사양
| 속성 | 가치 |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Part Status | Last Time Buy |
| Protocol | I²C |
| Function | Controller |
| Interface | SPI |
| Voltage - Supply | 2.4V ~ 3.6V |
| Supply Current | 11mA |
| Operating Temperature | -40°C ~ 85°C |
개요
Description
The SC18IS602BIPW/S8HP is a bridge IC produced by NXP Semiconductors. It serves the purpose of enabling communication between an I²C-bus and an SPI interface, effectively allowing devices with different communication protocols to interface seamlessly. This bridge IC is particularly useful in applications where an I²C master needs to communicate with SPI slave devices.
Key features of the SC18IS602BIPW/S8HP include its ability to operate at I²C-bus speeds up to 400 kHz and handle SPI speeds up to 1.8 Mbit/s. It supports SPI modes 0, 1, 2, and 3, providing flexibility for various device requirements. The IC comes in a compact TSSOP package and operates within a voltage range of 2.4 V to 3.6 V, making it suitable for low-power applications.
Additionally, it includes four programmable I/O pins, which can be used for various control functions, and has a simple command set for operation. This makes the SC18IS602BIPW/S8HP a versatile and efficient component for bridging I²C and SPI communication in embedded systems.
Key features of the SC18IS602BIPW/S8HP include its ability to operate at I²C-bus speeds up to 400 kHz and handle SPI speeds up to 1.8 Mbit/s. It supports SPI modes 0, 1, 2, and 3, providing flexibility for various device requirements. The IC comes in a compact TSSOP package and operates within a voltage range of 2.4 V to 3.6 V, making it suitable for low-power applications.
Additionally, it includes four programmable I/O pins, which can be used for various control functions, and has a simple command set for operation. This makes the SC18IS602BIPW/S8HP a versatile and efficient component for bridging I²C and SPI communication in embedded systems.
Features
The SC18IS602BIPW/S8HP is an I2C-bus to SPI bridge designed to interface systems using different communication protocols. Key features include:
1. Protocol Conversion: Converts I2C-bus commands to SPI, enabling communication between I2C masters and SPI slave devices.
2. I2C Compatibility: Supports I2C-bus frequencies up to 400 kHz.
3. SPI Support: Allows SPI clock frequencies up to 1.8 MHz with configurable clock polarity and phase.
4. Command-Based Operation: Utilizes simple command format for reading and writing SPI slave devices.
5. Slave Select Control: Provides control for up to four SPI slave devices through programmable slave select pins.
6. Low Power Consumption: Suitable for battery-operated devices due to its low power requirements.
7. Wide Voltage Range: Operates at a voltage range of 2.4 V to 3.6 V.
8. Package: Available in a small, space-efficient TSSOP8 package.
9. Temperature Range: Operates within a temperature range of -40°C to +85°C, suitable for industrial applications.
These features make the SC18IS602BIPW/S8HP ideal for applications requiring seamless I2C to SPI communication, such as sensor interfacing, peripheral expansion, and microcontroller systems.
1. Protocol Conversion: Converts I2C-bus commands to SPI, enabling communication between I2C masters and SPI slave devices.
2. I2C Compatibility: Supports I2C-bus frequencies up to 400 kHz.
3. SPI Support: Allows SPI clock frequencies up to 1.8 MHz with configurable clock polarity and phase.
4. Command-Based Operation: Utilizes simple command format for reading and writing SPI slave devices.
5. Slave Select Control: Provides control for up to four SPI slave devices through programmable slave select pins.
6. Low Power Consumption: Suitable for battery-operated devices due to its low power requirements.
7. Wide Voltage Range: Operates at a voltage range of 2.4 V to 3.6 V.
8. Package: Available in a small, space-efficient TSSOP8 package.
9. Temperature Range: Operates within a temperature range of -40°C to +85°C, suitable for industrial applications.
These features make the SC18IS602BIPW/S8HP ideal for applications requiring seamless I2C to SPI communication, such as sensor interfacing, peripheral expansion, and microcontroller systems.
Pinout
The SC18IS602BIPW/S8HP is an I2C-bus to SPI bridge manufactured by NXP Semiconductors. It is designed to allow communication between an I2C-bus and an SPI interface, enabling devices with these different protocols to interface seamlessly.
The SC18IS602BIPW/S8HP is housed in a TSSOP (Thin Shrink Small Outline Package) with 16 pins. The key functions of these pins include:
- I2C Interface: SDA (data line) and SCL (clock line) for I2C communication.
- SPI Interface: Includes SCK (clock), MOSI (Master Out Slave In), MISO (Master In Slave Out), and CS (Chip Select) for SPI communication.
- General-Purpose I/O: Several pins can be configured as GPIO for additional flexibility.
- Power Supply: VDD (power supply) and GND (ground) pins.
- Additional Control Pins: Such as RESET for device reset.
The SC18IS602BIPW/S8HP facilitates bridging communication between I2C and SPI devices, making it useful in applications where these different communication protocols need to interact.
The SC18IS602BIPW/S8HP is housed in a TSSOP (Thin Shrink Small Outline Package) with 16 pins. The key functions of these pins include:
- I2C Interface: SDA (data line) and SCL (clock line) for I2C communication.
- SPI Interface: Includes SCK (clock), MOSI (Master Out Slave In), MISO (Master In Slave Out), and CS (Chip Select) for SPI communication.
- General-Purpose I/O: Several pins can be configured as GPIO for additional flexibility.
- Power Supply: VDD (power supply) and GND (ground) pins.
- Additional Control Pins: Such as RESET for device reset.
The SC18IS602BIPW/S8HP facilitates bridging communication between I2C and SPI devices, making it useful in applications where these different communication protocols need to interact.
Manufacturer
The SC18IS602BIPW/S8HP is manufactured by NXP Semiconductors. NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands. It specializes in the design and manufacture of a wide range of semiconductor products, including integrated circuits, microcontrollers, and communication chips. NXP's products are used across various industries, such as automotive, industrial, mobile, and communication infrastructure. The company is known for its innovations in secure connectivity solutions and embedded applications, catering to the demands of the rapidly evolving technology landscape.
Application
The SC18IS602BIPW/S8HP is an I2C-bus to SPI bridge designed for interfacing microcontrollers with SPI devices using an I2C interface. Its application areas include:
1. Embedded Systems: Facilitates communication between microcontrollers with I2C and SPI-based peripherals.
2. Consumer Electronics: Used in devices requiring integration of components with differing communication protocols.
3. Industrial Automation: Enables connection of control systems with SPI sensors and actuators.
4. IoT Devices: Supports bridging communication protocols for seamless interaction between components.
5. Data Acquisition Systems: Allows integration of various sensors and data channels using different communication protocols.
Overall, it enhances design flexibility and reduces the need for multiple interfaces.
1. Embedded Systems: Facilitates communication between microcontrollers with I2C and SPI-based peripherals.
2. Consumer Electronics: Used in devices requiring integration of components with differing communication protocols.
3. Industrial Automation: Enables connection of control systems with SPI sensors and actuators.
4. IoT Devices: Supports bridging communication protocols for seamless interaction between components.
5. Data Acquisition Systems: Allows integration of various sensors and data channels using different communication protocols.
Overall, it enhances design flexibility and reduces the need for multiple interfaces.
Package
The SC18IS602BIPW/S8HP is a bridge IC from NXP Semiconductors, with a package type of TSSOP-16 (Thin Shrink Small Outline Package with 16 pins).
