사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Number of LABs/CLBs | 82920 |
| Number of Logic Elements/Cells | 1451100 |
| Total RAM Bits | 77721600 |
| Number of I/O | 728 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
개요
Description
The XCKU115-2FLVF1924I is a part of the Xilinx Kintex UltraScale FPGA series. It is designed to deliver high performance with lower power consumption, making it suitable for applications requiring intensive processing and high-speed data throughput. This FPGA features a logic cell count of approximately 1.2 million, offering significant computational capabilities for complex designs.
It is housed in a FCBGA-1924 package, which provides a robust connectivity solution and enhances thermal management. The "2" in its designation indicates its speed grade, while the "I" signifies its industrial-grade temperature range, making it ideal for demanding environmental conditions. The device supports a range of I/O standards and includes advanced features like DSP slices, block RAM, and serial transceivers, which are essential for applications in telecommunications, aerospace, and data centers.
The XCKU115-2FLVF1924I is also supported by Xilinx's Vivado Design Suite, enabling efficient development, simulation, and deployment of digital designs. Its combination of versatility, performance, and energy efficiency makes it a preferred choice for high-performance embedded systems.
It is housed in a FCBGA-1924 package, which provides a robust connectivity solution and enhances thermal management. The "2" in its designation indicates its speed grade, while the "I" signifies its industrial-grade temperature range, making it ideal for demanding environmental conditions. The device supports a range of I/O standards and includes advanced features like DSP slices, block RAM, and serial transceivers, which are essential for applications in telecommunications, aerospace, and data centers.
The XCKU115-2FLVF1924I is also supported by Xilinx's Vivado Design Suite, enabling efficient development, simulation, and deployment of digital designs. Its combination of versatility, performance, and energy efficiency makes it a preferred choice for high-performance embedded systems.
Equivalent
The XCKU115-2FLVF1924I is a Xilinx Kintex UltraScale FPGA. Equivalent products from other manufacturers include:
1. Intel Stratix 10 FPGAs: Comparable in terms of performance and logic capability.
2. Lattice ECP5 or Lattice Nexus series: Depending on specific requirements like power consumption and cost.
3. Microsemi (now part of Microchip) PolarFire FPGAs: Offers similar performance and features for mid-range applications.
Always verify specific technical requirements and compatibility when selecting equivalent FPGA products.
1. Intel Stratix 10 FPGAs: Comparable in terms of performance and logic capability.
2. Lattice ECP5 or Lattice Nexus series: Depending on specific requirements like power consumption and cost.
3. Microsemi (now part of Microchip) PolarFire FPGAs: Offers similar performance and features for mid-range applications.
Always verify specific technical requirements and compatibility when selecting equivalent FPGA products.
Features
The XCKU115-2FLVF1924I is a member of the Xilinx Kintex UltraScale FPGA family, known for high performance and power efficiency. Key features include:
1. High Logic Density: Over 1.1 million logic cells, suitable for complex designs.
2. DSP Slices: 5,520 DSP slices for efficient signal processing tasks.
3. Memory Resources: 75.9 Mb of total on-chip memory, including block RAM and UltraRAM, providing significant data storage capacity.
4. I/O Flexibility: Supports a wide range of I/O standards with numerous high-performance I/O pins.
5. Transceiver Capabilities: Up to 32.75 Gbps transceivers for high-speed data transfer.
6. Clock Management: Multiple clock management tiles for precise control and distribution of clock signals.
7. Power Efficiency: Designed with low power consumption in mind, making it suitable for energy-sensitive applications.
8. Temperature Range: Industrial-grade with an operating temperature range of -40°C to +100°C, suitable for harsh environments.
9. Packaging: Available in a 1924-ball Flip-Chip FineLine BGA package.
These features make it ideal for applications in areas like communications, aerospace, and data center acceleration.
1. High Logic Density: Over 1.1 million logic cells, suitable for complex designs.
2. DSP Slices: 5,520 DSP slices for efficient signal processing tasks.
3. Memory Resources: 75.9 Mb of total on-chip memory, including block RAM and UltraRAM, providing significant data storage capacity.
