사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Kintex® UltraScale+™ |
| Part Status | Active |
| Number of LABs/CLBs | 65340 |
| Number of Logic Elements/Cells | 1143450 |
| Total RAM Bits | 82329600 |
| Number of I/O | 512 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
개요
Description
The XCKU15P-1FFVE1517E is a member of the Xilinx (now AMD) Kintex UltraScale+ FPGA family, designed for high-performance computing, networking, and signal processing.
### Key Features:
- FPGA Fabric: 16nm FinFET+ technology, offering high logic density and power efficiency.
- Logic Cells: ~1.5 million (varies by configuration).
- DSP Slices: High-performance DSP blocks for intensive arithmetic operations.
- Memory: Up to 75.9 Mb of UltraRAM and 38.7 Mb of block RAM.
- I/O: Supports high-speed transceivers (up to 32.75 Gbps GTY) and PCIe Gen4.
- Package: FFVE1517 (Flip-chip, 1517-pin BGA).
- Applications: Data centers, 5G, radar, and AI acceleration.
### Advantages:
- Balanced performance-to-power ratio (UltraScale+ architecture).
- Scalable for complex designs with high-speed interfaces.
This FPGA is ideal for demanding, high-bandwidth applications requiring flexibility and efficiency.
### Key Features:
- FPGA Fabric: 16nm FinFET+ technology, offering high logic density and power efficiency.
- Logic Cells: ~1.5 million (varies by configuration).
- DSP Slices: High-performance DSP blocks for intensive arithmetic operations.
- Memory: Up to 75.9 Mb of UltraRAM and 38.7 Mb of block RAM.
- I/O: Supports high-speed transceivers (up to 32.75 Gbps GTY) and PCIe Gen4.
- Package: FFVE1517 (Flip-chip, 1517-pin BGA).
- Applications: Data centers, 5G, radar, and AI acceleration.
### Advantages:
- Balanced performance-to-power ratio (UltraScale+ architecture).
- Scalable for complex designs with high-speed interfaces.
This FPGA is ideal for demanding, high-bandwidth applications requiring flexibility and efficiency.
Equivalent
The XCKU15P-1FFVE1517E is a Kintex UltraScale+ FPGA. Equivalent alternatives include:
- Xilinx Kintex UltraScale+ KU15P (same family, similar specs)
- Intel Stratix 10 GX 2800 (competitive FPGA with comparable logic density)
- Xilinx Virtex UltraScale+ VU13P (higher-end alternative)
For exact replacements, check Xilinx's (now AMD) product tables or cross-reference tools for matching speed grades, packages, and features.
- Xilinx Kintex UltraScale+ KU15P (same family, similar specs)
- Intel Stratix 10 GX 2800 (competitive FPGA with comparable logic density)
- Xilinx Virtex UltraScale+ VU13P (higher-end alternative)
For exact replacements, check Xilinx's (now AMD) product tables or cross-reference tools for matching speed grades, packages, and features.
Pinout
The XCKU15P-1FFVE1517E is a Kintex UltraScale+ FPGA in a 1517-ball Flip-Chip Fine-Pitch BGA (FFVE) package.
- Pin Count: 1517 balls (including power, ground, and I/O).
- Key Functions:
- High-speed transceivers (up to 32.75 Gbps GTY).
- Logic cells: ~1.1 million.
- DSP slices: 5,520.
- Block RAM: ~75.9 Mb.
- PCIe Gen3/4, 100G Ethernet, and memory interfaces (DDR4).
- LVDS, LVCMOS, and other I/O standards.
Designed for high-performance computing, networking, and signal processing.
- Pin Count: 1517 balls (including power, ground, and I/O).
- Key Functions:
- High-speed transceivers (up to 32.75 Gbps GTY).
- Logic cells: ~1.1 million.
- DSP slices: 5,520.
- Block RAM: ~75.9 Mb.
- PCIe Gen3/4, 100G Ethernet, and memory interfaces (DDR4).
- LVDS, LVCMOS, and other I/O standards.
Designed for high-performance computing, networking, and signal processing.
Manufacturer
The XCKU15P-1FFVE1517E is manufactured by Xilinx, a leading American technology company specializing in programmable logic devices, including FPGAs (Field-Programmable Gate Arrays) and adaptive SoCs (System-on-Chips). Xilinx, now a subsidiary of AMD (acquired in 2022), is known for its high-performance computing and embedded solutions.
This specific model is part of Xilinx's Kintex UltraScale+ family, designed for applications requiring high-speed processing, such as data centers, aerospace, and telecommunications. The company is a key player in semiconductor innovation, particularly in reconfigurable computing.
This specific model is part of Xilinx's Kintex UltraScale+ family, designed for applications requiring high-speed processing, such as data centers, aerospace, and telecommunications. The company is a key player in semiconductor innovation, particularly in reconfigurable computing.
Application
The XCKU15P-1FFVE1517E, a high-performance Kintex UltraScale+ FPGA, is widely used in:
1. Data Centers – Accelerating AI/ML, networking, and storage.
2. 5G & Wireless – Baseband processing and fronthaul/backhaul.
3. Aerospace & Defense – Radar, EW, and secure comms.
4. Industrial Automation – Real-time control and vision systems.
5. Medical Imaging – High-speed signal processing.
6. Automotive – ADAS and in-vehicle networking.
Its high-speed interfaces (PCIe, DDR4) and DSP capabilities make it ideal for demanding applications.
1. Data Centers – Accelerating AI/ML, networking, and storage.
2. 5G & Wireless – Baseband processing and fronthaul/backhaul.
3. Aerospace & Defense – Radar, EW, and secure comms.
4. Industrial Automation – Real-time control and vision systems.
5. Medical Imaging – High-speed signal processing.
6. Automotive – ADAS and in-vehicle networking.
Its high-speed interfaces (PCIe, DDR4) and DSP capabilities make it ideal for demanding applications.
Package
The XCKU15P-1FFVE1517E is a Xilinx UltraScale+ FPGA in a 1FFVE1517E package. This is a Flip-Chip Fine-Pitch Ball Grid Array (FF) package with 1517 pins, measuring 35mm x 35mm. It supports high-speed interfaces and is designed for advanced applications requiring high performance and signal integrity. The "E" suffix indicates it is RoHS-compliant.
