XC7VX330T-2FFG1157C is a Field-Programmable Gate Array (FPGA) from Xilinx's 7 Series Virtex-7 family, designed for high-performance applications. This model features approximately 330,000 logic cells and is built on a 28nm process technology, providing a balance of performance, power efficiency, and cost. The "-2" indicates its speed grade, offering a mid-range performance level. The "FFG1157" part of the name specifies the package type and pin count — a flip-chip ball grid array with 1157 pins, which supports high-density and high-speed connections.
The Virtex-7 series targets applications such as telecommunications, data centers, and advanced scientific computing, offering capabilities like high-speed DSP, connectivity, and memory interface performance. The "C" suffix indicates the commercial temperature grade, suitable for operating in environments ranging from 0°C to 85°C.
Overall, the XC7VX330T-2FFG1157C FPGA is designed for professionals seeking robust performance for complex, high-throughput processes, providing scalability and flexibility in demanding digital design applications.

Equivalent

The XC7VX330T-2FFG1157C is a Xilinx Virtex-7 FPGA. Its equivalents would typically be other FPGAs in the same performance and capacity range from different manufacturers. These might include:
1. Intel (Altera) Stratix V series.
2. Lattice ECP5 series at the high end.
3. Microsemi (Microchip) PolarFire or SmartFusion2 series.
Each has different architectural features, so the choice depends on specific application requirements. Always cross-reference specifications to ensure compatibility with your needs.

Features

The XC7VX330T-2FFG1157C is a member of the Xilinx Virtex-7 FPGA family. It features 330,000 logic cells and is built on a 28nm process technology. The device includes 20,600 Configurable Logic Blocks (CLBs) and 26,800 DSP slices, making it suitable for high-performance digital signal processing applications. It has 1,470 I/Os and supports up to 28.05 Gbps transceivers, enabling high-speed data transfer.
The XC7VX330T-2FFG1157C offers 21.3 Mb of Block RAM and supports multiple I/O standards such as LVDS, LVCMOS, and SSTL. It also includes advanced clock management with mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs) for precise clock synthesis and distribution.
This FPGA is encapsulated in a 1157-ball Fine-Pitch Ball Grid Array (FBGA) package and operates at a core voltage of 1.0V, with an extended temperature range suitable for diverse applications. The -2 speed grade indicates a balance between performance and power consumption, optimizing for applications requiring high-speed operations.

Pinout

The XC7VX330T-2FFG1157C is a Field-Programmable Gate Array (FPGA) from Xilinx's Virtex-7 family. It comes in an FFG1157 package, which indicates a Fine-Pitch Ball Grid Array with 1157 pins. This FPGA is designed for high-performance applications and includes a variety of features.
The XC7VX330T offers high-speed serial connectivity, a large number of logic cells, enhanced signal processing capabilities, and robust I/O resources. It is suitable for applications such as data centers, broadcast, medical imaging, and aerospace and defense. The "2" in the part number refers to the speed grade, which affects the performance characteristics, while the "C" indicates the commercial temperature range.
The pins are used for various functions, including power supply connections, ground connections, user I/Os, configuration pins, and differential pairs for high-speed data transmission. The specific functions of each pin can be found in the device's datasheet or user guide provided by Xilinx.

Manufacturer

The XC7VX330T-2FFG1157C is manufactured by Xilinx, Inc., which is a part of AMD (Advanced Micro Devices, Inc.) following its acquisition that was completed in February 2022. Xilinx is known for its role as a leading developer and manufacturer of programmable logic devices, such as FPGAs (Field-Programmable Gate Arrays), CPLDs (Complex Programmable Logic Devices), and associated software. The company has been pivotal in the semiconductor industry, providing solutions that allow for high flexibility and reconfigurability in a wide range of applications, including communications, data centers, automotive, aerospace, and industrial sectors. Xilinx's products are often used in cutting-edge technology applications where adaptability and scalability are crucial. As part of AMD, Xilinx's technologies complement AMD's broader portfolio of CPUs and GPUs, furthering AMD's reach into data center and embedded systems markets.

Application

The XC7VX330T-2FFG1157C is a Virtex-7 FPGA from Xilinx, designed for high-performance applications. Its application areas include digital signal processing, high-speed communications, data center acceleration, and video processing. It is used in sectors such as aerospace and defense for radar and electronic warfare systems, telecommunications for network infrastructure, and the automotive industry for advanced driver-assistance systems (ADAS). The FPGA's high logic density and robust I/O capabilities make it suitable for implementing complex algorithms, accelerating computations, and handling bandwidth-intensive tasks in various industrial, scientific, and commercial applications.

Package

The XC7VX330T-2FFG1157C is a field-programmable gate array (FPGA) from Xilinx's Virtex-7 series. It features a package type of FFG1157, which denotes a Fine-Pitch Ball Grid Array (FBGA) with 1157 balls. This package type allows for high-density interconnects, suitable for advanced applications requiring significant processing power and flexibility.

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