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XCVU9P-L2FLGA2104E
+BOMIC FPGA 832 I/O 2104FCBGA
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제조업체AMD
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제조업체 부품 #XCVU9P-L2FLGA2104E
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재고3464
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사양
| 속성 | 가치 |
| Series | Virtex® UltraScale+™ |
| PartStatus | Active |
| DigiKeyProgrammable | Not Verified |
| NumberofLogicElements/Cells | 2586150 |
| TotalRAMBits | 391168000 |
| NumberofI/O | 832 |
| Voltage-Supply | 0.698V ~ 0.742V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 110°C (TJ) |
| Package/Case | 2104-BBGA, FCBGA |
| SupplierDevicePackage | 2104-FCBGA (47.5x47.5) |
| BaseProductNumber | XCVU9 |
| NumberofLABs/CLBs | 147780 |
개요
Description
The L2FLGA2104E package provides a high pin-count, ensuring ample I/O options and flexibility for complex designs. Additionally, these FPGAs support advanced features such as integrated blocks for PCIe, Ethernet, and high-speed memory interfaces, which are critical for applications in data centers, telecommunications, and advanced scientific computing. The combination of high logic density, integrated advanced features, and customizable architecture makes the XCVU9P-L2FLGA2104E suitable for modern, demanding applications requiring robust processing capabilities and high-speed data handling.
Equivalent
1. Intel Stratix 10 series FPGAs, particularly models in the GX or SX line.
2. Altera's earlier Arria 10 series for certain applications.
3. Lattice's ECP5 or CertusPro-NX series for lower-end alternatives, though not direct equivalents.
These alternatives vary based on specific performance, power, and application requirements, so it's essential to compare specifications for a suitable match.
Features
1. UltraScale+ Architecture: Offers enhanced performance and efficiency, featuring integrated logic blocks and DSP slices for intensive computations.
2. High Logic Density: Supports a vast array of logic cells, facilitating complex designs and large-scale integration.
3. Advanced I/O capabilities: Provides extensive I/O bandwidth with multiple high-speed transceivers supporting various protocols.
4. Memory Resources: Includes abundant on-chip memory, enhanced with HBM (High Bandwidth Memory) options for faster data processing.
5. Power Efficiency: Designed to deliver high performance while maintaining optimized power consumption.
6. Security Features: Comes with advanced security measures to protect sensitive data and IP.
7. Customizability: Highly configurable to suit specific application needs across industries such as telecommunications, automotive, and aerospace.
This device is ideal for applications requiring high throughput, low latency, and robust data handling.
Pinout
1. High Logic Density: It provides a large number of logic cells, making it suitable for complex computations and data processing tasks.
2. I/O Flexibility: Offers numerous high-speed transceivers and general-purpose I/O pins to support a range of connectivity options from PCIe to Ethernet.
3. Memory Resources: Includes considerable on-chip memory with block RAM and UltraRAM, enhancing its capability to handle data-intensive applications.
4. DSP Capabilities: Equipped with powerful DSP slices optimized for operations like filtering, encoding, and encryption.
5. Power Efficiency: Despite its performance, the FPGA is designed to optimize power consumption, making it suitable for power-sensitive applications.
Overall, the XCVU9P-L2FLGA2104E is ideal for use in data centers, telecommunications, and advanced scientific applications where performance and flexibility are paramount.
Manufacturer
As a company, Xilinx has been integral in the semiconductor industry, pioneering the FPGA technology that allows for hardware customization and reconfiguration, which is highly valued in industries that require rapid adaptability and scalability. Their acquisition by AMD, completed in February 2022, has expanded AMD's product portfolio and capabilities, combining AMD's strengths in CPUs and GPUs with Xilinx's expertise in FPGAs and adaptive computing. This merger aims to deliver a more comprehensive suite of solutions across the computing spectrum, enhancing capabilities in AI, machine learning, and other advanced technologies.
Application
1. Data Centers: Acceleration of cloud computing, networking, and storage applications.
2. Telecommunications: Used in 5G wireless infrastructure and high-speed networking.
3. Broadcast and Pro Audio/Video: Supports high-definition video processing and transmission.
4. Aerospace and Defense: Suitable for radar systems, electronic warfare, and secure communications.
5. Scientific Research: Used in high-performance computing for simulations and data analysis.
6. Automotive: Advanced driver-assistance systems and autonomous vehicle technologies.
Its capabilities in processing power, bandwidth, and flexibility make it ideal for these demanding applications.