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OMAPL138BZCED4
+BOMIC MPU OMAP-L1X 456MHZ 361NFBGA
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제조업체텍사스 인스트루먼트(주)
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제조업체 부품 #OMAPL138BZCED4
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데이터시트 OMAPL138BZCED4 DataSheet
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재고7631
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사양
| 속성 | 가치 |
| Series | OMAP-L1x |
| Part Status | Obsolete |
| Core Processor | ARM926EJ-S |
| Number of Cores/Bus Width | 1 Core, 32-Bit |
| Speed | 456MHz |
| Co-Processors/DSP | Signal Processing; C674x, System Control; CP15 |
| RAM Controllers | SDRAM |
| Graphics Acceleration | No |
| Display & Interface Controllers | LCD |
| Ethernet | 10/100Mbps (1) |
| SATA | SATA 3Gbps (1) |
| USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) |
| Voltage - I/O | 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 90°C (TJ) |
| Security Features | Boot Security, Cryptography |
| Mounting Type | Surface Mount |
| Package / Case | 361-LFBGA |
| Supplier Device Package | 361-NFBGA (13x13) |
| Additional Interfaces | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART |
| Base Product Number | OMAPL138 |
개요
Description
Key features include:
- Processing Power: The ARM core handles high-level tasks, while the DSP core is optimized for complex mathematical computations, ideal for real-time applications.
- Memory and I/O: It supports various memory interfaces (DDR, SRAM) and offers multiple peripheral options, including UART, SPI, I2C, and GPIO for flexible connectivity.
- Low Power Consumption: Designed for energy efficiency, making it suitable for battery-operated and power-sensitive applications.
- Development Support: It is supported by a range of development tools and software, including TI's Code Composer Studio.
Overall, the OMAPL138BZCED4 is a versatile solution for developers seeking robust performance in embedded processing environments.
Equivalent
Features
1. Architecture: It integrates an ARM926EJ-S core for general-purpose processing and a TMS320C674x DSP core for high-performance digital signal processing.
2. Performance: It operates at speeds up to 456 MHz, allowing efficient handling of complex algorithms and multimedia tasks.
3. Memory: Supports various memory interfaces, including DDR2 and DDR3, facilitating flexible system design.
4. I/O Interfaces: Equipped with multiple connectivity options, including SPI, I2C, UART, and GPIO, enabling versatile peripheral integration.
5. Video Processing: Capable of handling video codecs and image processing applications, making it suitable for multimedia devices.
6. Power Management: Features advanced power management capabilities for efficient performance in battery-powered applications.
7. Development Support: Compatible with various development tools and software platforms, enhancing ease of use for developers.
This combination of features makes the OMAPL138 suitable for applications in industrial automation, medical devices, and consumer electronics.
Pinout
The OMAPL138 integrates an ARM9 core and a C674x DSP core, making it suitable for applications requiring high-performance processing with low power consumption. Key functions include:
1. Digital Signal Processing: The C674x DSP enables advanced audio, video, and signal processing tasks.
2. ARM Processing: The ARM9 core supports general-purpose computing and control tasks.
3. Connectivity: Interfaces such as UART, SPI, I2C, and USB support various peripheral connections.
4. Multimedia Processing: Built-in support for imaging and sound processing, useful in embedded applications.
5. Memory Interfaces: Supports DDR2 and SRAM for flexible memory management.
This versatile SoC is widely used in applications like industrial automation, medical devices, and consumer electronics.
Manufacturer
The OMAPL138 is part of TI's OMAP (Open Multimedia Applications Platform) family, specifically designed for low-power applications that require multimedia processing capabilities. TI focuses on developing high-performance, power-efficient products that enable advanced functionality in devices such as smartphones, tablets, and embedded systems.
Overall, Texas Instruments is a key player in the electronics sector, with a strong commitment to research and development, contributing to advancements in technology and enhancing the capabilities of electronic devices globally.