사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Kintex® UltraScale+™ |
| Part Status | Active |
| Number of LABs/CLBs | 42660 |
| Number of Logic Elements/Cells | 746550 |
| Total RAM Bits | 70656000 |
| Number of I/O | 304 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
개요
Description
The XCKU13P-2FFVE900I is a member of Xilinx's (now AMD) Kintex UltraScale+ FPGA family, designed for high-performance applications. Key features include:
- FPGA Fabric: 16nm process with 1,159K logic cells, 6,840 DSP slices, and 75.9 Mb of BRAM.
- I/O & Interfaces: Supports high-speed interfaces like PCIe Gen3/4, 32.75 Gb/s transceivers, DDR4 memory, and up to 500+ user I/Os.
- Package: 900-ball flip-chip (FFVE900) with fine-pitch BGA for dense designs.
- Performance: Optimized for low power and high throughput in data center, networking, and embedded systems.
Ideal for 5G, AI acceleration, and high-speed data processing, it balances power efficiency and computational density.
- FPGA Fabric: 16nm process with 1,159K logic cells, 6,840 DSP slices, and 75.9 Mb of BRAM.
- I/O & Interfaces: Supports high-speed interfaces like PCIe Gen3/4, 32.75 Gb/s transceivers, DDR4 memory, and up to 500+ user I/Os.
- Package: 900-ball flip-chip (FFVE900) with fine-pitch BGA for dense designs.
- Performance: Optimized for low power and high throughput in data center, networking, and embedded systems.
Ideal for 5G, AI acceleration, and high-speed data processing, it balances power efficiency and computational density.
Equivalent
The XCKU13P-2FFVE900I is a Kintex UltraScale+ FPGA. Equivalent alternatives include:
- Xilinx Kintex UltraScale+ variants like XCKU11P, XCKU15P (similar family, different resources).
- Intel Stratix 10 (e.g., 1SG280HU, competitive performance).
- AMD Versal ACAP (e.g., XCVC1902, newer architecture).
Check specs for exact resource, speed, and power trade-offs. Always verify pin compatibility and feature requirements.
- Xilinx Kintex UltraScale+ variants like XCKU11P, XCKU15P (similar family, different resources).
- Intel Stratix 10 (e.g., 1SG280HU, competitive performance).
- AMD Versal ACAP (e.g., XCVC1902, newer architecture).
Check specs for exact resource, speed, and power trade-offs. Always verify pin compatibility and feature requirements.
Features
The Xilinx XCKU13P-2FFVE900I is a high-performance FPGA from the Kintex UltraScale+ family. Key features:
- Logic Cells: 1,159K
- DSP Slices: 5,520 (27x18 multipliers)
- Block RAM: 75.9 Mb (4,860 Kb ultra RAM)
- Transceivers: 32x GTH (16.3 Gbps)
- PCIe: Gen3 x16 support
- I/O Pins: 600+ (HP & HR banks)
- Process: 16nm FinFET+
- Power: Low-power optimized (2-grade speed)
- Package: 900-ball FCBGA (23x23mm)
Ideal for high-speed networking, data centers, and signal processing.
- Logic Cells: 1,159K
- DSP Slices: 5,520 (27x18 multipliers)
- Block RAM: 75.9 Mb (4,860 Kb ultra RAM)
- Transceivers: 32x GTH (16.3 Gbps)
- PCIe: Gen3 x16 support
- I/O Pins: 600+ (HP & HR banks)
- Process: 16nm FinFET+
- Power: Low-power optimized (2-grade speed)
- Package: 900-ball FCBGA (23x23mm)
Ideal for high-speed networking, data centers, and signal processing.
Pinout
The XCKU13P-2FFVE900I is a Kintex UltraScale+ FPGA with the following key specifications:
- Pin Count: 900 pins (FFVE package)
- Primary Functions:
- High-speed serial transceivers (up to 32.75 Gbps)
- Logic and DSP resources for high-performance computing
- On-chip memory (UltraRAM, Block RAM)
- PCIe Gen4 support
- Advanced power management
It is designed for applications like data center acceleration, wired/wireless communications, and high-performance embedded systems.
- Pin Count: 900 pins (FFVE package)
- Primary Functions:
- High-speed serial transceivers (up to 32.75 Gbps)
- Logic and DSP resources for high-performance computing
- On-chip memory (UltraRAM, Block RAM)
- PCIe Gen4 support
- Advanced power management
It is designed for applications like data center acceleration, wired/wireless communications, and high-performance embedded systems.
Manufacturer
The XCKU13P-2FFVE900I is manufactured by Xilinx, a leading American technology company specializing in programmable logic devices, including FPGAs (Field-Programmable Gate Arrays) and adaptive SoCs (System-on-Chips). Xilinx, founded in 1984 and now a subsidiary of AMD (acquired in 2022), is renowned for its high-performance computing, AI, and embedded solutions. The XCKU13P is part of Xilinx's Kintex UltraScale+ family, designed for advanced applications in data centers, aerospace, and telecommunications.
Xilinx is a key player in semiconductor innovation, providing flexible, high-speed processing solutions for industries requiring customizable hardware acceleration.
Xilinx is a key player in semiconductor innovation, providing flexible, high-speed processing solutions for industries requiring customizable hardware acceleration.
Package
The XCKU13P-2FFVE900I is a Flip-Chip Fine-Pitch Ball Grid Array (FF) package. It has 900 pins and is designed for high-performance applications. The "VE" suffix indicates its industrial temperature range (-40°C to +100°C). The package supports high-speed interfaces and dense logic, typical of Xilinx UltraScale+ FPGAs.
