H5TQ2G63GFR-TEC

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H5TQ2G63GFR-TEC

+BOM

  • 제조업체SK하이닉스

  • 제조업체 부품 #H5TQ2G63GFR-TEC

  • 재고6300

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Manufacturer SK HYNIX
Package / Case FBGA-96
Voltage - Supply 1.425V~1.575V
Operating Temperature -40℃~+95℃
Memory Format SDRAM DDR3
Supply Current 40mA

개요

Description

H5TQ2G63GFR-TEC is a specific model of DRAM (Dynamic Random Access Memory) produced by Samsung. It typically belongs to the DDR4 (Double Data Rate 4) memory family, known for high performance and energy efficiency compared to earlier DDR versions. This memory module is commonly used in various applications, including personal computers, laptops, and servers, providing improved speed and capacity.
Key features of H5TQ2G63GFR-TEC include a data rate of up to 2400 MT/s (Mega Transfers per second), a 64-bit data width, and support for various memory configurations. It operates at a low voltage of around 1.2V, which contributes to lower power consumption and heat generation.
This model is designed to enhance overall system performance, making it suitable for gaming, content creation, and multitasking environments. Overall, H5TQ2G63GFR-TEC represents a balance of efficiency and performance in modern memory technology.

Equivalent

The H5TQ2G63GFR-TEC chip is a 2GB DDR2 SDRAM memory chip. Equivalent products include the H5TQ2G63CFR, H5TQ2G63BFR, and other DDR2 SDRAM chips with similar specifications (2GB capacity, DDR2 technology, and compatible timing parameters). Always consult specific datasheets for exact pin configurations and electrical characteristics before substituting.

Features

The H5TQ2G63GFR-TEC is a 2GB DDR3 SDRAM memory chip designed for use in various electronic applications. Key features include:
1. Capacity: 2GB, providing adequate memory for general computing tasks.
2. Type: DDR3 SDRAM, which offers improved speed and efficiency compared to earlier DDR versions.
3. Speed: Operating at a data rate of 1066 MT/s (megatransfers per second), supporting various performance needs.
4. Voltage: Operates at a low voltage of 1.5V, enhancing energy efficiency and reducing power consumption.
5. Organization: Configured as 256 Meg x 8 bits, facilitating easy integration into devices.
6. Package Type: Available in a small, surface-mount FBGA package, allowing for compact design in electronic devices.
7. Temperature Range: Designed for standard operating temperatures, suitable for consumer electronics.
This memory chip is ideal for applications in laptops, desktops, and embedded systems, providing reliable performance for multitasking and data-intensive applications.

Manufacturer

The H5TQ2G63GFR-TEC is manufactured by SK hynix, a South Korean semiconductor company. SK hynix is one of the world's largest manufacturers of memory chips, including dynamic random-access memory (DRAM) and NAND flash memory. The company was established in 1983 and has since grown to be a significant player in the global semiconductor market, providing memory solutions for various applications such as personal computers, mobile devices, and servers. SK hynix is known for its focus on innovation and research and development in memory technology, aiming to deliver high-performance and energy-efficient products. In addition to memory chips, SK hynix is involved in the development of advanced semiconductor technologies and solutions to support the evolving needs of the digital and data-driven world.

Application

The H5TQ2G63GFR-TEC is a 2Gb DDR2 SDRAM memory chip, primarily used in various electronics due to its high-speed data transfer capabilities. Applications include:
1. Consumer Electronics: Used in smartphones, tablets, and laptops.
2. Networking Equipment: Integrated into routers and switches for efficient data handling.
3. Gaming Consoles: Supports high-performance graphics and gaming applications.
4. Automotive Systems: Utilized in advanced driver-assistance systems (ADAS).
5. Industrial Applications: Employed in robotics and automation systems.
Its versatility and efficiency make it suitable for a wide range of applications requiring reliable memory solutions.

Package

The H5TQ2G63GFR-TEC is typically packaged in a 48-ball TFBGA (Thin Fine Ball Grid Array) form factor. This package type is designed for compactness and efficient thermal performance, commonly used in mobile and portable devices.

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