4. I/O Flexibility: Supports a wide range of I/O standards with numerous high-performance I/O pins.
5. Transceiver Capabilities: Up to 32.75 Gbps transceivers for high-speed data transfer.
6. Clock Management: Multiple clock management tiles for precise control and distribution of clock signals.
7. Power Efficiency: Designed with low power consumption in mind, making it suitable for energy-sensitive applications.
8. Temperature Range: Industrial-grade with an operating temperature range of -40°C to +100°C, suitable for harsh environments.
9. Packaging: Available in a 1924-ball Flip-Chip FineLine BGA package.
These features make it ideal for applications in areas like communications, aerospace, and data center acceleration.
Pinout
The XCKU115-2FLVF1924I is part of the Xilinx Kintex UltraScale FPGA family. It comes in an FLVF1924 package, which indicates it has 1924 pins. This FPGA is designed for high-performance applications and offers a variety of functions including advanced signal processing, high-speed connectivity, and large-scale integration capabilities.
Key functions and features include:
1. Logic Cells: It contains a large number of logic cells for implementing complex digital circuits.
2. DSP Slices: Offers a significant number of DSP slices for high-speed signal processing.
3. Block RAM: Provides substantial block RAM for data storage and processing.
4. High-speed Transceivers: Equipped with high-speed transceivers for efficient data transfer.
5. I/O Pins: A large number of I/O pins enable extensive interfacing capabilities.
6. Scalability and Configurability: Highly scalable to meet diverse application requirements.
The XCKU115 is suitable for applications such as data centers, wireless infrastructure, and video processing, providing high throughput and low power consumption.
Key functions and features include:
1. Logic Cells: It contains a large number of logic cells for implementing complex digital circuits.
2. DSP Slices: Offers a significant number of DSP slices for high-speed signal processing.
3. Block RAM: Provides substantial block RAM for data storage and processing.
4. High-speed Transceivers: Equipped with high-speed transceivers for efficient data transfer.
5. I/O Pins: A large number of I/O pins enable extensive interfacing capabilities.
6. Scalability and Configurability: Highly scalable to meet diverse application requirements.
The XCKU115 is suitable for applications such as data centers, wireless infrastructure, and video processing, providing high throughput and low power consumption.
Manufacturer
The XCKU115-2FLVF1924I is manufactured by Xilinx, Inc. Xilinx is a company that specializes in the development and production of programmable logic devices. It is particularly known for its field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs). These products are used in a wide range of applications across various industries, including telecommunications, automotive, aerospace, and consumer electronics, to enable hardware optimization and customization. Xilinx's technology allows for the creation of adaptable hardware solutions that can be reprogrammed to meet specific functional requirements, offering significant flexibility compared to fixed-function hardware.
Application
The Xilinx XCKU115-2FLVF1924I is a high-performance FPGA from the Kintex UltraScale family. It is used in various application areas including:
1. Data Centers: For acceleration of data processing tasks.
2. Wireless Communications: In baseband processing and 5G systems.
3. Broadcast and Video: For video processing and transmission.
4. Aerospace and Defense: In radar and signal intelligence applications.
5. Test and Measurement: For high-speed data acquisition and processing.
6. High-Performance Computing: As a co-processor for computational tasks.
These applications benefit from the FPGA's high logic density, DSP capabilities, and high-speed transceivers.
1. Data Centers: For acceleration of data processing tasks.
2. Wireless Communications: In baseband processing and 5G systems.
3. Broadcast and Video: For video processing and transmission.
4. Aerospace and Defense: In radar and signal intelligence applications.
5. Test and Measurement: For high-speed data acquisition and processing.
6. High-Performance Computing: As a co-processor for computational tasks.
These applications benefit from the FPGA's high logic density, DSP capabilities, and high-speed transceivers.
Package
The XCKU115-2FLVF1924I is part of Xilinx's Kintex UltraScale FPGA family. It features an F1924 package type, which is a Flip-Chip Ball Grid Array (FCBGA) with 1924 balls. The "I" denotes the industrial temperature grade.