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H57V2562GTR-75C

Name: H57V2562GTR-75C
Rating: 4.8 (15 reviews)

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제조업체 부품 #H57V2562GTR-75C
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사양

속성	가치
Manufacturer	SK HYNIX
Package / Case	TSOP-54-10.2mm

개요

Description

The H57V2562GTR-75C is a type of DRAM (Dynamic Random Access Memory) module manufactured by Hynix Semiconductor. This chip is primarily used in computing environments that require efficient data storage and retrieval, such as in personal computers, servers, and other digital devices. The specifications typically include a memory capacity of 256 Megabits organized into 8M x 8 banks, which allows for high data bandwidth and reliable performance.
Operating at a speed of 7.5 ns, it provides a balance between performance and power efficiency. The "-75C" in its designation indicates that this model is designed to function optimally at a specified temperature range and speed rating. It uses a 3.3V power supply, which is standard for many DRAM modules, ensuring compatibility with a wide range of systems. The H57V2562GTR-75C also supports various refresh modes and self-refresh capability to maintain data integrity and optimize performance.
This DRAM is suitable for applications requiring robust memory solutions and is known for its durability and reliability.

Equivalent

The H57V2562GTR-75C is a DRAM chip. Equivalent products are those with similar specifications, such as size (256M), speed (133 MHz or 7.5 ns), and type (DDR SDRAM). Some potential equivalents include:
1. Samsung K4H561638J-75C
2. Micron MT46V32M16
3. Elpida EDD5116AATA-7F
These components are generally used in similar applications and share comparable performance characteristics. Always verify compatibility with your specific application before substitution.

Features

The H57V2562GTR-75C is a DRAM memory component known for its specific features that make it suitable for various applications. Key features include:
1. Type and Density: It's a 256Mb DDR SDRAM, offering ample storage capacity for data-intensive operations.

2. Speed and Performance: Operates at 133 MHz with a clock cycle time of 7.5 ns, ensuring fast data access and high performance.
3. Voltage: This chip works with a power supply voltage of 3.3V, making it efficient for use in multiple electronic devices.
4. Interface: The DDR interface allows for high-speed data processing and transfer.
5. Packaging: It comes in a compact TSOP II package, which is suitable for space-constrained designs.
6. Temperature Range: The component is designed to operate within a commercial temperature range, making it reliable for standard operating environments.
These features make the H57V2562GTR-75C a versatile and efficient choice for various computing and electronic applications.

Pinout

The H57V2562GTR-75C is a DRAM chip manufactured by Hynix. It typically has a pin count of 54, which is common for TSOP (Thin Small Outline Package) configurations used in these types of memory chips. This DRAM chip is organized as 32M x 8, which means it has a total memory capacity of 256 Megabits.
The primary functions of the H57V2562GTR-75C include data storage and retrieval. It is used in various electronic devices to provide volatile memory that can be quickly accessed by the system's processor. The chip supports essential operations such as reading, writing, and refreshing data.
The "75C" in the model number typically indicates its speed grade, with "75" denoting a 7.5 ns cycle time, which corresponds to a memory clock speed of approximately 133 MHz. The "C" often specifies the temperature range or package option.
For detailed specifications and usage, one should refer to the manufacturer's datasheet, as it will provide comprehensive information on pin configurations, electrical characteristics, and operational guidelines.

Manufacturer

The H57V2562GTR-75C is a DRAM chip manufactured by SK Hynix. SK Hynix is a South Korean company that specializes in the production of semiconductor memory chips. It is one of the leading companies in the global semiconductor industry, particularly known for its development and supply of DRAM and NAND flash memory products. SK Hynix provides memory solutions for a wide range of electronic devices, including computers, mobile devices, servers, and more. It is recognized as one of the top memory manufacturers in the world, competing with other major companies like Samsung and Micron Technology.

Application

The H57V2562GTR-75C is a DRAM memory chip, commonly used in applications requiring volatile memory solutions. Key areas include:
1. Consumer Electronics: Used in devices like digital cameras, smartphones, and gaming consoles for temporary data storage and processing.
2. Computing: Utilized in PCs and laptops for efficient multitasking and quick data retrieval.
3. Networking Equipment: Supports data buffering and caching in routers and switches.
4. Embedded Systems: Offers memory solutions for industrial automation and IoT devices for real-time processing.
5. Automotive Electronics: Used in infotainment systems and advanced driver-assistance systems (ADAS).
These applications benefit from its high-speed data access and low power consumption.

Package

The H57V2562GTR-75C is a DRAM package. Specifically, it is a DDR SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) chip, and it typically comes in a TSOP (Thin Small Outline Package).

Frequently Asked Questions

Q: What is the specific memory type of the H57V2562GTR-75C?
A: It is a 256Mb DDR SDRAM, specifically organized as 16 Meg x 16 I/Os, commonly used in memory modules or embedded systems.

Q: What is the speed grade of this SK Hynix component?
A: The "-75C" suffix indicates a speed grade of 133MHz (7.5ns cycle time) at CAS latency of 3 (CL3).

Q: What package form factor does the H57V2562GTR-75C use?
A: It uses a 54-pin TSOP-II package with a 10.2mm body width, suitable for standard PCB layouts.

Q: Is this part compatible with 2.5V or 3.3V power supply?
A: It operates on a standard 2.5V VDD supply, with 1.8V or 1.9V for memory reference voltage (VREF).

Q: Can this component be used for legacy DDR1 memory upgrades?
A: Yes, it is designed for DDR SDRAM applications, ideal for replacing or designing DDR1-based systems in networking or consumer electronics.

Q: What is the typical operating temperature range for this memory chip?
A: Based on its commercial grade, it supports a 0°C to 70°C operating temperature range, though verify with SK Hynix documentation.