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XCZU9EG-2FFVB1156E
+BOMIC SOC CORTEX-A53 1156FCBGA
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제조업체AMD
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제조업체 부품 #XCZU9EG-2FFVB1156E
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사양
| 속성 | 가치 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Base Product Number | XCZU9 |
개요
Description
The device supports high-speed connectivity options, including PCIe, SATA, and Ethernet, and it is packaged in a 1156-ball Flip-Chip Ball Grid Array (FCBGA). This integration enables developers to build complex systems that need both software programmability and hardware acceleration, ideal for applications in automotive, industrial, telecommunications, and advanced driver-assistance systems (ADAS). The XCZU9EG-2FFVB1156E combines flexibility, scalability, and efficiency, catering to a wide range of system-level design requirements.
Equivalent
Features
1. Processing System (PS):
- Quad-core ARM Cortex-A53 (64-bit) for applications processing.
- Dual-core ARM Cortex-R5 for real-time processing.
- ARM Mali-400 MP2 GPU for graphics processing.
2. Programmable Logic (PL):
- Based on Xilinx's UltraScale architecture, providing robust and flexible logic resources for custom hardware acceleration.
3. Memory:
- DDR4/LPDDR4/DDR3L support for high-bandwidth memory interfaces.
4. Connectivity:
- Multiple high-speed connectivity options, including PCIe, USB 3.0, SATA, and Gigabit Ethernet.
5. DSP and I/O:
- Extensive DSP resources for complex signal processing tasks.
- Wide range of I/O capabilities, supporting various protocols and interfaces.
6. Security Features:
- Hardware root of trust, secure boot, and encryption for data protection.
This device is suitable for applications requiring high-performance computing, real-time processing, and flexible interfacing, such as automotive, industrial, and communications systems.
Pinout
The 1156 pins provide connections for a variety of interfaces and functionalities, including:
1. Power and Ground: A significant number of pins are dedicated to power (VCC, VCCO) and ground (GND) to ensure stable operation and performance.
2. Multi-Gigabit Transceivers (MGTs): Support high-speed communication protocols.
3. Memory Interfaces: Include DDR4/3, LPDDR4/3 for high-performance memory operations.
4. I/O Banks: Configurable for various standard interfaces like SPI, I2C, UART, etc.
5. Configuration Pins: Used for device programming and configuration.
6. Clock Inputs: Critical for synchronous operations within the device.
This multipurpose pin arrangement allows the XCZU9EG-2FFVB1156E to be versatile in applications ranging from communications to embedded systems.
Manufacturer
Application
1. Embedded Systems: Used in complex embedded systems for industrial automation and control.
2. Telecommunications: Ideal for wireless infrastructure and advanced communication systems.
3. Automotive: Powers advanced driver-assistance systems (ADAS) and infotainment.
4. Aerospace and Defense: Suitable for radar, signal processing, and avionics.
5. Medical Equipment: Enables real-time processing in medical imaging and diagnostics.
6. Artificial Intelligence: Supports AI workloads with accelerated processing for machine learning applications.
Its combination of ARM processing power and FPGA programmability makes it versatile for numerous high-performance, compute-intensive applications.