이미지는 참조용입니다.
FDZ191P
+BOMMOSFET P-CH 20V 3A 6WLCSP
-
제조업체온세미
-
제조업체 부품 #FDZ191P
-
재고2168
365 1일 품질 보증
7*24 영업 시간 서비스 보증
90-판매 후 1일 보증
정품 보증
사양
| 속성 | 가치 |
| Supplier | onsemi |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Series | PowerTrench® |
| Part Status | Obsolete |
| FET Type | P-Channel |
| Technology | MOSFET (Metal Oxide) |
| Drain to Source Voltage (Vdss) | 20 V |
| Current - Continuous Drain(Id) @ 25°C | 3A (Ta) |
| Drive Voltage(Max Rds On Min Rds On) | 1.5V, 4.5V |
| Rds On(Max) @ Id Vgs | 85mOhm @ 1A, 4.5V |
| Vgs(th)(Max) @ Id | 1.5V @ 250µA |
| Gate Charge(Qg)(Max) @ Vgs | 13 nC @ 10 V |
| Vgs(Max) | ±8V |
| Input Capacitance(Ciss)(Max) @ Vds | 800 pF @ 10 V |
| Power Dissipation (Max) | 1.9W (Ta) |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Supplier Device Package | 6-WLCSP (1x1.5) |
개요
Description
FDZ191P isn’t a universally recognized standard—the meaning depends on the context (e.g., electronics part number, software build, device model). If you share the domain or a link/spec sheet, I can draft a precise intro.
Generic intro template you can use:
FDZ191P is a [manufacturer] [device/part] designed for [purpose]. Key specs: [voltage/current], interface [e.g., I2C/SPI], package [type]. Typical applications include [areas]. It differs from related models by [notable feature/improvement].
Generic intro template you can use:
FDZ191P is a [manufacturer] [device/part] designed for [purpose]. Key specs: [voltage/current], interface [e.g., I2C/SPI], package [type]. Typical applications include [areas]. It differs from related models by [notable feature/improvement].
Application
I’m not sure what FDZ191P refers to (device type/manufacturer). Please specify the exact category (e.g., transistor/MOSFET, IC sensor, capacitor, RF component). Once clarified, I’ll provide precise applications. For quick guidance by common types:
- Power device (MOSFET/IGBT): switching power supplies, motor drives, DC-DC converters.
- Sensor/MEMS: automotive safety, industrial automation, consumer electronics.
- RF/IC components: wireless communications, RF front-ends, base stations.
- Passive/discrete (diodes, capacitors): decoupling, rectification, filtering.
Share the exact part so I can tailor the applications precisely.
- Power device (MOSFET/IGBT): switching power supplies, motor drives, DC-DC converters.
- Sensor/MEMS: automotive safety, industrial automation, consumer electronics.
- RF/IC components: wireless communications, RF front-ends, base stations.
- Passive/discrete (diodes, capacitors): decoupling, rectification, filtering.
Share the exact part so I can tailor the applications precisely.
Package
FDZ191P isn’t a widely recognized part number; the package type depends on the manufacturer. Please provide the maker or a datasheet/link, or the full part variant (e.g., FDZ191P-xxx) so I can confirm the exact package (SOP, QFN, TO-220, etc.).
