XE167FM72F80LRABKXUMA1

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XE167FM72F80LRABKXUMA1

+BOM

IC MCU 16BIT 576KB FLASH 144LQFP

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Package / Case Tape & Reel (TR),Cut Tape (CT)
Series XE16x
Part Status Not For New Designs
Core Processor C166SV2
Core Size 16-Bit
Speed 80MHz
Connectivity CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals I²S, POR, PWM, WDT
Number of I/O 119
Program Memory Size 576KB (576K x 8)
Program Memory Type FLASH
RAM Size 50K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 24x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount

개요

Description

The XE167FM72F80LRABKXUMA1 is a microcontroller unit (MCU) within Infineon's XE166 family, designed for demanding automotive and industrial applications. It features a 16-bit architecture with high-performance capabilities, suitable for real-time control systems. The microcontroller boasts an effective processing speed due to its 80 MHz CPU frequency and advanced peripherals, including PWM units, ADCs, and communication interfaces like CAN and UART.
This MCU is built to handle complex tasks with its extended memory options, including both on-chip Flash and RAM, aiding larger data processing and program execution. The XE167FM72F80LRABKXUMA1 also supports efficient power management, making it ideal for low-power applications.
Designed with robust architecture and extensive I/O configurations, it provides reliable solutions for automotive applications such as engine management, transmission control, and safety systems, as well as for industrial automation and control. The microcontroller is known for its reliability, scalability, and efficient performance, contributing to optimized system designs.

Equivalent

The XE167FM72F80LRABKXUMA1 is a microcontroller by Infineon, part of the XE166 series. Equivalent products could include other microcontrollers from similar performance tiers and feature sets by manufacturers like STMicroelectronics (such as STM32 series), NXP (LPC series), or Microchip (PIC32 or AVR series). Specific equivalents would need to match the XE167's specifications, including memory, processing speed, and peripheral compatibility, and would require a detailed comparison based on application needs.

Features

The XE167FM72F80LRABKXUMA1 is part of Infineon's XE166 family of microcontrollers, designed for real-time control applications. Key features include:
1. CPU and Performance: It has a 16-bit C166S V2 core with a maximum clock frequency of 80 MHz, providing fast computing capability for demanding tasks.
2. Memory: The microcontroller includes up to 576 KB of Flash memory and 82 KB of RAM, which supports extensive code and data storage.
3. Peripherals: It features a variety of peripherals including multiple timers, a 16-channel, 10-bit ADC, and PWM units, which are essential for precise control applications.
4. Communication Interfaces: The device supports multiple communication protocols, including CAN, UART, SPI, and I2C, offering versatile connectivity options.
5. Power and Efficiency: With integrated power management features, it ensures low power consumption, making it suitable for power-sensitive applications.
6. Temperature Range: It operates reliably under a wide temperature range, which is crucial for automotive and industrial environments.
These features make it ideal for automotive and industrial control systems requiring robust and efficient processing capabilities.

Pinout

The XE167FM72F80LRABKXUMA1 is a microcontroller from Infineon's XE166 family, which is commonly used in automotive and industrial applications. It typically comes in a package with a pin count of 144. The microcontroller is designed for high-performance real-time control applications and offers features such as:
1. CPU: Equipped with a 16-bit C166S V2 CPU core, providing high efficiency and performance.
2. Memory: It includes on-chip Flash memory and RAM for program and data storage.
3. Timers: Multiple timer units for precise control and timing functions.
4. Communication Interfaces: Supports various communication protocols such as UART, CAN, and SPI for connectivity.
5. Analog/Digital Conversion: Includes ADC units for converting analog signals to digital data.
6. Power Management: Features low-power modes to optimize energy consumption.
7. I/O Ports: Multiple programmable I/O ports for interfacing with external devices.
These features make the XE167FM72F80LRABKXUMA1 suitable for complex embedded system designs, offering a balance between performance and flexibility for various control and automation tasks.

Manufacturer

The XE167FM72F80LRABKXUMA1 is manufactured by Infineon Technologies. Infineon Technologies is a German semiconductor manufacturer that specializes in producing a wide range of semiconductor solutions. The company focuses on automotive, industrial power control, power management and multimarket, and digital security solutions. Infineon develops products that are used in various applications, including automotive electronics, communication technology, consumer electronics, and security systems. As a leading global player in the semiconductor industry, Infineon is known for its innovation and commitment to providing energy-efficient and sustainable technology solutions.

Application

The XE167FM72F80LRABKXUMA1 is a microcontroller from Infineon's XE166 family, designed for automotive and industrial applications. Key application areas include automotive control systems such as engine management, transmission control, and chassis control, due to its robust performance and reliability. Additionally, it is used in industrial automation, motor control, and power conversion systems, benefiting from its high-speed processing and extensive peripheral set. The microcontroller's features like integrated DSP functionality, multiple communication interfaces, and advanced safety features also make it suitable for real-time control applications in various embedded systems.

Package

The XE167FM72F80LRABKXUMA1 is a microcontroller from Infineon's XE166 family. It typically comes in a LQFP (Low-Profile Quad Flat Package) package type. This package is known for surface mounting and provides a compact form factor suitable for embedded applications.

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