이미지는 참조용입니다.
XC7Z100-2FFG1156I
+BOMIC SOC CORTEX-A9 800MHZ 1156BGA
-
제조업체AMD Xilinx
-
제조업체 부품 #XC7Z100-2FFG1156I
-
패키지 FCBGA-1156
-
재고5001
365 1일 품질 보증
7*24 영업 시간 서비스 보증
90-판매 후 1일 보증
정품 보증
사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Zynq®-7000 |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex™-7 FPGA, 444K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
개요
Description
Key features include:
1. Processing System (PS): Dual-core ARM Cortex-A9 processor with NEON and FPU, capable of running operating systems like Linux or real-time applications.
2. Programmable Logic (PL): Equivalent to the Artix-7 FPGA, offering up to 444k logic cells, 2020 DSP slices, and 26.5Mb of block RAM, allowing for extensive hardware customization and parallel processing.
3. I/O and Interfaces: The device supports a wide range of I/O and interfaces, including high-speed transceivers, USB, Ethernet, and memory interfaces, making it suitable for various applications.
4. Temperature and Speed Grade: The "-2FFG1156I" designation indicates a specific speed grade and an industrial temperature range, suitable for demanding environments.
Overall, the XC7Z100-2FFG1156I is ideal for applications requiring a blend of software flexibility and hardware performance, such as in communications, automotive, and industrial automation systems.
Equivalent
Features
1. Processor System: It includes a dual-core ARM Cortex-A9 processor with NEON and FPU, operating up to 1 GHz.
2. Memory Interface: Supports DDR3, DDR3L, DDR2, and LPDDR2 with ECC capability.
3. Programmable Logic: Offers 277,400 logic cells and 3,528 Kb of block RAM.
4. DSP Slices: Contains 2,020 DSP slices for high-performance signal processing.
5. I/O and Connectivity: Features up to 500 I/O pins, supporting various interfaces such as USB, Ethernet, and SDIO.
6. Power Management: Advanced power management features allow for efficient energy consumption.
7. Temperature Range: Designed for industrial temperature ranges, suitable for harsh environments.
8. Package: Comes in a FFG1156 package with 1156 pins.
These features make the XC7Z100-2FFG1156I suitable for complex applications requiring high processing power and flexibility, such as communications, automotive, and industrial control systems.
Pinout
The primary functions of the XC7Z100 include:
1. Processing System (PS): The dual-core ARM Cortex-A9 processor subsystem that supports various applications, including real-time processing and operating system support.
2. Programmable Logic (PL): The FPGA portion allows for custom hardware implementations, offering high flexibility for designing complex systems.
3. I/O Ports: It supports multiple I/O standards and interfaces such as DDR3/DDR3L, USB, Ethernet, and PCIe for connectivity and data transfer.
4. Interconnect Logic: Provides high-speed interconnects between the PS and PL for efficient data communication.
These features make the XC7Z100 suitable for applications requiring a combination of software programmability and hardware optimization, such as embedded systems, automotive, telecommunications, and industrial applications.
Manufacturer
In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a major semiconductor company known for its high-performance processors and graphics technologies. This acquisition aimed to expand AMD's product portfolio and market reach, leveraging Xilinx's expertise in adaptive computing solutions. The combined resources and technologies of the two companies enhance their ability to offer comprehensive solutions that cater to the evolving demands of different sectors.
Application
1. Embedded Systems: Used in applications requiring tight integration of software and hardware, such as industrial automation and robotics.
2. Multimedia and Video Processing: Supports real-time video processing, useful in surveillance systems and broadcasting.
3. Communications: Ideal for wireless communication systems, including LTE base stations.
4. Automotive: Used in advanced driver-assistance systems (ADAS) and infotainment systems.
5. Medical Devices: Supports imaging and diagnostic equipment.
6. Aerospace and Defense: Used in applications requiring high reliability and processing power.
These applications benefit from the SoC's processing capability, flexibility, and energy efficiency.