THGBMFG8C2LBAIL

THGBMFG8C2LBAIL is a Toshiba (now Kioxia) 3D NAND flash memory device. The THGB prefix indicates Toshiba/Kioxia’s NAND family, and the rest encodes the specific variant in their 3D NAND line. This chip is a high-density nonvolatile storage element used in solid-state drives, embedded storage, memory cards, and related modules. It employs 3D vertical NAND architecture with multilevel-cell storage and on-chip features typical of modern NAND (ECC support, page/block organization, etc.). The exact capacity, performance (read/write speeds, IOPS), endurance (P/E cycles), voltage, and package type are defined in the official datasheet for this specific variant. To confirm precise specs, consult Kioxia/Toshiba’s datasheet or contact the supplier with the part number THGBMFG8C2LBAIL. In short: it’s a specific 3D NAND flash memory chip used as a storage component in various devices.

THGBMFG8C2LBAIL is a Toshiba (now Kioxia) 3D NAND flash device. There is no public one‑to‑one equivalent part number; cross‑references depend on density, interface, and packaging. To find equivalents, use Kioxia/Toshiba’s cross-reference tool or distributor catalogs (Digi‑Key, Mouser) with the exact device code and specify density and package to obtain matches.

THGBMFG8C2LBAIL is a Toshiba (now Kioxia) NAND flash memory device. Exact specifications require the official datasheet for this exact part number. In this family, you typically see:
- 3D NAND (BiCS) architecture
- High-density TLC (or QLC) per die
- ONFI-compatible interface
- Page sizes around 2–4 KB; block sizes often 128–256 pages
- ECC support and error correction
- Wear leveling and bad-block management
- Read-disturb protection
- Multiple voltage rails for core and I/O
Endurance and performance vary by capacity and process. For precise features (capacity, speed, endurance, voltages, packaging), please share the datasheet or a link to it.

I don’t have the exact pin count for THGBMFG8C2LBAIL in my data. It is a Toshiba/SK hynix (BiCS) 3D NAND flash device, i.e., non-volatile NAND memory. The pin count and pinout depend on the specific packaging (ball-grid array) used for this part. Please consult the manufacturer's datasheet or marking guide for the precise package pin count and pinout.

- Manufacturer: Kioxia (formerly Toshiba Memory Corporation/Toshiba).
- What kind of company: A Japanese multinational semiconductor company that designs, develops, and manufactures NAND flash memory and solid-state storage products; one of the world’s largest NAND flash makers.

THGBMFG8C2LBAIL is a NAND flash memory device. Common application areas:
- Embedded/mobile storage (smartphones, tablets, wearables)
- Consumer electronics (digital cameras, camcorders, set-top boxes, smart TVs, game consoles)
- Removable storage (USB drives, SD/memory cards)
- Automotive/industrial (infotainment, telematics, rugged embedded systems)
- Enterprise/storage subsystems (NAND in SSDs and related storage devices)
Used wherever high-density non-volatile flash storage is required.

Ball Grid Array (BGA) package.