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XC2S200-5FGG256I
+BOMIC FPGA 176 I/O 256FBGA
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제조업체AMD
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제조업체 부품 #XC2S200-5FGG256I
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재고7706
365 1일 품질 보증
7*24 영업 시간 서비스 보증
90-판매 후 1일 보증
정품 보증
사양
| 속성 | 가치 |
| Series | Spartan®-II |
| Part Status | Obsolete |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 5292 |
| Total RAM Bits | 57344 |
| Number of I/O | 176 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-FBGA (17x17) |
| Base Product Number | XC2S200 |
| Number of LA Bs / CL Bs | 1176 |
| Number of Gates | 200000 |
개요
Description
The Spartan-II series offers various advanced features, including fast, flexible, in-system programmability and re-programmability, a robust logic cell architecture, efficient memory management, and a variety of I/O standards. These features make it suitable for applications like telecommunications, consumer electronics, industrial control systems, and digital signal processing. Its cost-effectiveness makes it an ideal choice for prototyping and production systems where adaptability and performance are required without the higher costs associated with more advanced FPGA series.
Equivalent
Features
1. Logic Cells: It contains approximately 200,000 system gates and 2,376 logic cells.
2. Configurable Logic Blocks (CLBs): It contains 192 CLBs, which are configurable for implementing custom logic functions.
3. Memory: It offers 56 KB of distributed RAM.
4. I/O Pins: The device supports up to 176 user I/O pins, providing flexibility in interfacing.
5. Package: Comes in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package.
6. Speed Grade: The "-5" denotes a specific speed grade, indicating balanced performance and power.
7. Temperature Range: The "I" suffix indicates an industrial-grade temperature range, typically from -40°C to +100°C.
8. Supply Voltage: Operates at a core voltage of 2.5V, with 3.3V for I/O.
These features make it suitable for applications requiring moderate logic density and performance within industrial environments.
Pinout
The primary function of the XC2S200 FPGA is to provide a flexible hardware platform that can be configured to perform a wide variety of digital logic functions. This includes implementing custom logic circuits, digital signal processing, and interfacing with other hardware components. The device includes configurable logic blocks (CLBs), input/output blocks (IOBs), and embedded memory, allowing users to implement complex digital designs. The "-5" indicates the speed grade of the device, and the "I" suffix specifies that it is rated for industrial temperature ranges.
Manufacturer
In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a prominent semiconductor company that designs and produces CPUs, GPUs, and related technologies for PC, server, and embedded system applications. The acquisition, completed in 2022, allowed AMD to expand its portfolio and strengthen its position in the data center and embedded system markets by integrating Xilinx's cutting-edge FPGA technologies.
Application
1. Communications: Used in data processing, signal encoding/decoding, and protocol implementation.
2. Consumer Electronics: Supports video processing, image enhancement, and home automation systems.
3. Industrial Automation: Facilitates motor control, sensor interfacing, and real-time decision making.
4. Automotive: Implements infotainment systems, ADAS, and in-car networking.
5. Aerospace and Defense: Used for signal processing, encryption, and radar systems.
6. Medical Devices: Supports diagnostic equipment and patient monitoring systems.
These applications leverage the FPGA's reconfigurability, parallel processing capabilities, and performance efficiency.