BGM240PA22VNA3

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BGM240PA22VNA3

+BOM

RF TXRX MOD BLUETOOTH CHIP SMD

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사양

속성 가치
Part Status Active
Base Product Number BGM240
Digi Key Programmable Not Verified
RF Family / Standard Bluetooth
Protocol Bluetooth v5.4
Modulation GFSK
Frequency 2.4GHz
Data Rate 2Mbps
Power - Output 10dBm
Sensitivity -106.5dBm
Serial Interfaces GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART
Antenna Type Integrated, Chip
Utilized IC / Part EFR32BG24
Memory Size 1.5MB Flash, 256kB RAM
Voltage - Supply 1.8V ~ 3.8V
Current - Receiving 4.5mA ~ 5.2mA
Current - Transmitting 4.8mA ~ 154.8mA
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TA)
Package / Case 36-SMD Module

개요

Description

The BGM240PA22VNA3 is a Bluetooth Low Energy (BLE) module developed by Silicon Labs, designed for IoT applications requiring low power consumption and reliable wireless connectivity. This module features an integrated EFR32BG22 SoC, which combines a high-performance ARM Cortex-M33 processor, efficient power management, and a variety of peripherals to facilitate quick development and deployment.
Key features include a compact footprint, low energy consumption (ideal for battery-operated devices), and support for Bluetooth 5.0, enabling longer range and higher data rates. The BGM240PA22VNA3 also offers a range of interfaces, including GPIO, I2C, SPI, and UART, making it versatile for different applications.
With robust security features such as hardware-based security and encryption, it is well-suited for applications in smart home devices, wearables, health monitoring, and industrial automation. The module is supported by Silicon Labs’ development tools and software stack, simplifying integration into various user projects.

Equivalent

The BGM240PA22VNA3 chip is a Bluetooth Low Energy (BLE) module based on the EFR32BG series. Equivalent products include the Nordic Semiconductor nRF52832, Texas Instruments CC2640R2F, and Silicon Labs EFR32MG21. These alternatives offer similar BLE capabilities, processing power, and are suitable for IoT applications. Ensure to check specific features and compatibility before selection.

Features

The BGM240PA22VNA3 is a low-energy Bluetooth module designed for IoT applications. Key features include:
1. Compact Design: Small form factor suitable for space-constrained devices.
2. Low Power Consumption: Optimized for battery-operated applications, extending operational life.
3. Integrated Antenna: Built-in antenna simplifies design and reduces overall footprint.
4. High Performance: Supports Bluetooth 5.0, enabling higher data rates and improved range.
5. Flexible Connectivity: Compatible with various wireless protocols for diverse applications.
6. Onboard Flash Memory: Allows for firmware updates and storage of application data.
7. Secure Connections: Enhanced security features to protect data and connections.
8. Development Support: Access to comprehensive SDKs and development tools for easy integration.
9. Wide Operating Temperature Range: Suitable for various environments and applications.
This module is ideal for smart home devices, wearable technology, and industrial automation, offering a reliable solution for wireless connectivity.

Pinout

The BGM240PA22VNA3 is a Bluetooth low energy (BLE) module from Silicon Labs. It features a 20-pin interface. The module integrates a microcontroller, radio, and power amplifier, providing a compact solution for IoT applications.
Pin Functions Overview:
1. Power Supply (VDD, GND): Connects to power supply and ground.
2. Antenna (ANT): External antenna connection for wireless communication.
3. GPIO (General Purpose Input/Output): Configurable pins for various digital I/O functions.
4. UART (TX, RX): Provides serial communication interface.
5. I2C/SPI: Interfaces for connecting sensors and peripherals.
6. RESET: Resets the module.
7. SWDIO, SWCLK: Used for programming and debugging the module.
8. ADC: Analog-to-digital converter input for sensor data.
9. Capacitive Touch: Supports capacitive touch functionality.
This module is suitable for applications in smart homes, wearables, and other IoT devices.

Manufacturer

The BGM240PA22VNA3 is manufactured by Silicon Labs, a company known for its expertise in semiconductors and microcontrollers. Silicon Labs specializes in providing a wide range of products, including wireless connectivity solutions, microcontrollers, sensors, and software.
Founded in 1996 and headquartered in Austin, Texas, Silicon Labs focuses on developing innovative technologies that enable a variety of applications, particularly in the Internet of Things (IoT), consumer electronics, and industrial markets. The company is recognized for its low-power wireless solutions, which include Bluetooth, Zigbee, and other protocols, catering to the growing demand for connected devices.
Silicon Labs is also known for its commitment to quality and performance, making it a prominent player in the semiconductor industry. Its products are widely used in various sectors, including smart home devices, wearable technologies, and healthcare applications, demonstrating its impact on modern technology and connectivity.

Application

The BGM240PA22VNA3 is a Bluetooth Low Energy (BLE) module designed for various IoT applications. Key application areas include smart home devices, wearables, health monitoring systems, industrial automation, and remote sensor networks. It is suitable for any application requiring low power consumption, reliable wireless communication, and seamless connectivity. Additional uses encompass smart energy management, asset tracking, and Bluetooth-enabled consumer electronics, making it versatile for both consumer and industrial markets.

Package

The BGM240PA22VNA3 is packaged in a 22-pin QFN (Quad Flat No-lead) format. This compact, surface-mount package is designed for low-profile applications and facilitates efficient thermal dissipation and electrical performance.

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