IRFR5410PBF

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IRFR5410PBF

+BOM

MOSFET P-CH 100V 13A DPAK

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Package / Case Tube
Series HEXFET®
Part Status Discontinued at Digi-Key
FET Type P-Channel
Technology MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 100 V
Current - Continuous Drain(Id) @ 25°C 13A (Tc)
Drive Voltage(Max Rds On Min Rds On) 10V
Rds On(Max) @ Id Vgs 205mOhm @ 7.8A, 10V
Vgs(th)(Max) @ Id 4V @ 250µA
Gate Charge(Qg)(Max) @ Vgs 58 nC @ 10 V
Vgs(Max) ±20V
Input Capacitance(Ciss)(Max) @ Vds 760 pF @ 25 V
Power Dissipation (Max) 66W (Tc)
Operating Temperature -55°C ~ 150°C (TJ)
Mounting Type Surface Mount
Supplier Device Package D-Pak

개요

Equivalent

Equivalent products to the IRFR5410PBF (P-channel MOSFET, -100V, -33A) include:
- IRFR5410TRPBF (same specs, tape & reel packaging)
- IRFR5410PbF (lead-free variant)
- IRF9Z34N (similar specs, -55V, -19A)
- IRF4905 (-55V, -74A, higher current)
- STP80PF55 (-55V, -80A, higher current)
Check datasheets for exact compatibility in your circuit.

Pinout

The IRFR5410PBF is a Power MOSFET with 3 pins in a TO-252 (DPAK) package.
Pin Functions:
1. Gate (G) – Controls the MOSFET's switching.
2. Drain (D) – Connects to the load (high-voltage side).
3. Source (S) – Connects to ground (low-voltage side).
Key Specs:
- VDS: -100V (P-Channel)
- ID: -23A (continuous)
- RDS(on): 0.077Ω (max @ VGS = -10V)
Used in power switching, DC-DC converters, and motor control.

Application

The IRFR5410PBF, a P-channel MOSFET, is commonly used in:
1. Power Management – Switching regulators, DC-DC converters.
2. Motor Control – H-bridge circuits, driver modules.
3. Load Switching – Power distribution in automotive, industrial systems.
4. Battery Protection – Reverse polarity and discharge control.
5. Consumer Electronics – Power supplies, inverters, and portable devices.
Its low on-resistance (RDS(on)) and high current handling (up to 23A) make it suitable for efficient power switching.

Package

The IRFR5410PBF is a Power MOSFET housed in a TO-252 (DPAK) surface-mount package. This package type offers efficient thermal performance and is commonly used for power applications. It features three leads (gate, drain, source) and a tab for heat dissipation. The compact design makes it suitable for space-constrained PCB layouts.

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