NT6CL256M32AM-H1

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NT6CL256M32AM-H1

+BOM

8Gbit 1.14V~1.3V 933MHz BGA-178 Memory (ICs) RoHS

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

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사양

속성 가치
Packaging BGA-178
Clock Frequency 933MHz
Memory Size 8Gbit
Operating Temperature -30℃~+105℃
Voltage - Supply 1.14V~1.3V

개요

Description

The NT6CL256M32AM-H1 is a high-performance, low-power DRAM module designed for a variety of applications, including computing and telecommunications. Specifically, it is a 256 Megabit (Mb) DRAM configured as 8M x 32 bits, which makes it suitable for systems requiring fast data processing and efficient storage capabilities. This module operates at low voltage levels, which helps in reducing overall power consumption. It typically supports high-speed data transfer rates, making it ideal for modern computing environments where rapid data access is crucial.
The module's architecture ensures high reliability and performance, with advanced error-correction features that reduce data corruption risks. Its compact form factor allows for easy integration into a wide range of electronic devices, from consumer electronics to industrial systems. The NT6CL256M32AM-H1 is often used in applications that demand robust memory solutions, such as embedded systems, networking equipment, and advanced consumer electronics. Its design ensures durability and efficiency, contributing to the overall stability and performance of the systems in which it is employed.

Equivalent

The NT6CL256M32AM-H1 is a NAND Flash memory chip. Equivalent products would typically be other 8Gb NAND Flash memory chips with similar specifications from different manufacturers. Potential equivalents could include products from companies like Micron, Samsung, Toshiba, or Western Digital, which offer NAND Flash chips with similar capacity, interface, voltage, and performance characteristics. Always verify the specific technical details and compatibility requirements before making substitutions.

Features

The NT6CL256M32AM-H1 is a high-performance DRAM component designed for various applications. Key features include:
1. Density and Configuration: It offers a 256Mb density organized into 32M x 32 bits configuration, providing efficient memory storage.
2. Technology: Built on advanced DRAM technology, ensuring reliability and performance in demanding environments.
3. Speed: Capable of supporting high data rates and fast access times, suitable for applications requiring rapid data processing.
4. Voltage: Operates at standard DRAM voltage levels, ensuring compatibility with various systems and easy integration into existing designs.
5. Interface: Features a standard interface for seamless communication with other system components.
6. Temperature Range: Designed to operate across a broad temperature range, making it suitable for both consumer and industrial applications.
7. Package: Available in a compact package, optimizing space utilization in electronic devices.
These features make the NT6CL256M32AM-H1 a versatile choice for applications in fields such as computing, telecommunications, and consumer electronics.

Pinout

The NT6CL256M32AM-H1 is a low-power DDR4 SDRAM chip designed for high-speed data storage and retrieval in computing applications. It typically features a 78-ball FBGA (Fine-Pitch Ball Grid Array) package, consistent with other DDR4 SDRAMs of similar specifications. The chip's primary function is to provide volatile memory storage that supports fast read and write operations, crucial for applications requiring quick data access and high throughput.
As a 256Mb x 32 configuration, the NT6CL256M32AM-H1 offers a 32-bit data bus width, which facilitates efficient data handling. It is commonly utilized in scenarios where low power consumption and high performance are critical, such as in mobile devices, embedded systems, and other consumer electronics. The chip supports various power-saving features and speed enhancements, ensuring optimal balance between energy efficiency and performance.
For detailed information about the pin functions and specific configurations, consulting the official datasheet from the manufacturer is recommended.

Manufacturer

The NT6CL256M32AM-H1 is manufactured by Nanya Technology Corporation. Nanya is a Taiwanese company that specializes in the research, development, design, manufacturing, and sales of memory products, with a particular focus on DRAM (Dynamic Random Access Memory) solutions. The company is a significant player in the global semiconductor industry and is known for producing a wide range of memory products used in computers, servers, mobile devices, and various other electronic applications. Nanya Technology is part of the Formosa Plastics Group, one of Taiwan's largest conglomerates, which helps bolster its position in the semiconductor market.

Application

The NT6CL256M32AM-H1 is a type of LPDDR4 DRAM chip, commonly used in applications requiring high-performance memory with low power consumption. Key application areas include:
1. Mobile Devices: Utilized in smartphones and tablets for efficient power management and enhanced multitasking capabilities.
2. Consumer Electronics: Integrated into devices like smart TVs and gaming consoles for improved graphics and processing speeds.
3. Automotive Systems: Used in advanced driver-assistance systems (ADAS) and infotainment systems, where reliability and performance are critical.
4. IoT Devices: Supports various Internet of Things applications, providing efficient memory solutions for smart home devices and wearables.
5. Networking Equipment: Deployed in routers and switches for efficient data handling and low-latency operations.

Package

The NT6CL256M32AM-H1 is typically available in a BGA package. BGA stands for Ball Grid Array, which is a type of surface-mount packaging used for integrated circuits.

Frequently Asked Questions


Q: What is the memory density and organization of the NT6CL256M32AM-H1?
A: It features 8Gbit density organized as 256M x 32 bits, ideal for high-bandwidth applications in a single-chip package.


Q: What is the maximum clock frequency supported by this DRAM?
A: The device supports a maximum clock frequency of 933MHz, suitable for high-speed DDR3L or similar memory interfaces.


Q: What is the operating voltage range for this component?
A: It operates from 1.14V to 1.3V, allowing low-power 1.2V nominal operation while maintaining signal integrity.


Q: Can this memory be used in industrial temperature environments?
A: Yes, with an operating temperature range of -30°C to +105°C, it is suitable for industrial and automotive-grade applications.


Q: What is the package type of the NT6CL256M32AM-H1?
A: It comes in a 178-ball BGA package, offering a compact footprint for space-constrained PCB designs.


Q: Is this component compatible with standard DDR3L memory controllers?
A: Yes, based on the 933MHz clock and 1.2V supply, it is designed for DDR3L-1866 standard interfaces.


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