XCZU5EV-2SFVC784I

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XCZU5EV-2SFVC784I

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IC SOC CORTEX-A53 784FCBGA

  • 제조업체AMD Xilinx

  • 제조업체 부품 #XCZU5EV-2SFVC784I

  • 패키지 FBGA-784

  • 재고7560

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사양

속성 가치
Package Tray
Series Zynq® UltraScale+™ MPSoC EV
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAMSize 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 784-BFBGA, FCBGA

개요

Description

The XCZU5EV-2SFVC784I is part of Xilinx's Zynq UltraScale+ MPSoC family, which integrates a feature-rich ARM-based processing system and a programmable logic (FPGA) in a single device. This model specifically includes a quad-core ARM Cortex-A53 processor, a dual-core Cortex-R5 real-time processor, and a Mali-400 MP2 GPU. The XCZU5EV variant also features a high-performance H.264/H.265 video codec unit, making it suitable for applications requiring video processing, such as broadcast, surveillance, and machine vision.
The device is built on a 16nm FinFET process, ensuring high performance and low power consumption. It offers a wide range of connectivity options, including PCIe, USB, and Gigabit Ethernet, alongside ample programmable logic resources for custom hardware acceleration. The "2SFVC784I" part of the model number indicates specific features like speed grade and package type, with "I" denoting industrial temperature range operation. Overall, the XCZU5EV-2SFVC784I is designed for versatility, combining processing power with FPGA flexibility for complex and demanding embedded system applications.

Equivalent

The XCZU5EV-2SFVC784I is a Xilinx Zynq UltraScale+ MPSoC. Equivalent products are typically from other vendors offering similar FPGA and SoC capabilities, such as the Intel (previously Altera) Stratix 10 or Arria 10 SoCs. Other potential equivalents include Lattice Semiconductor's CrossLink-NX family and Microchip's PolarFire SoC FPGA series. Each has distinct features, so direct equivalence depends on specific application requirements like processing power, power consumption, and I/O capabilities.

Features

The XCZU5EV-2SFVC784I is part of Xilinx's Zynq UltraScale+ MPSoC family. Key features include:
1. Architecture: Combines a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processors, and a Mali-400 MP2 GPU for versatile processing capabilities.
2. Programmable Logic: Incorporates a substantial amount of programmable logic, allowing for custom hardware acceleration and adaptability to various applications.
3. Memory Interface: Supports high-speed DDR4 memory interfaces, ensuring fast data access and processing efficiency.
4. Connectivity: Offers a range of connectivity options, including high-speed transceivers, PCIe Gen2, USB 3.0/2.0, and Gigabit Ethernet, facilitating robust communication and data transfer.
5. Integrated Peripherals: Includes a variety of peripherals such as CAN, I2C, SPI, and UART for enhanced flexibility in design.
6. Security: Features advanced security measures, including secure boot and cryptographic engines, enhancing protection against unauthorized access and data breaches.
7. Power Management: Efficient power management features for optimized energy usage.
These features make the XCZU5EV-2SFVC784I well-suited for applications requiring high performance, flexibility, and security, such as in industrial, automotive, and communication sectors.

Pinout

The XCZU5EV-2SFVC784I is a part of the Xilinx Zynq UltraScale+ MPSoC family. This specific model is housed in an SFVC784 package, which is a BGA (Ball Grid Array) with 784 pins.
The XCZU5EV device integrates a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a Mali-400MP2 GPU, along with FPGA fabric. The device features include high-speed transceivers, DDR memory interfaces, and a wide range of peripherals suitable for applications in communications, automotive, and industrial markets.
The 784-pin package provides connections for the following functions:
- Power supply and ground connections
- High-speed transceiver and serial interfaces
- Memory interfaces, including DDR and QSPI
- General-purpose I/O (GPIO) for various peripheral connectivity
- Configuration and control signals
These pins are used to interface the SoC to external devices and systems, and their precise function depends on the configuration and design of the specific application using the device. For detailed pin functions and configurations, refer to the manufacturer's datasheet and user manual.

Manufacturer

The XCZU5EV-2SFVC784I is manufactured by Xilinx, Inc. Xilinx is a technology company that primarily designs and develops programmable logic devices, most notably field-programmable gate arrays (FPGAs). The company is a leader in the development of FPGAs, adaptive system-on-chip (SoC) devices, and associated software tools, which are used in a wide range of applications across various industries, including telecommunications, aerospace, defense, automotive, industrial, and consumer electronics. Xilinx's products enable developers to design custom hardware solutions that can be reprogrammed to meet specific requirements, providing flexibility and adaptability in rapidly evolving technological environments. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a major player in the semiconductor industry, which extended its capabilities in the field of adaptive computing solutions.

Application

The XCZU5EV-2SFVC784I is part of the Xilinx Zynq UltraScale+ MPSoC family, which combines processing systems and programmable logic. Its application areas include:
1. Embedded Vision Systems: Used in industrial and automotive vision for its robust processing capabilities.
2. 5G and Wireless Communications: Supports advanced wireless infrastructure with high-speed data processing.
3. Aerospace and Defense: Offers secure and reliable performance for mission-critical applications.
4. Medical Imaging: Facilitates real-time processing in diagnostic equipment.
5. IoT and Smart Devices: Powers intelligent, connected devices with efficient computation and connectivity features.
6. Broadcast and Pro AV: Used in video processing and encoding for professional audio-visual applications.

Package

The XCZU5EV-2SFVC784I is a System-on-Chip (SoC) package from Xilinx's Zynq UltraScale+ family. It features a Flip-Chip Ball Grid Array (FCBGA) package type with 784 balls. This package integrates both processing systems and programmable logic on a single chip, suitable for high-performance applications.

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