사양
| 속성 | 가치 |
| Supplier | AMD Xilinx |
| Package / Case | Tray |
| Series | Virtex®-E |
| Part Status | Obsolete |
| Number of LABs/CLBs | 3456 |
| Number of Logic Elements/Cells | 15552 |
| Total RAM Bits | 294912 |
| Number of I/O | 444 |
| Number of Gates | 985882 |
| Voltage - Supply | 1.71V ~ 1.89V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
개요
Description
XCV600E-6FG676I is a Xilinx Virtex‑E FPGA. It comes in a 676‑pin FineLine BGA package (FG676), with speed grade -6 and an industrial temperature range (I). The device provides roughly 600k logic cells, plus block RAM and DSP resources across multiple I/O banks, enabling high‑density DSP, logic, and I/O‑intensive designs. It is programmed with Xilinx design tools (historically ISE) to produce a bitstream (.bit) for configuration. Typical applications include communications, signal processing, data acquisition, and hardware acceleration. Note that this is an older device; availability and toolchain support have evolved. For exact specifications (logic cells, BRAM, DSP slices, I/O counts, I/O standards), consult the official Xilinx datasheet for XCV600E‑6FG676I.
Features
XCV600E-6FG676I is a Virtex‑E FPGA in a FG676 Fine‑PG BGA package (industrial temperature, speed grade -6). Key features:
- High-density fabric with LUT-based CLBs (hundreds of thousands of logic resources)
- On‑chip Block RAM and distributed RAM
- DSP slices for high‑speed math/filters
- Rich clocking: multiple DCMs/PLLs for independent clock domains
- Large I/O across multiple banks with support for common standards (LVCMOS/LVTTL, SSTL, HSTL, etc.)
- Flexible configuration options (JTAG, SPI, and other boot modes)
- Multi‑voltage I/O banks and power management for dense designs
These make it suitable for demanding DSP, communications, and high‑performance logic applications. For exact resource counts and electrical specs, refer to the Xilinx datasheet.
- High-density fabric with LUT-based CLBs (hundreds of thousands of logic resources)
- On‑chip Block RAM and distributed RAM
- DSP slices for high‑speed math/filters
- Rich clocking: multiple DCMs/PLLs for independent clock domains
- Large I/O across multiple banks with support for common standards (LVCMOS/LVTTL, SSTL, HSTL, etc.)
- Flexible configuration options (JTAG, SPI, and other boot modes)
- Multi‑voltage I/O banks and power management for dense designs
These make it suitable for demanding DSP, communications, and high‑performance logic applications. For exact resource counts and electrical specs, refer to the Xilinx datasheet.
Pinout
- Pin count: 676 pins (FG676 package).
- Function: Xilinx Virtex-E FPGA (XCV600E) – a 600K-logic-cell field-programmable gate array with configurable I/O, RAM blocks, DSP resources, etc. (industrial temperature grade indicated by the trailing I).
- Function: Xilinx Virtex-E FPGA (XCV600E) – a 600K-logic-cell field-programmable gate array with configurable I/O, RAM blocks, DSP resources, etc. (industrial temperature grade indicated by the trailing I).
Manufacturer
- Manufacturer: Xilinx, Inc. (now part of AMD)
- Company type: A multinational American semiconductor company that designs and manufactures programmable logic devices (FPGAs, CPLDs) and related design software/IP.
- Company type: A multinational American semiconductor company that designs and manufactures programmable logic devices (FPGAs, CPLDs) and related design software/IP.
Application
XCV600E-6FG676I is a Virtex‑E FPGA with about 600K logic cells, many I/Os, BRAM and DSP slices. Typical applications:
- High‑end DSP, communications, DSP accelerators, software‑defined radio
- High‑speed data paths, telecom/network interfaces, switch fabrics
- Real‑time video/image processing and machine vision
- Embedded systems, hardware accelerators, protocol processing
- Prototyping, emulation and reconfigurable computing
- Aerospace/defense, automotive, medical instrumentation and test equipment
- High‑end DSP, communications, DSP accelerators, software‑defined radio
- High‑speed data paths, telecom/network interfaces, switch fabrics
- Real‑time video/image processing and machine vision
- Embedded systems, hardware accelerators, protocol processing
- Prototyping, emulation and reconfigurable computing
- Aerospace/defense, automotive, medical instrumentation and test equipment
Package
Fine-Line Ball Grid Array (FG676) package — 676-ball FG676 package.
