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XCZU48DR-2FFVG1517E
+BOMIC ZUP RFSOC A53 FPGA 1517BGA
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제조업체AMD
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제조업체 부품 #XCZU48DR-2FFVG1517E
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사양
| 속성 | 가치 |
| Series | Zynq® UltraScale+™ RFSoC |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.333GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
개요
Description
The XCZU48DR variant offers high-speed, high-resolution RF data converters, including ADCs and DACs, essential for direct RF sampling. It supports extensive I/O capabilities and high-speed interfaces, which are crucial for data-intensive operations. The device is built on a 16nm FinFET process, optimizing power efficiency and performance. Its package, the FFVG1517, offers substantial pin count to accommodate complex designs.
Overall, the XCZU48DR-2FFVG1517E is suited for advanced digital signal processing, making it a powerful choice for industries requiring integrated processing and data conversion solutions.
Equivalent
Features
1. Integrated RF Data Converters: Includes up to 8 ADCs and 8 DACs, supporting direct RF sampling for high-performance, flexible radio applications.
2. Processing System: Comprises a quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 for efficient control and data processing.
3. Programmable Logic: Utilizes UltraScale+ architecture, offering significant programmable resources for customized hardware acceleration.
4. High-speed Connectivity: Supports high-bandwidth memory interfaces, PCIe Gen3, and gigabit transceivers for robust data throughput.
5. Advanced DSP Capabilities: Incorporates numerous DSP slices, suitable for compute-intensive applications, including digital signal processing tasks.
6. Security Features: Provides design security and safety features essential for protecting sensitive applications.
7. Package: Available in a 1517-ball flip-chip BGA (FFV1517) package for efficient heat dissipation and compact designs.
This RFSoC is ideal for applications in wireless communication, radar systems, and other demanding RF applications.
Pinout
Manufacturer
Application
1. Wireless Communications: Provides high-performance processing for 5G and satellite communications.
2. Radar Systems: Suitable for beamforming and real-time data processing.
3. Medical Imaging: Offers efficient data handling and processing for advanced imaging techniques.
4. Test and Measurement: Used in high-speed data acquisition and analysis.
5. Defense Systems: Supports secure and complex processing tasks.
6. Industrial IoT: Enables edge processing and connectivity in industrial applications.
These applications leverage its integration of analog and digital processing capabilities.