OMAPL132EZWTA2

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OMAPL132EZWTA2

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IC MPU OMAP-L1X 200MHZ 361NFBGA

  • 제조업체텍사스 인스트루먼트(주)

  • 제조업체 부품 #OMAPL132EZWTA2

  • 패키지 NFBGA-361

  • 재고3697

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Package / Case Bulk,Tray
Series OMAP-L1x
Part Status Active
Core Processor ARM926EJ-S
Number of Cores / Bus Width 1 Core, 32-Bit
Speed 200MHz
Co - Processors / DSP Signal Processing; C674x, System Control; CP15
RAM Controllers LPDDR, DDR2
Graphics Acceleration No
Ethernet 10/100Mbps (1)
USB USB 2.0 + PHY (1)
Voltage - I / O 1.8V, 3.3V
Operating Temperature -40°C ~ 105°C (TJ)

개요

Description

The OMAP-L132EZWTA2 is a part of Texas Instruments' OMAP-L1x family of processors, designed for embedded applications requiring efficient processing capabilities. This processor integrates an ARM9 CPU and a DSP (Digital Signal Processor) for handling high-performance tasks. Its architecture is optimized for low power consumption, making it suitable for portable and power-sensitive applications.
Key features include support for a variety of interfaces like UART, USB, and Ethernet, enhancing connectivity options. It also offers robust multimedia capabilities, including video and audio processing, which are essential for applications in sectors like industrial automation, medical devices, and communication systems.
The OMAP-L132EZWTA2 is built on a scalable and flexible platform, allowing developers to customize and optimize their applications. It also supports various development tools and software libraries, facilitating ease of development and integration.
Overall, the OMAP-L132EZWTA2 is well-suited for applications requiring a balance of performance, efficiency, and connectivity, particularly in embedded systems that demand reliable multimedia processing.

Equivalent

The OMAP-L132 (OMAPL132EZWTA2) is a DSP+ARM processor by Texas Instruments. Equivalent products can be found in similar DSP+ARM architectures, such as:
1. TI OMAP-L138 - Offers similar functionality with enhanced features.
2. TI AM1808 - Part of the Sitara series, providing close capabilities.
3. Analog Devices BF60x series - Offers similar DSP+ARM integration.
4. Freescale i.MX series - Some models offer comparable ARM cores with additional multimedia capabilities.
Choices depend on specific application requirements and additional features needed.

Features

The OMAPL132EZWTA2 is a digital signal processor (DSP) from Texas Instruments, designed for multimedia applications. It features an ARM926EJ-S core and a TMS320C674x DSP core, providing a balance between general-purpose processing and high-performance digital signal processing. Key features include a clock speed of up to 456 MHz for the DSP core and 300 MHz for the ARM core. It supports various peripherals such as UART, I2C, SPI, and McASP for audio applications. The device is built on a low-power architecture, making it suitable for battery-operated and portable devices. It also supports Linux and DSP/BIOS operating systems. Connectivity options include USB, EMAC (Ethernet MAC), and MMC/SD interfaces. The OMAPL132EZWTA2 is designed to handle complex audio and video processing tasks efficiently, catering to applications in consumer electronics, industrial automation, and multimedia devices. Its compact packaging and integration of multiple functionalities make it a versatile solution for developers looking to optimize performance and power consumption.

Pinout

The OMAPL132EZWTA2 is part of Texas Instruments' OMAP-L132 series, which are applications processors. These processors typically integrate an ARM processor and a DSP core to handle a wide range of applications. The OMAPL132 specifically is designed for low-power applications and is often used in industrial and consumer electronics.
The OMAPL132EZWTA2 comes in a ZWT package, which is a 361-pin BGA (Ball Grid Array) format. This package allows for a high pin density, enabling the processor to connect with various peripherals and interfaces.
Key functions of the OMAPL132 include:
1. ARM and DSP Processing: It integrates an ARM9 core for general-purpose processing and a C674x DSP core for digital signal processing tasks.
2. Connectivity: It supports various interfaces such as UART, I2C, SPI, and McASP, making it versatile for different applications.
3. Memory Support: It supports external memory interfaces for SDRAM, NAND, and NOR flash.
4. Low Power Consumption: Designed for energy-efficient operations in embedded systems.
For detailed specifications and pin assignments, referring to the official Texas Instruments datasheet is recommended.

Manufacturer

The OMAPL132EZWTA2 is manufactured by Texas Instruments (TI). Texas Instruments is an American technology company that designs and manufactures semiconductors and various integrated circuits. It is known for its development of analog chips and embedded processors, which are used in a wide array of electronic devices and applications. TI's products are utilized in industries such as automotive, industrial, personal electronics, and communications equipment. The company is one of the largest semiconductor companies in the world and has a significant role in the electronics supply chain.

Application

The OMAP-L132 (OMAPL132EZWTA2) is a digital signal processor (DSP) and ARM processor designed for embedded systems. Its application areas include:
1. Industrial Automation: Used in programmable logic controllers (PLCs) and robotics for process control and automation.
2. Medical Devices: Supports medical imaging, patient monitoring, and diagnostics equipment.
3. Audio Processing: Facilitates audio encoding, decoding, and signal processing in consumer electronics.
4. Telecommunications: Powers communication infrastructure like network routers and gateways.
5. Consumer Electronics: Employed in products needing multimedia processing capabilities.
6. Security and Surveillance: Enhances image and video processing in security systems.
These applications leverage its efficient processing capabilities and low power consumption.

Package

The OMAPL132EZWTA2 is typically available in a BGA (Ball Grid Array) package. This type of packaging is used for mounting devices such as microprocessors and other integrated circuits. It allows for a high number of interconnection pins in a small footprint, providing better performance and reliability in electronic applications.

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