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XCZU43DR-2FFVE1156I
+BOMIC ZUP RFSOC A53 FPGA 1156BGA
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제조업체AMD
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제조업체 부품 #XCZU43DR-2FFVE1156I
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사양
| 속성 | 가치 |
| Series | Zynq® UltraScale+™ RFSoC |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.333GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
개요
Description
1. Architecture: It combines a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processors, and UltraScale FPGA fabric.
2. RF Capabilities: Equipped with integrated RF data converters, it supports direct RF sampling, which reduces latency and system size by eliminating the need for external data converters.
3. Performance: The device offers high throughput with its programmable logic and utilizes advanced DSP capabilities for efficient data processing.
4. Connectivity: It supports various high-speed interfaces, such as PCIe, Ethernet, and DDR memory, allowing for easy integration into complex systems.
5. Package and Temperature Range: The designation "FFVE1156I" refers to the device's package and its industrial temperature range, making it suitable for robust applications.
Overall, the XCZU43DR-2FFVE1156I is ideal for high-performance, flexible, and scalable RF processing applications.
Equivalent
Features
1. Integration: Combines programmable logic with integrated RF-class analog technology, including multi-gigasample RF data converters.
2. Processing System: Features a 64-bit quad-core Arm Cortex-A53 application processor and a dual-core Arm Cortex-R5 real-time processor.
3. Programmable Logic: Provides over 930,000 system logic cells, offering significant flexibility for custom hardware accelerations.
4. RF Data Converters: Includes 16 integrated RF ADCs and 16 RF DACs, facilitating direct RF signal interfacing, reducing the need for separate components.
5. Memory: Supports DDR4 memory interfaces and offers on-chip UltraRAM.
6. Connectivity: Includes high-speed transceivers, PCIe Gen3, and Ethernet interfaces.
7. Power Efficiency: Designed with power-optimized features suitable for embedded applications.
8. Package: Offered in a 1156-ball Flip-Chip Ball Grid Array (FCBGA) package.
9. Temperature Grade: Industrial temperature range, supporting operation in demanding environments.
This combination of features makes it ideal for applications in wireless communications, radar systems, and other high-performance RF applications.
Pinout
The functions of the XCZU43DR-2FFVE1156I include:
1. Processing System (PS): Provides application processing with dual-core ARM Cortex-A53, real-time processing with dual-core ARM Cortex-R5, and a Mali-400MP2 GPU for graphics.
2. Programmable Logic (PL): Offers FPGA capabilities for custom hardware acceleration and parallel processing.
3. RF Data Converters: Integrates high-speed ADCs and DACs to support RF signal processing directly on-chip.
4. Integrated Peripherals: Includes standard interfaces like USB, Ethernet, and PCIe along with memory interfaces.
These features make it highly versatile for complex embedded system designs that require high levels of integration and performance.
Manufacturer
Application
1. Wireless Communications: For 4G/5G base stations, remote radio heads, and massive MIMO systems.
2. Aerospace and Defense: Used in radar systems, electronic warfare, and secure communications.
3. Test and Measurement: Ideal for high-speed data acquisition and real-time analysis.
4. Broadcasting: Supports digital video broadcasting and signal processing.
5. Medical Imaging: Enhances capabilities in ultrasound and MRI systems.
6. Automotive: Enables advanced driver-assistance systems (ADAS) and V2X communications.
Its integration of processing power with RF capabilities allows for efficient, high-performance solutions across these sectors.