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MTFC8GAMALBH-IT

Name: MTFC8GAMALBH-IT
Rating: 4.8 (15 reviews)

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IC FLASH 64GBIT MMC 153TFBGA

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사양

속성	가치
Series	e•MMC™
Part Status	Obsolete
Base Product Number	MTFC8
DigiKey Programmable	Not Verified
Memory Type	Non-Volatile
Memory Format	FLASH
Technology	FLASH - NAND
Memory Size	64Gbit
Memory Organization	8G x 8
Memory Interface	MMC
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package	153-TFBGA
Supplier Device Package	153-TFBGA (11.5x13)
Packaging	Tray

개요

Description

The MTFC8GAMALBH-IT is a model of e.MMC (embedded MultiMediaCard) flash storage, often used in electronic devices like smartphones, tablets, and other consumer electronics for data storage. It combines NAND flash memory and a controller within a single package, offering advantages such as simplified integration, reduced footprint, and efficient management of storage operations. This specific model is likely part of a series that offers varying capacities and performance features to meet different application needs. With its integrated memory management, including wear leveling and error correction, e.MMC is a robust choice for embedded systems requiring reliable, high-speed data storage. Its compact design and efficient performance make it a popular choice for manufacturers seeking to optimize the balance between cost, space, and performance in their devices.

Equivalent

The MTFC8GAMALBH-IT is an eMMC memory chip manufactured by Micron. Equivalent products from other manufacturers might include:
1. Samsung eMMC with similar capacity and specifications.
2. SK Hynix eMMC chips with comparable features.
3. Kingston eMMC solutions with matching capacities.
4. Toshiba (Kioxia) eMMC products offering similar performance.
When looking for equivalents, ensure matching specifications like capacity (8GB), interface, and temperature ratings. Always check datasheets for precise compatibility.

Features

The MTFC8GAMALBH-IT is a NAND flash memory chip, typically utilized in various electronic devices for data storage. Here are some key features:
1. Capacity: It offers an 8GB storage capacity, making it suitable for moderate data storage needs in consumer electronics.
2. NAND Technology: Utilizes Multi-Level Cell (MLC) NAND technology for storing multiple bits per cell, balancing cost, performance, and endurance.
3. e.MMC Interface: The chip uses the e.MMC (embedded MultiMediaCard) interface, simplifying integration with microprocessors by providing a standard connection for embedded applications.
4. Performance: Offers decent read and write speeds suitable for general-purpose applications, contributing to efficient data processing and retrieval.
5. Temperature Range: Designed to operate effectively within industrial temperature ranges, making it suitable for use in various environmental conditions.
6. Compact Size: The chip's compact packaging allows for integration in space-constrained devices like smartphones, tablets, and embedded systems.
These features make the MTFC8GAMALBH-IT a versatile option for manufacturers seeking reliable and efficient storage solutions in their devices.

Pinout

The MTFC8GAMALBH-IT is an eMMC (embedded MultiMediaCard) memory module manufactured by Micron Technology. It typically has a 153-ball BGA (Ball Grid Array) package. The primary function of this module is to provide non-volatile storage with NAND Flash memory integrated with a controller for managing storage operations.
This eMMC module is used in a variety of applications, including smartphones, tablets, and other embedded systems, due to its compact form and integrated storage management. The device supports various standard features such as boot partitions, partition management, and reliable write features, aligned with JEDEC standards for eMMC.
For detailed pin configurations and electrical specifications, referring to the official datasheet provided by Micron is recommended, as it includes comprehensive technical details.

Manufacturer

The MTFC8GAMALBH-IT is manufactured by Micron Technology, Inc. Micron is a leading American company in the semiconductor industry, specializing in the production of memory and storage solutions. Its products include DRAM, NAND flash memory, and other semiconductor devices that are crucial for a wide range of applications, from personal electronics to data centers and industrial systems. Micron is known for its innovation and focus on advancing memory technology to meet the evolving demands of the tech industry.

Application

The MTFC8GAMALBH-IT is a NAND Flash memory module commonly used in a variety of applications. It is typically utilized in consumer electronics, automotive systems, industrial devices, and mobile devices due to its reliable data storage capabilities. Its robust performance in harsh environments makes it ideal for automotive applications. Additionally, it is used in embedded systems and IoT devices where solid-state storage is essential for efficient data management. The module's high-speed data transfer rates and durability also make it suitable for use in portable devices such as smartphones and tablets.

Package

The MTFC8GAMALBH-IT is a BGA (Ball Grid Array) package type. BGA is a surface-mount packaging used for integrated circuits, providing a high-density connection by having solder balls on the underside for mounting onto a printed circuit board.

Frequently Asked Questions

Q: Is this e•MMC device compatible with JEDEC e•MMC standard 5.1?
A: Based on the specified parameters, it uses the MMC memory interface and is part of Micron's e•MMC series, but no specific JEDEC version is provided.

Q: What is the maximum sustained read speed for the 64Gbit NAND Flash?
A: The exact read speed depends on the host clock rate and interface timing; the datasheet should be consulted for specific throughput benchmarks.

Q: Can this component operate in industrial temperature environments down to -40°C?
A: Yes, the operating temperature range is specified as -40°C to 85°C (TA), making it suitable for industrial applications.

Q: Is this part designed for high-reliability data storage in embedded systems?
A: Yes, as a non-volatile NAND Flash with MMC interface and a wide temperature range, it is suitable for embedded storage applications.

Q: What is the package size for PCB layout design?
A: It is supplied in a 153-TFBGA package with dimensions 11.5x13 mm (Supplier Device Package).

Q: Is the memory organized as 8G x 8 bits, and is it byte-addressable?
A: Yes, the memory organization is 8G x 8 bits, yet access is managed through the MMC protocol block interface, not direct byte addressing.

Q: Does this part support the HS400 high-speed mode?
A: The base parameters do not explicitly specify supported modes; verify with the full manufacturer datasheet for interface speed capabilities.