XCZU2CG-2SFVC784I

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XCZU2CG-2SFVC784I

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IC SOC CORTEX-A53 784FCBGA

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사양

속성 가치
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 784-BFBGA, FCBGA
Supplier Device Package 784-FCBGA (23x23)
Base Product Number XCZU2

개요

Description

The XCZU2CG-2SFVC784I is a member of the Xilinx Zynq UltraScale+ MPSoC family, which combines the versatility of an ARM-based processing system with the flexibility of programmable logic. This particular model is part of the ZU2CG series, featuring a dual-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and a Mali-400 MP2 graphics processor unit. It is built on the 16nm FinFET Plus process, enhancing performance and power efficiency.
The device is housed in a 784-pin flip-chip ball grid array (FCBGA) package, making it suitable for high-density applications. With integrated hardware and software programmability, the XCZU2CG is ideal for applications requiring real-time processing, graphics, and high-speed data transfer, such as automotive, industrial automation, and communications.
Additionally, it supports a range of interfaces and protocols, including PCIe, USB, and Gigabit Ethernet, offering extensive connectivity options. The part number "2SFVC784I" indicates specific features and temperature grades, ensuring suitability for diverse industrial environments.

Equivalent

The XCZU2CG-2SFVC784I is a Zynq UltraScale+ MPSoC from Xilinx, known for its integration of CPU, GPU, and FPGA capabilities. Equivalent products from other manufacturers might include the Intel (Altera) Cyclone V SoC or the Microchip (Microsemi) PolarFire SoC, as they also combine processing systems with FPGA fabric for versatile applications. However, specific equivalence depends on detailed requirements like processing power, I/O options, and application needs. Always compare specifications to ensure suitability for your project.

Features

The XCZU2CG-2SFVC784I is a member of the Xilinx Zynq UltraScale+ MPSoC family. Key features include:
1. Architecture: Combines a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and a Mali-400 MP2 GPU.
2. Programmable Logic: Features a mid-range FPGA fabric with 81,000 logic cells, facilitating custom hardware accelerations.
3. Memory: Supports various memory interfaces, including DDR4/3/3L, LPDDR4/3, and QSPI Flash, providing flexibility in memory configurations.
4. I/O and Connectivity: Offers extensive connectivity options, such as PCIe Gen2, USB 3.0/2.0, Ethernet (up to 10G), and SATA interfaces, enhancing communication capabilities.
5. Power Management: Equipped with advanced power management features to optimize power efficiency.
6. Security: Includes features like secure boot, encryption, and authentication to ensure data integrity and system security.
7. Package: Comes in a 784-ball FCBGA package, suitable for various industrial and embedded applications.
This combination of processing capabilities, programmable logic, and connectivity makes it suitable for applications in automotive, aerospace, industrial, and IoT systems.

Pinout

The XCZU2CG-2SFVC784I is part of Xilinx's Zynq UltraScale+ MPSoC family. It is housed in an SFVC784 package, which has 784 pins. This device integrates a processor system and programmable logic, combining the capabilities of an ARM-based processor with FPGA logic.
The XCZU2CG variant includes:
1. Processor System: Dual-core ARM Cortex-A53, ARM Cortex-R5, and a Mali-400 MP2 GPU.
2. Programmable Logic: Provides configurable logic blocks for custom digital circuit designs.
3. I/O: Supports various I/O interfaces, including high-speed transceivers, Ethernet, USB, and more.
4. Memory Interfaces: Compatible with DDR4, LPDDR4, DDR3, and DDR3L memory.
The package's pin configuration supports a wide range of functions necessary for embedded processing and programmable logic applications, offering flexibility for diverse applications such as automotive, industrial, and communication systems. For precise pin functions, users should refer to the datasheet and pinout diagrams provided by Xilinx.

Manufacturer

The XCZU2CG-2SFVC784I is manufactured by Xilinx, Inc., which is now a part of Advanced Micro Devices, Inc. (AMD) following its acquisition in 2022. Xilinx is known for designing and developing a wide range of programmable logic devices, notably Field-Programmable Gate Arrays (FPGAs), SoCs, and ACAPs (Adaptive Compute Acceleration Platforms). The company has been a significant player in the semiconductor industry, particularly in the area of programmable logic, allowing for flexibility and adaptability in various applications ranging from consumer electronics to high-performance computing and telecommunications.

Application

The XCZU2CG-2SFVC784I is part of Xilinx's Zynq UltraScale+ MPSoC family and is ideal for applications requiring high integration of processors, programmable logic, and I/O. Key application areas include:
1. Embedded Vision Systems: For real-time image processing and machine learning tasks.
2. Industrial Automation: Used in control systems, robotics, and IoT devices.
3. Automotive: Advanced driver-assistance systems (ADAS) and infotainment systems.
4. Communications: Network equipment, wireless infrastructure, and baseband processing.
5. Aerospace and Defense: For secure and reliable mission-critical applications.
6. Medical Devices: Imaging equipment and portable diagnostic devices.
Its integration of ARM cores and FPGA fabric makes it versatile for complex applications.

Package

The XCZU2CG-2SFVC784I is a System-on-Chip (SoC) from Xilinx's Zynq UltraScale+ series. The package type "SFVC784" indicates a BGA (Ball Grid Array) package with 784 pins. The device is designed for applications requiring high-performance processing, programmable logic, and advanced connectivity. The "I" at the end signifies an industrial-grade temperature range.