사양
| 속성 | 가치 |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Part Status | Last Time Buy |
| Protocol | I²C |
| Function | Controller |
| Interface | SPI |
| Voltage - Supply | 2.4V ~ 3.6V |
| Supply Current | 11mA |
| Operating Temperature | -40°C ~ 85°C |
개요
Description
The SC18IS600IPW/S8HP is a bridge chip designed by NXP Semiconductors that facilitates communication between an I²C-bus and an SPI interface. It serves as a master on the I²C-bus and an SPI slave, enabling data transfer between devices using these two different protocols. The primary function of this chip is to convert I²C commands into SPI commands, streamlining communication in systems where these protocols coexist.
Key features of the SC18IS600IPW/S8HP include its ability to operate in I²C-bus frequencies up to 400 kHz and SPI clock frequencies up to 1.8 MHz. It has four general-purpose input/output (GPIO) pins and supports multiple SPI devices without the need for additional select lines through software. The chip operates over a wide voltage range, enhancing its versatility in various applications. Typical use cases include LCD displays, EEPROMs, and other peripherals where protocol bridging is necessary. The SC18IS600IPW/S8HP is packaged in a compact TSSOP, making it suitable for space-constrained applications.
Key features of the SC18IS600IPW/S8HP include its ability to operate in I²C-bus frequencies up to 400 kHz and SPI clock frequencies up to 1.8 MHz. It has four general-purpose input/output (GPIO) pins and supports multiple SPI devices without the need for additional select lines through software. The chip operates over a wide voltage range, enhancing its versatility in various applications. Typical use cases include LCD displays, EEPROMs, and other peripherals where protocol bridging is necessary. The SC18IS600IPW/S8HP is packaged in a compact TSSOP, making it suitable for space-constrained applications.
Equivalent
The SC18IS600IPW/S8HP is an I2C-bus to SPI bridge from NXP Semiconductors. Equivalent products might include:
1. Maxim Integrated MAX3421E - USB to SPI/I2C interface.
2. Microchip Technology MCP2210 - USB to SPI bridge.
3. TI TCA8418 (if focused on keypad interface with I2C).
4. FTDI FT4222H - USB to I2C/SPI bridge.
5. Silicon Labs CP2130 - USB to SPI bridge.
Please verify compatibility based on detailed specifications and application requirements.
1. Maxim Integrated MAX3421E - USB to SPI/I2C interface.
2. Microchip Technology MCP2210 - USB to SPI bridge.
3. TI TCA8418 (if focused on keypad interface with I2C).
4. FTDI FT4222H - USB to I2C/SPI bridge.
5. Silicon Labs CP2130 - USB to SPI bridge.
Please verify compatibility based on detailed specifications and application requirements.
Features
The SC18IS600IPW/S8HP is a bridge IC from NXP Semiconductors designed to interface between I²C-bus and SPI (Serial Peripheral Interface). It enables communication between devices with these different protocols. Key features include:
1. I²C Interface: Operates as a slave device with a data rate of up to 400 kbit/s.
2. SPI Interface: Functions as a master device, supporting SPI clock speeds up to 1.8 Mbit/s.
3. Voltage Range: Operates with a supply voltage between 2.4 V and 3.6 V.
4. Eight Programmable I/O Pins: Can be configured as inputs or outputs, offering flexibility for various applications.
5. Clock Stretching and Idle Modes: Enhances performance and power efficiency.
6. Low Power Consumption: Suitable for battery-operated devices.
7. Compact Package: Available in TSSOP8, making it ideal for space-constrained designs.
This IC is useful for applications requiring protocol conversion, such as sensor interfacing or expanding I²C-bus systems with SPI peripherals.
