사양
| 속성 | 가치 |
| Package / Case | Bulk |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
개요
Description
The XCZU3CG-2SFVC784E is a model from Xilinx's Zynq UltraScale+ MPSoC family. This device integrates a high-performance processing system and programmable logic on a single chip, providing a versatile platform for a wide range of applications, including embedded systems, automotive, and industrial control. The processing system includes a quad-core ARM Cortex-A53, a dual-core ARM Cortex-R5 for real-time processing, and a Mali-400 MP2 GPU, offering robust computational capabilities.
The "-2" denotes a specific speed grade, impacting the device's performance characteristics. The "SFVC784" indicates the package type and pin count, with "784" referring to the number of pins. The ZU3CG model offers a balance of logic cells, DSP slices, and block RAM, making it suitable for complex designs requiring significant processing power and flexibility. Additionally, the device supports various I/O standards and interfaces, enhancing its adaptability for diverse connectivity needs. This MPSoC is ideal for designers seeking high integration and performance efficiency in demanding applications.
The "-2" denotes a specific speed grade, impacting the device's performance characteristics. The "SFVC784" indicates the package type and pin count, with "784" referring to the number of pins. The ZU3CG model offers a balance of logic cells, DSP slices, and block RAM, making it suitable for complex designs requiring significant processing power and flexibility. Additionally, the device supports various I/O standards and interfaces, enhancing its adaptability for diverse connectivity needs. This MPSoC is ideal for designers seeking high integration and performance efficiency in demanding applications.
Equivalent
The XCZU3CG-2SFVC784E is a Xilinx Zynq UltraScale+ MPSoC. Equivalent products include:
1. Intel Cyclone V SoC series
2. Microchip PolarFire SoC
3. NXP i.MX 8M family
4. Texas Instruments AM57x Sitara processors
These alternatives may vary in specific features and performance, so it’s important to compare based on individual project requirements.
1. Intel Cyclone V SoC series
2. Microchip PolarFire SoC
3. NXP i.MX 8M family
4. Texas Instruments AM57x Sitara processors
These alternatives may vary in specific features and performance, so it’s important to compare based on individual project requirements.
Features
The XCZU3CG-2SFVC784E is part of Xilinx's Zynq UltraScale+ MPSoC family. It integrates a quad-core ARM Cortex-A53 and a dual-core ARM Cortex-R5, providing a versatile processing system. This device includes advanced features such as hardware virtualization, integrated peripherals like USB, SATA, and Gigabit Ethernet, and support for advanced security measures.
The programmable logic includes approximately 154k system logic cells, offering flexibility for custom hardware acceleration and parallel processing. It features high-speed connectivity options with up to 24 high-speed transceivers supporting data rates of up to 12.5 Gbps. The device also supports DDR4, LPDDR4, and DDR3 memory interfaces, enhancing system memory bandwidth.
With its VU+ architecture, it provides enhanced performance, power efficiency, and integration, suitable for applications in automotive, industrial, and data center environments. The package is FCBGA with 784 pins, allowing for robust connectivity in compact form factors. This MPSoC is ideal for applications requiring a balanced mix of processing and programmable logic resources.
The programmable logic includes approximately 154k system logic cells, offering flexibility for custom hardware acceleration and parallel processing. It features high-speed connectivity options with up to 24 high-speed transceivers supporting data rates of up to 12.5 Gbps. The device also supports DDR4, LPDDR4, and DDR3 memory interfaces, enhancing system memory bandwidth.
With its VU+ architecture, it provides enhanced performance, power efficiency, and integration, suitable for applications in automotive, industrial, and data center environments. The package is FCBGA with 784 pins, allowing for robust connectivity in compact form factors. This MPSoC is ideal for applications requiring a balanced mix of processing and programmable logic resources.
Pinout
The XCZU3CG-2SFVC784E is a Zynq UltraScale+ MPSoC from Xilinx, and it comes in an FVC784 package. It has a pin count of 784. This device integrates a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 processor, and a Mali-400 MP2 GPU, along with FPGA fabric.
The primary function of the XCZU3CG-2SFVC784E is to serve as a versatile platform for embedded applications that require a mix of high-performance processing, real-time control, and hardware programmability. It is suitable for applications in automotive, industrial, medical, and communication systems.
The pins in this package are allocated for various purposes including power supply, I/O functions, memory interfaces, peripherals, and configuration. Specific pin functions include general-purpose I/Os (GPIOs), high-speed transceiver pins, memory interfaces for DDR4/3, and connections for peripherals like USB, Ethernet, and PCIe. The exact pin configuration can be found in the device's datasheet provided by Xilinx.
The primary function of the XCZU3CG-2SFVC784E is to serve as a versatile platform for embedded applications that require a mix of high-performance processing, real-time control, and hardware programmability. It is suitable for applications in automotive, industrial, medical, and communication systems.
The pins in this package are allocated for various purposes including power supply, I/O functions, memory interfaces, peripherals, and configuration. Specific pin functions include general-purpose I/Os (GPIOs), high-speed transceiver pins, memory interfaces for DDR4/3, and connections for peripherals like USB, Ethernet, and PCIe. The exact pin configuration can be found in the device's datasheet provided by Xilinx.
Manufacturer
The XCZU3CG-2SFVC784E is manufactured by Xilinx, Inc. Xilinx is a technology company known for designing and developing programmable logic devices. Specifically, Xilinx is recognized for its field-programmable gate arrays (FPGAs), adaptive system-on-chips (SoCs), and associated software tools. The company plays a significant role in various industries by providing hardware that can be customized for specific applications, including telecommunications, data centers, automotive, aerospace, and consumer electronics. Xilinx was acquired by Advanced Micro Devices, Inc. (AMD) in 2022, making it part of a larger entity that focuses on semiconductor products and solutions.
Application
The XCZU3CG-2SFVC784E is a Zynq UltraScale+ MPSoC from Xilinx, which integrates a processing system with programmable logic. It is used in various applications including:
1. Embedded Vision: Provides high-performance processing for image and video applications.
2. Industrial Automation: Facilitates real-time processing and control in industrial systems.
3. Automotive: Supports ADAS and infotainment systems with its robust processing capabilities.
4. Communications: Used in base stations, network infrastructure, and wireless communications.
5. Aerospace and Defense: Offers high security and performance for defense systems.
6. Medical Devices: Enables advanced imaging and diagnostic tools.
Its versatility in handling complex processing tasks makes it suitable for diverse, high-performance applications.
1. Embedded Vision: Provides high-performance processing for image and video applications.
2. Industrial Automation: Facilitates real-time processing and control in industrial systems.
3. Automotive: Supports ADAS and infotainment systems with its robust processing capabilities.
4. Communications: Used in base stations, network infrastructure, and wireless communications.
5. Aerospace and Defense: Offers high security and performance for defense systems.
6. Medical Devices: Enables advanced imaging and diagnostic tools.
Its versatility in handling complex processing tasks makes it suitable for diverse, high-performance applications.
Package
The XCZU3CG-2SFVC784E is a Xilinx Zynq UltraScale+ MPSoC device that comes in an FVC784 package type. This indicates a Flip-Chip Ball Grid Array (FCBGA) with 784 pins. It's designed for high-performance applications, integrating processing systems and programmable logic on a single chip.