BGM220SC22WGA2R

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BGM220SC22WGA2R

+BOM

WIRELESS GECKO, BLUETOOTH SIP MO

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Package / Case Tape & Reel (TR),Cut Tape (CT)
Part Status Active
RF Family / Standard Bluetooth
Protocol Bluetooth v5.2
Modulation GFSK
Frequency 2.4GHz ~ 2.4835GHz
Data Rate 2Mbps
Power - Output 6dBm
Sensitivity -106.4dBm
Serial Interfaces ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART
Antenna Type Integrated, Chip
Utilized IC / Part EFR32BG22
Memory Size 352kB Flash, 32kB RAM
Voltage - Supply 1.8V ~ 3.8V
Current - Receiving 4.2mA ~ 4.8mA
Current - Transmitting 4.6mA ~ 8.8mA
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)

개요

Description

The BGM220SC22WGA2R is a compact, energy-efficient wireless module designed for Bluetooth Low Energy (BLE) applications. Part of Silicon Labs' BGM220S series, this module is engineered to support IoT devices requiring reliable and robust Bluetooth connectivity. It features an integrated ARM Cortex-M33 processor, providing sufficient computational power for various applications while maintaining low power consumption.
The module operates in the 2.4 GHz frequency band, supporting Bluetooth 5.2 features, which include enhanced data rates, long-range capabilities, and improved security. It is suitable for applications like smart home devices, wearable technology, health and fitness trackers, and industrial sensors.
The BGM220SC22WGA2R's compact form factor makes it ideal for space-constrained designs. It also offers extensive development support, including software tools and resources from Silicon Labs, which facilitate rapid prototyping and product development. This module is designed to help developers create efficient, scalable BLE solutions with minimal hardware design effort.

Equivalent

The BGM220SC22WGA2R is a wireless microcontroller from Silicon Labs, designed for Bluetooth applications. Equivalent products include:
1. Nordic Semiconductor's nRF52833 - a versatile SoC for Bluetooth 5.1.
2. Texas Instruments' CC2640R2F - a wireless MCU supporting Bluetooth 5.0.
3. STMicroelectronics' BlueNRG-LP - a Bluetooth 5.2 SoC.
4. Microchip's RN4871 - a Bluetooth 4.2 module.
These alternatives may differ slightly in specifications but serve similar applications in Bluetooth connectivity. Always compare detailed specs for compatibility.

Features

The BGM220SC22WGA2R is a compact, wireless Bluetooth module designed for IoT applications. Key features include:
1. Bluetooth Low Energy (BLE) 5.2: Provides robust, energy-efficient connections ideal for battery-powered devices.
2. Processor: Powered by an ARM Cortex-M33 core, offering efficient processing capabilities for various applications.
3. Memory: Equipped with sufficient Flash and RAM to support complex applications and firmware upgrades.
4. Size: Compact form factor facilitating integration into space-constrained designs.
5. Power Efficiency: Designed for low power consumption, extending the battery life of IoT devices.
6. Security: Features hardware-based security measures such as Secure Boot and TrustZone architecture, ensuring secure data transmission and device operation.
7. Antenna Options: Comes with an onboard antenna for streamlined connectivity.
8. Development Support: Compatible with Silicon Labs' software tools and development kits, facilitating rapid development and deployment.
9. Operating Range: Suitable for use in various environments with a decent range conducive to IoT applications.
These features make the BGM220SC22WGA2R suitable for a range of IoT products, including smart home devices, wearables, and industrial applications.

Pinout

The BGM220SC22WGA2R is a Bluetooth module from Silicon Labs. It is part of the BGM220S series, which is designed for ultra-low-power Bluetooth Low Energy (BLE) applications. The module typically features a 32-pin configuration. Key functions of this module include:
1. Bluetooth Connectivity: Provides BLE 5.2 connectivity for wireless communication.
2. Processor: Equipped with an Arm Cortex-M33 core for efficient processing.
3. Memory: Includes flash memory and RAM for application storage and execution.
4. Security Features: Offers secure boot and debug security features.
5. Peripherals and Interfaces: Supports various interfaces like I2C, SPI, UART, and GPIOs for connecting with other devices and sensors.
6. Low Energy Consumption: Designed for battery-powered applications with optimized power management.
These features make the BGM220SC22WGA2R suitable for IoT devices, wearables, and other applications requiring reliable BLE connectivity and low power operation. For detailed specifications, referring to the datasheet is recommended.

Manufacturer

The BGM220SC22WGA2R is manufactured by Silicon Labs. Silicon Labs is a semiconductor company that specializes in developing and producing integrated circuits (ICs), microcontrollers, and other components for various electronic devices and applications. The company is known for its focus on providing solutions for the Internet of Things (IoT), industrial automation, consumer electronics, and other connected device markets. Silicon Labs is headquartered in Austin, Texas, and is recognized for its innovation in wireless technology and embedded systems.

Application

The BGM220SC22WGA2R is a Bluetooth module designed for IoT applications. Its application areas include:
1. Smart Home Devices: Supports connectivity for appliances, lighting, and security systems.
2. Wearable Technology: Used in fitness trackers, smartwatches, and health monitoring devices.
3. Asset Tracking: Facilitates location tracking and management of goods and equipment.
4. Industrial IoT: Enables connectivity for sensors and machinery monitoring.
5. Personal Medical Devices: Supports wireless communication in health monitoring equipment.
6. Consumer Electronics: Enhances connectivity in audio devices and remote controls.
7. Building Automation: Used in HVAC systems and smart lighting controls.
These application areas leverage its low power consumption and robust Bluetooth connectivity.

Package

The BGM220SC22WGA2R is a compact, surface-mount package type known as a WLCSP (Wafer Level Chip Scale Package). It is designed for space-constrained applications and offers efficient performance for Bluetooth communication, particularly in IoT devices.

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