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NT5CC256M16DP-DI

Name: NT5CC256M16DP-DI
Rating: 4.8 (15 reviews)

+BOM

1.35V 4Gbit 800MHz DDR3 SDRAM Memory (ICs) RoHS

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제조업체 부품 #NT5CC256M16DP-DI
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사양

속성	가치
Clock Frequency	800MHz
Memory Format	DDR3 SDRAM
Memory Size	4Gbit
Operating temperature	0℃~+95℃
Voltage - Supply	1.35V

개요

Equivalent

Equivalent products to the NT5CC256M16DP-DI (256Mb DDR3L SDRAM) include:
- MT41K256M16TW-107:P (Micron)
- K4B4G1646E-BCMA (Samsung)
- IS43TR16256B-125KBL (ISSI)
These are 256Mb (16Mx16) DDR3L chips with similar specs (1.35V, 1600Mbps). Verify pinout and timing compatibility for your design.

Pinout

The NT5CC256M16DP-DI is a 4Gb (256M × 16) DDR3L SDRAM chip.
- Pin Count: 96-ball FBGA (Fine-pitch Ball Grid Array).
- Key Functions:
- 16-bit data bus (DQ0-DQ15).
- Low-voltage operation (1.35V/1.5V) (DDR3L compatible).
- On-die termination (ODT) for signal integrity.
- Auto-refresh & self-refresh modes.
- CAS latency (CL) programmable for timing flexibility.
- A0-A15 address inputs for 256M × 16 organization.
Used in consumer electronics, networking, and embedded systems requiring low-power, high-speed memory.

Manufacturer

The NT5CC256M16DP-DI is a DDR3 SDRAM module manufactured by Nanya Technology Corporation, a Taiwanese company specializing in DRAM (Dynamic Random-Access Memory) products.
Nanya Technology is a major global player in the semiconductor industry, focusing on memory solutions for computing, consumer electronics, and networking applications. Founded in 1995, it is one of the leading DRAM suppliers, competing with companies like Samsung, SK Hynix, and Micron.
The company is known for its cost-effective and reliable memory products, serving OEMs and various tech sectors.

Application

The NT5CC256M16DP-DI is a DDR3 SDRAM chip primarily used in:
- Computing systems (desktops, laptops, servers)
- Networking equipment (routers, switches)
- Embedded systems (industrial automation, medical devices)
- Consumer electronics (smart TVs, gaming consoles)
- Telecommunications infrastructure (base stations, data centers)
It provides high-speed, low-latency memory (4Gb capacity, 16-bit bus) for applications requiring efficient data processing and storage.

Package

The NT5CC256M16DP-DI is a DDR3 SDRAM chip in a 78-ball FBGA (Fine-Pitch Ball Grid Array) package. It measures 9mm x 9mm and is designed for high-speed, low-power applications. The FBGA package ensures compact size and efficient thermal performance, suitable for embedded systems and mobile devices.

Frequently Asked Questions

Q: What is the maximum operating clock frequency of the NT5CC256M16DP-DI?
A: The part supports a maximum clock frequency of 800 MHz, compliant with DDR3-1600 data rate standards.

Q: Is this component only suitable for standard 1.5V DDR3 systems?
A: No, it operates at a supply voltage of 1.35V, making it a low-power DDR3L (DDR3 Low Voltage) device, backward compatible with standard 1.5V.

Q: What is the memory density and organization of this chip?
A: It has a density of 4 Gbit, organized as 256M words x 16 bits per word (256Mx16).

Q: What is the operating temperature range for this DDR3 memory?
A: The specified operating temperature range is 0°C to +95°C, suitable for commercial and industrial temperature applications.

Q: Is this part applicable for high-reliability industrial designs?
A: With its 1.35V low voltage and wide temperature range up to 95°C, it is well-suited for embedded systems and industrial computing.