1. I²C Interface: Operates as a slave device with a data rate of up to 400 kbit/s.
2. SPI Interface: Functions as a master device, supporting SPI clock speeds up to 1.8 Mbit/s.
3. Voltage Range: Operates with a supply voltage between 2.4 V and 3.6 V.
4. Eight Programmable I/O Pins: Can be configured as inputs or outputs, offering flexibility for various applications.
5. Clock Stretching and Idle Modes: Enhances performance and power efficiency.
6. Low Power Consumption: Suitable for battery-operated devices.
7. Compact Package: Available in TSSOP8, making it ideal for space-constrained designs.
This IC is useful for applications requiring protocol conversion, such as sensor interfacing or expanding I²C-bus systems with SPI peripherals.
Pinout
The SC18IS600IPW/S8HP is an I2C-bus to SPI bridge manufactured by NXP Semiconductors. It comes in an 8-pin TSSOP package. Here is a summary of the pin functions:
1. VDD (Pin 1): Power supply pin.
2. GND (Pin 2): Ground connection.
3. SCL (Pin 3): I2C-bus clock input.
4. SDA (Pin 4): I2C-bus data input/output.
5. S0 (Pin 5): SPI slave select output (active low).
6. SO (Pin 6): SPI data output (also known as MISO - Master In Slave Out).
7. SI (Pin 7): SPI data input (also known as MOSI - Master Out Slave In).
8. SCLK (Pin 8): SPI clock output.
The SC18IS600IPW/S8HP acts as a bridge between an I2C-bus, allowing it to interface with SPI-based devices, effectively translating data communication between these two protocols.
1. VDD (Pin 1): Power supply pin.
2. GND (Pin 2): Ground connection.
3. SCL (Pin 3): I2C-bus clock input.
4. SDA (Pin 4): I2C-bus data input/output.
5. S0 (Pin 5): SPI slave select output (active low).
6. SO (Pin 6): SPI data output (also known as MISO - Master In Slave Out).
7. SI (Pin 7): SPI data input (also known as MOSI - Master Out Slave In).
8. SCLK (Pin 8): SPI clock output.
The SC18IS600IPW/S8HP acts as a bridge between an I2C-bus, allowing it to interface with SPI-based devices, effectively translating data communication between these two protocols.
Manufacturer
The SC18IS600IPW/S8HP is manufactured by NXP Semiconductors. NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands. The company designs and supplies integrated circuits and other semiconductor components, with a focus on automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer, and computing markets. NXP is known for its innovation in the areas of secure connectivity solutions, microcontrollers, and advanced driver-assistance systems (ADAS). Established as an independent entity in 2006 after being spun off from Philips, NXP has grown through strategic acquisitions and partnerships to enhance its technology offerings and market reach.
Application
The SC18IS600IPW/S8HP is a bridge chip that facilitates communication between an I²C bus and an SPI interface. It is commonly used in applications where integration between devices using these two communication protocols is required. Typical application areas include:
1. Embedded systems: Facilitating communication between microcontrollers and peripheral devices.
2. Industrial automation: Enabling data exchange between sensors and control units.
3. Consumer electronics: Connecting various components like displays or sensors using different protocols.
4. IoT devices: Allowing seamless integration of sensors and modules with varying communication interfaces.
5. Automotive systems: Bridging communication between different electronic control units (ECUs) and sensors.
These applications benefit from the SC18IS600IPW/S8HP's ability to simplify system design and improve interoperability.
1. Embedded systems: Facilitating communication between microcontrollers and peripheral devices.
2. Industrial automation: Enabling data exchange between sensors and control units.
3. Consumer electronics: Connecting various components like displays or sensors using different protocols.
4. IoT devices: Allowing seamless integration of sensors and modules with varying communication interfaces.
5. Automotive systems: Bridging communication between different electronic control units (ECUs) and sensors.
These applications benefit from the SC18IS600IPW/S8HP's ability to simplify system design and improve interoperability.
Package
The SC18IS600IPW/S8HP is packaged in a TSSOP-8 (Thin Shrink Small Outline Package) format. This type of packaging is commonly used for integrated circuits and is known for its small size and low profile, making it suitable for compact electronic devices.
