사양
| 속성 | 가치 |
| Package / Case | Bulk |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Number of LABs/CLBs | 25391 |
| Number of Logic Elements/Cells | 444343 |
| Total RAM Bits | 19456000 |
| Number of I/O | 312 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
개요
Description
The XCKU035-2FBVA676E is a member of Xilinx's Kintex UltraScale FPGA family, offering high performance and power efficiency. Key features include:
- Logic Capacity: ~362K logic cells
- DSP Slices: 1,380 for high-speed signal processing
- Memory: 22.6 Mb of block RAM
- I/O: 400+ user I/Os with support for high-speed protocols (PCIe Gen3, 10G Ethernet)
- Package: 676-pin FBGA (Fine-Pitch Ball Grid Array)
- Process Technology: 20nm, optimized for low power and high bandwidth
Ideal for applications like wireless communications, data centers, and embedded vision, it balances performance and cost. The -2 speed grade ensures robust timing performance.
For detailed specs, refer to Xilinx’s DS890 (UltraScale FPGAs) and UG575 (Packaging) documentation.
- Logic Capacity: ~362K logic cells
- DSP Slices: 1,380 for high-speed signal processing
- Memory: 22.6 Mb of block RAM
- I/O: 400+ user I/Os with support for high-speed protocols (PCIe Gen3, 10G Ethernet)
- Package: 676-pin FBGA (Fine-Pitch Ball Grid Array)
- Process Technology: 20nm, optimized for low power and high bandwidth
Ideal for applications like wireless communications, data centers, and embedded vision, it balances performance and cost. The -2 speed grade ensures robust timing performance.
For detailed specs, refer to Xilinx’s DS890 (UltraScale FPGAs) and UG575 (Packaging) documentation.
Equivalent
The XCKU035-2FBVA676E is a Kintex UltraScale FPGA from Xilinx (now AMD). Equivalent alternatives include:
- Kintex UltraScale family: XCKU025, XCKU040, XCKU060 (similar architecture, varying resources).
- Kintex UltraScale+: XCKU3P (higher performance, lower power).
- Competitors: Intel Stratix 10 (GX/SX series) or Artix UltraScale+ for lower-cost options.
Check specs for exact resource, speed, and power trade-offs.
- Kintex UltraScale family: XCKU025, XCKU040, XCKU060 (similar architecture, varying resources).
- Kintex UltraScale+: XCKU3P (higher performance, lower power).
- Competitors: Intel Stratix 10 (GX/SX series) or Artix UltraScale+ for lower-cost options.
Check specs for exact resource, speed, and power trade-offs.
Pinout
The XCKU035-2FBVA676E is a Kintex UltraScale FPGA with:
- Pin count: 676 (FBVA676 package)
- Key functions:
- High-speed I/O: Supports up to 16.3 Gbps transceivers (GTH)
- Logic capacity: ~504K logic cells
- Memory: ~38.5 Mb BRAM, 48 Mb UltraRAM
- DSP slices: 2,520 for high-performance math
- PCIe Gen3/4, 100G Ethernet, and high-speed memory interfaces (DDR4)
Designed for high-performance computing, networking, and signal processing.
- Pin count: 676 (FBVA676 package)
- Key functions:
- High-speed I/O: Supports up to 16.3 Gbps transceivers (GTH)
- Logic capacity: ~504K logic cells
- Memory: ~38.5 Mb BRAM, 48 Mb UltraRAM
- DSP slices: 2,520 for high-performance math
- PCIe Gen3/4, 100G Ethernet, and high-speed memory interfaces (DDR4)
Designed for high-performance computing, networking, and signal processing.
Manufacturer
The XCKU035-2FBVA676E is manufactured by Xilinx, a leading American technology company specializing in programmable logic devices, including FPGAs (Field-Programmable Gate Arrays) and adaptive SoCs (System-on-Chips). Xilinx, founded in 1984 and now a subsidiary of AMD (acquired in 2022), is renowned for its high-performance, reconfigurable semiconductor solutions used in industries like telecommunications, automotive, aerospace, and data centers. The XCKU035 is part of Xilinx's Kintex UltraScale+ family, offering advanced processing capabilities for demanding applications.
Package
The XCKU035-2FBVA676E is a Kintex UltraScale FPGA from Xilinx (now AMD). It comes in a FBVA676 package, which is a 676-ball Fine-Pitch Ball Grid Array (FBGA) with a 1.0mm ball pitch. This package is designed for high-performance applications, offering robust thermal and electrical performance. The "E" suffix indicates it is an extended temperature range variant (-40°C to +100°C).
