Part A
ADF4001BCPZ
아날로그 디바이스(주)
- Lifecycle
- Active
- Stock
- 1703 PCS
- Package
- WFQFN-20
- Series
- 클럭 타이밍 - 클럭 발생기, PLL, 주파수 합성기
Replacement verdict
Compatible functional replacement candidate
The ADF4001BCP and ADF4001BCPZ are functionally equivalent PLL frequency synthesizer ICs sharing the same core, package, and pinout; the only distinction is the Pb-free/RoHS-compliant molding compound and finish of the BCPZ suffix. Both are direct drop-in replacements for one another in existing designs, with the BCPZ variant preferred for new designs requiring RoHS compliance.
Function and Core Architecture
High match
Package and Pinout
High match
Electrical Specifications
High match
RoHS and Finish Compliance
Validation required
Parts at a glance
Part B
ADF4001BCP
아날로그 디바이스(주)
- Lifecycle
- Active
- Stock
- 4879 PCS
- Package
- WFQFN-20
- Series
- 클럭 타이밍 - 클럭 발생기, PLL, 주파수 합성기
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | ADF4001BCPZ | ADF4001BCP | Why it matters |
|---|---|---|---|
| Manufacturer | Analog Devices Inc. | Analog Devices Inc. | Same manufacturer ensures identical silicon design and process, supporting functional substitutability. |
| Function | 200 MHz Clock Generator PLL Frequency Synthesizer | 200 MHz Clock Generator PLL Frequency Synthesizer | Identical core function confirms the parts serve the same role in a PLL/synthesizer circuit. |
| Package / Case | 20-WFQFN Exposed Pad, CSP | 20-LFCSP (20-Lead Frame Chip Scale Package) | Both are 20-lead LFCSP/WFQFN packages, so the PCB footprint is compatible for drop-in substitution. |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V | Matching supply range means the same power rail can drive either device without redesign. |
| Maximum Operating Frequency | 200 MHz | 200 MHz | Identical RF bandwidth ensures equivalent synthesizer performance in the target application. |
| Number of Pins | 20 | 20 | Same pin count supports pin-to-pin compatibility on the PCB. |
| Mounting Type | Surface Mount | Surface Mount | Both are surface-mount devices, consistent with modern SMT assembly processes. |
| RoHS / Lead-Free Status | RoHS Compliant, Lead-Free | RoHS Compliant (Pb-free version indicated by Z suffix) | The "Z" suffix denotes the lead-free/RoHS-compliant variant; both are RoHS compliant, but the suffix distinguishes the exact ordering code. |
| Operating Temperature Range | -40 °C to +85 °C | -40 °C to +85 °C | Identical temperature ratings ensure equivalent reliability across the same environmental conditions. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | ADF4001BCPZ | ADF4001BCP |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC |
| Part Status | Active | Obsolete |
| Type | Clock Generator (RF) | Clock Generator (RF) |
| PLL | Yes | Yes |
| Input | CMOS, TTL | Clock |
| Output | Clock | Clock |
| Ratio - Input: Output | 2:1 | 2:1 |
| Differential - Input: Output | Yes/No | Yes/No |
| Frequency - Max | 200MHz | 200MHz |
| Divider / Multiplier | Yes/No | Yes/No |
| Voltage - Supply | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
| Mounting Type | Surface Mount | Surface Mount |
| Number of Circuits | 1 | - |
| Operating Temperature | -40°C ~ 85°C | - |
Frequently asked questions
What is the difference between the ADF4001BCPZ and the ADF4001BCP?
The ADF4001BCPZ and ADF4001BCP are functionally identical phase-locked loop (PLL) synthesizer ICs. The primary difference is the package finish/lead plating designation: the "Z" suffix in ADF4001BCPZ denotes a RoHS-compliant, lead-free (Pb-free) package, while the ADF4001BCP is the non-RoHS, lead-containing (Pb) version. Both are offered in a 20-lead LFCSP package.
Are the ADF4001BCPZ and ADF4001BCP electrically interchangeable?
Yes. Both devices share the same silicon die, functional block diagram, and electrical specifications, including the 200 MHz maximum RF input frequency, programmable reference divider, and phase/frequency detector characteristics. The only difference is the package plating material, so they are electrically interchangeable in the same circuit.
Do the ADF4001BCPZ and ADF4001BCP have the same package and pinout?
Yes. Both parts are supplied in the same 20-lead LFCSP (lead frame chip scale package) with identical pin assignments and the same PCB land pattern. The package outline and pin functions are unchanged between the two versions.
Which version should be selected for RoHS-compliant designs?
The ADF4001BCPZ should be selected for RoHS-compliant designs, as its "Z" suffix indicates lead-free, RoHS-compliant construction. The ADF4001BCP is the non-RoHS version and is not suitable where RoHS compliance is required.
Can the ADF4001BCPZ be used as a drop-in replacement for the ADF4001BCP?
Yes, in most cases the ADF4001BCPZ can be used as a drop-in replacement for the ADF4001BCP because the electrical function, package, and pinout are identical. The substitution should be validated against the target design's RoHS and soldering process requirements, since the lead-free finish may require adjusted reflow profiles.
What is the maximum RF input frequency of the ADF4001BCPZ and ADF4001BCP?
Both the ADF4001BCPZ and ADF4001BCP support a maximum RF input frequency of 200 MHz, as specified in the manufacturer datasheet for the ADF4001 family.
Do both versions share the same supply voltage and current specifications?
Yes. Both devices operate from a 2.7 V to 5.5 V supply and share the same current consumption and logic interface specifications, since they are the same silicon device differing only in package plating.
Why does the "Z" suffix matter for procurement and compliance?
The "Z" suffix identifies the RoHS-compliant, lead-free variant. Procurement and compliance teams use this suffix to distinguish the Pb-free part (ADF4001BCPZ) from the leaded part (ADF4001BCP) when verifying material declarations, RoHS status, and soldering process compatibility.