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MT40A512M16JY-075E:B
+BOMIC DRAM 8GBIT PARALLEL 96FBGA
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제조업체 부품 #MT40A512M16JY-075E:B
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사양
| 속성 | 가치 |
| PartStatus | Obsolete |
| BaseProductNumber | MT40A512M16 |
| DigiKeyProgrammable | Not Verified |
| MemoryType | Volatile |
| MemoryFormat | DRAM |
| Technology | SDRAM - DDR4 |
| MemorySize | 8Gbit |
| MemoryOrganization | 512M x 16 |
| MemoryInterface | Parallel |
| ClockFrequency | 1.33 GHz |
| Voltage-Supply | 1.14V ~ 1.26V |
| OperatingTemperature | 0°C ~ 95°C (TC) |
| MountingType | Surface Mount |
| Package | 96-TFBGA |
| SupplierDevicePackage | 96-FBGA (8x14) |
| Packaging | Tray |
개요
Description
This DRAM chip offers several advanced features, including an improved bank-group architecture, which enhances efficiency and speed by allowing concurrent data operations. It also supports a wide operating temperature range, making it suitable for various applications in computing, networking, and enterprise environments. The MT40A512M16JY-075E:B is packaged in a compact FBGA (Fine-pitch Ball Grid Array) form, facilitating easy integration into electronic systems. Its design ensures reliability and stability, catering to the demanding needs of modern high-performance computing systems.
Equivalent
1. Samsung K4A8G165WB-BCTD
2. SK Hynix H5AN8G6NAFR-UHC
3. Kingston D4AG8S1M16-075
These alternatives should have similar speed, capacity, and form factors to ensure compatibility. Always verify specific technical details to ensure a proper match for your application.
Features
1. Density & Configuration: 512 Meg x 16, providing a total capacity of 8 Gb.
2. Speed: Operates with a data rate of up to 2,666 MT/s (million transfers per second).
3. Voltage: Requires a standard operating voltage of 1.2V, which enhances power efficiency.
4. Package: Available in a FBGA (Fine-pitch Ball Grid Array) package, which supports high-density, compact designs.
5. Low Power: Incorporates power-saving features such as the on-die termination and partial-array self-refresh.
6. Reliability: Features error correction capabilities to ensure data integrity and reliability.
7. Temperature Range: Designed to operate across a wide temperature range, suitable for various applications.
These features make it suitable for applications in computing systems that demand high performance and reliability, such as servers, desktops, and laptops.
Pinout
The functions of this DRAM include providing high-speed data storage and retrieval, typically used in computing applications such as servers, desktops, and laptops. Key functions and features of DDR4 include improved performance and bandwidth compared to previous generations, lower power consumption, and enhanced reliability and stability. It supports features like bank group architecture, internal Vref, and a command/address parity option for improved data integrity. The chip operates with a data rate of 2133 MT/s to 2666 MT/s and is designed for high-performance applications where speed and efficiency are crucial.
Manufacturer
Application
1. Computing Systems: Used in desktops, laptops, and servers to enhance processing speed and efficiency.
2. Data Centers: Supports cloud computing and big data analytics by providing faster data access and increased bandwidth.
3. Networking Equipment: Essential for routers and switches to manage large data traffic efficiently.
4. Telecommunications: Supports infrastructure requiring high-speed data transmission.
5. Embedded Systems: Used in industrial and automotive systems requiring robust and reliable memory solutions.
These applications benefit from the chip's low latency and high throughput capabilities.
Package
Frequently Asked Questions
Q: What is the memory density and organization of the MT40A512M16JY-075E:B?
A: It is 8Gbit (8Gb) density, organized as 512M words x 16 bits (512M x 16), using a parallel interface.
Q: What is the operating voltage range for this DDR4 SDRAM?
A: The supply voltage (VDD) is 1.14V to 1.26V, with a nominal 1.2V operation typical for DDR4.
Q: What is the maximum clock frequency of this Micron memory?
A: It supports a 1.33 GHz clock frequency, corresponding to DDR4-2666 data rate performance.
Q: What is the operating temperature range for this component?
A: It is rated for an operating temperature (TC) of 0°C to 95°C, suitable for commercial or extended temperature applications.
Q: What package type does the MT40A512M16JY-075E:B use?
A: It uses a 96-ball TFBGA (Thin Fine-Pitch Ball Grid Array) package, supplied in a 96-FBGA (8x14mm) form factor.
Q: Is this part still in active production or considered obsolete?
A: According to the specifications, the Part Status is marked as Obsolete, so it is no longer in active production.
Q: What memory technology does this component utilize?
A: It utilizes SDRAM - DDR4 (Double Data Rate 4) volatile memory technology for high-speed data transfers.