XCKU5P-L2FFVB676E

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XCKU5P-L2FFVB676E

+BOM

IC FPGA 280 I/O 676FCBGA

  • 제조업체AMD Xilinx

  • 제조업체 부품 #XCKU5P-L2FFVB676E

  • 패키지 FBGA-676

  • 재고7112

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Package Tray
Series Kintex® UltraScale+™
ProductStatus Active
NumberofLABs/CLBs 27120
NumberofLogicElements/Cells 474600
TotalRAMBits 41984000
NumberofI/O 280
Voltage-Supply 0.698V ~ 0.876V
MountingType Surface Mount
OperatingTemperature 0°C ~ 110°C (TJ)
Package/Case 676-BBGA, FCBGA

개요

Description

The XCKU5P-L2FFVB676E is a model within the Xilinx Kintex UltraScale+ FPGA series, which is designed to deliver high-performance computing capabilities while maintaining power efficiency. This particular model is part of the Kintex UltraScale+ family, known for its balance between cost and performance, making it suitable for applications requiring high throughput and low latency.
The XCKU5P-L2FFVB676E features advanced 16nm FinFET+ technology, offering improved speed and power efficiency over previous generations. It includes a range of resources such as programmable logic cells, DSP slices, memory blocks, and high-speed transceivers, enabling a wide variety of digital signal processing, data center, and communication applications.
This FPGA is packaged in the FFVB676, which ensures a compact form factor suitable for integration into various systems. Its architecture supports high-speed connectivity and extensive I/O flexibility, making it ideal for applications in areas such as 5G wireless, video processing, automotive, and industrial automation. Additionally, the device supports advanced security features and design tools, enhancing both its functionality and ease of development.

Equivalent

The XCKU5P-L2FFVB676E is part of the Xilinx Kintex UltraScale+ FPGA series. Equivalent products would be other FPGAs with similar capabilities and specifications from different manufacturers, such as Intel's (formerly Altera) Stratix 10 or Arria 10 series, and Microsemi's (now Microchip) PolarFire series. The exact equivalence depends on specific application requirements like logic cells, I/Os, power consumption, and cost considerations. Always compare detailed specifications to ensure suitability for your specific needs.

Features

The XCKU5P-L2FFVB676E is part of the Xilinx Kintex UltraScale+ FPGA family, designed to deliver high performance and optimized for a variety of applications. Key features include:
1. Architecture: Built on a 16nm FinFET process, it offers improved performance and power efficiency.
2. Logic Resources: Provides a substantial number of logic cells and programmable slices for complex designs.
3. DSP Slices: Equipped with numerous DSP slices, ideal for signal processing applications.
4. Memory: Includes ample on-chip memory resources, such as block RAM and UltraRAM, for efficient data handling.
5. I/O Flexibility: Supports a wide range of I/O standards with configurable I/O banks, enabling versatile connectivity options.
6. Transceivers: High-speed transceivers are available for data-intensive tasks and high-bandwidth communication.
7. Security: Features robust security options including bitstream encryption and authentication.
8. Power Management: Designed for low power consumption while maintaining high performance levels.
9. Design Tools: Compatible with Xilinx's Vivado Design Suite for efficient design and implementation.
These features make it suitable for applications in telecommunications, data centers, and aerospace, among others.

Pinout

The XCKU5P-L2FFVB676E is a member of the Xilinx Kintex UltraScale+ FPGA family. It comes in an FFVB676 package, which indicates it has 676 pins. This FPGA is designed for applications requiring high performance and efficiency, offering a balance of logic resources, memory, and DSP capabilities. The pins in this package serve various functions including:
1. I/O Pins: Configurable for different I/O standards and used for interfacing with other components.
2. Power and Ground Pins: Supply power and provide a ground path for the FPGA.
3. Configuration Pins: Used for programming the FPGA during the configuration phase.
4. Clock Pins: Dedicated pins for clock input to drive the FPGA's clock management resources.
5. JTAG Pins: Used for testing and debugging through the JTAG interface.
6. Dedicated High-Speed Transceiver Pins: For high-speed serial communication.
The exact function of each pin can be found in the device's datasheet or user guide provided by Xilinx, which details the pinout and configuration options specific to the FFVB676 package.

Manufacturer

The XCKU5P-L2FFVB676E is a product manufactured by Xilinx, Inc. Xilinx is a technology company that specializes in the development of programmable logic devices. They are well-known for their field-programmable gate arrays (FPGAs), adaptive system-on-chips (SoCs), and other advanced semiconductor products.
Xilinx’s products are widely used in various industries, including telecommunications, automotive, aerospace, defense, and consumer electronics, where they provide flexible and efficient solutions for a variety of applications. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), another leading company in the semiconductor industry, further enhancing their capabilities and market reach.

Application

The XCKU5P-L2FFVB676E is a FPGA from Xilinx's Kintex UltraScale+ family, designed for high-performance applications. Its application areas include:
1. Data Center Acceleration: Enhances processing capabilities for tasks like machine learning and data analytics.
2. Wireless Communications: Supports advanced protocols for 5G networks and beyond.
3. Broadcast and Pro Audio/Visual: Used in video processing and transmission.
4. Test and Measurement: Facilitates precise data acquisition and analysis.
5. Aerospace and Defense: Provides reliable processing for radar and electronic warfare systems.
6. Industrial IoT: Supports smart manufacturing with real-time data processing and connectivity.
These applications leverage its high logic density, low latency, and power efficiency.

Package

The package type for the XCKU5P-L2FFVB676E is a Flip-Chip Ball Grid Array (FCBGA) with 676 balls.

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