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XCZU19EG-2FFVD1760I
+BOMIC SOC CORTEX-A53 1760FCBGA
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제조업체AMD
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제조업체 부품 #XCZU19EG-2FFVD1760I
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사양
| 속성 | 가치 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| Base Product Number | XCZU19 |
개요
Description
With 19K logic cells, 1.6 MB of block RAM, and 4.5 Mb of UltraRAM, it supports complex algorithms and high-speed data processing. The XCZU19EG also includes multiple high-speed transceivers, enabling fast communication and data transfer rates. It operates at a temperature range suitable for industrial applications and supports various I/O standards.
Designed for flexibility and scalability, the XCZU19EG-2FFVD1760I allows developers to implement sophisticated designs with reduced latency and enhanced performance, making it a preferred choice for cutting-edge technology solutions.
Equivalent
Features
- Processing System: Dual-core ARM Cortex-A53 and a real-time ARM Cortex-R5 processor for efficient multitasking and control.
- FPGA Fabric: Includes 1,024 LUTs, 2,048 flip-flops, and 60 DSP slices for high-performance digital signal processing and custom logic implementation.
- Memory Support: Supports DDR4 and LPDDR4 memory interfaces for high bandwidth.
- I/O Capabilities: Offers a wide range of I/O options, including high-speed transceivers, GPIO, and programmable IO standards.
- Power Efficiency: Designed for low power consumption, making it suitable for embedded applications.
- Thermal Management: Operates efficiently in various temperature ranges.
This device is ideal for applications in communications, automotive, industrial, and more, combining the flexibility of FPGA with the power of a multi-core processor.
Pinout
The pin functions include:
- Power supply pins (VCC, GND)
- I/O pins for general-purpose input/output (GPIO)
- Configuration pins for JTAG and other programming interfaces
- High-speed serial transceivers for communication protocols like PCIe, Gigabit Ethernet, etc.
- Analog and digital signal processing capabilities
- Dedicated pins for memory interfaces (DDR, etc.)
This combination of features makes the XCZU19EG suitable for a wide range of applications, including embedded systems, data processing, and advanced control systems.
Manufacturer
In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), expanding AMD's portfolio to include Xilinx's adaptive computing solutions, which cater to markets such as data centers, automotive, industrial, and communications. Xilinx products, such as the XCZU19EG, are widely used for applications requiring high performance, flexibility, and efficiency, including artificial intelligence, machine learning, and high-speed networking. The company is recognized for its innovation in the semiconductor industry, making it a key player in the field of programmable logic devices.