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XC3S1200E-4FGG320I
+BOMIC FPGA 250 I/O 320FBGA
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제조업체AMD
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제조업체 부품 #XC3S1200E-4FGG320I
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재고9986
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사양
| 속성 | 가치 |
| Series | Spartan®-3E |
| Part Status | Obsolete |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 19512 |
| Total RAM Bits | 516096 |
| Number of I/O | 250 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 320-BGA |
| Supplier Device Package | 320-FBGA (19x19) |
| Base Product Number | XC3S1200 |
| Number of LA Bs / CL Bs | 2168 |
| Number of Gates | 1200000 |
개요
Description
The device is packaged in a 320-pin Fine Pitch Ball Grid Array (FBGA), which helps in efficient space utilization on PCBs. The XC3S1200E is suitable for applications such as embedded systems, signal processing, and custom hardware implementations. It also supports a wide range of development tools and libraries, facilitating design and prototyping. Overall, the XC3S1200E-4FGG320I is an efficient choice for engineers looking to implement custom digital logic solutions with flexibility and scalability.
Equivalent
Features
1. Logic Cells: 1,200 logic cells, enabling the implementation of complex digital designs.
2. I/O Pins: Up to 320 user-configurable I/O pins, providing flexibility for various interface requirements.
3. Memory: Includes block RAM (up to 6.1 Mb), allowing for efficient data storage and management.
4. DSP Slices: Integrated DSP slices for efficient signal processing tasks, beneficial for applications in communications and imaging.
5. Speed Grade: Operating at speed grade -4, supporting higher performance for demanding applications.
6. Configuration: Supports multiple configuration modes, including JTAG and SPI, facilitating ease of design and deployment.
7. Power Consumption: Low power consumption characteristics, making it suitable for portable and battery-operated designs.
8. Development Tools: Compatible with Xilinx development tools, enhancing design efficiency and productivity.
This FPGA is ideal for applications in automotive, industrial automation, and consumer electronics.
Pinout
The main functions of the XC3S1200E include:
- Logic Implementation: Provides programmable logic resources for custom digital circuits.
- I/O Capabilities: Supports various I/O standards, allowing integration with different interfaces and protocols.
- Memory Blocks: Contains embedded RAM for data storage and processing.
- Multipliers: Includes DSP slices for high-performance arithmetic operations.
- Configuration Options: Can be configured via JTAG or other methods to adapt to specific applications.
This FPGA is commonly used in applications like embedded systems, digital signal processing, and prototyping due to its versatility and performance.
Manufacturer
In 2020, Xilinx was acquired by AMD (Advanced Micro Devices, Inc.), further expanding its capabilities in high-performance computing and adaptive computing solutions. Xilinx products are widely used in various industries for applications such as digital signal processing, embedded systems, and data center operations. The XC3S1200E specifically belongs to the Spartan-3E family of FPGAs, which are designed for low-cost, low-power applications.
Application
1. Consumer Electronics: For video processing and image enhancement.
2. Automotive: In advanced driver-assistance systems (ADAS) and infotainment.
3. Telecommunications: For signal processing and network equipment.
4. Industrial Automation: In control systems and robotics.
5. Medical Devices: For imaging systems and diagnostics.
6. Military and Aerospace: In communication and radar systems.
Its flexibility, low power consumption, and cost-effectiveness make it suitable for these diverse applications.