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XC3SD1800A-4CSG484C
+BOMIC FPGA 309 I/O 484CSBGA
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제조업체AMD
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제조업체 부품 #XC3SD1800A-4CSG484C
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재고7730
365 1일 품질 보증
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90-판매 후 1일 보증
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사양
| 속성 | 가치 |
| Series | Spartan®-3A DSP |
| Part Status | Obsolete |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 37440 |
| Total RAM Bits | 1548288 |
| Number of I/O | 309 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 484-FBGA, CSPBGA |
| Supplier Device Package | 484-CSPBGA (19x19) |
| Base Product Number | XC3SD1800 |
| Number of LA Bs / CL Bs | 4160 |
| Number of Gates | 1800000 |
개요
Description
Key features include enhanced DSP slices for signal processing tasks, memory blocks for efficient data handling, and high-speed transceivers for communication. The XC3SD1800A also supports various interfaces like SPI, I2C, and LVDS, facilitating integration into diverse systems.
With a 484-pin CSG (Chip Scale Package) form factor, it provides a compact solution for space-constrained designs. The FPGA is programmable through Hardware Description Languages (HDLs), allowing for flexibility in design and rapid prototyping. Overall, the XC3SD1800A-4CSG484C is ideal for applications in telecommunications, automotive, and consumer electronics.
Equivalent
Features
1. Architecture: Based on the Spartan-3A architecture, optimized for cost and performance.
2. Logic Cells: Approximately 1.8 million system gates, providing extensive logic resources.
3. Embedded DSP: Features multiple dedicated DSP slices for efficient multiplication and accumulation operations.
4. Memory: Up to 1.4 Mbits of block RAM for data storage and buffering.
5. I/O: Supports up to 484 user I/O pins, with flexibility in voltage levels.
6. Speed Grade: Rated at -4 speed grade, enabling fast operation.
7. Configurable: Supports various I/O standards, including LVTTL, LVCMOS, and others.
8. Development Tools: Compatible with Xilinx ISE design tools for programming and simulation.
9. Applications: Ideal for communication, audio processing, and other DSP applications in consumer electronics, automotive, and industrial sectors.
Overall, it provides a balance of performance, efficiency, and versatility for various applications.
Pinout
The main functions of this FPGA include:
1. Configurable Logic Blocks (CLBs): Used for implementing custom logic and functions.
2. Digital Signal Processing (DSP) Slices: Optimized for high-performance signal processing tasks.
3. Memory Blocks: Integrated Block RAM for data storage.
4. I/O Pins: Configurable for various interfaces, supporting multiple standards like LVTTL, LVCMOS, and more.
5. Clock Management: Includes dedicated clock management resources.
This device is often utilized in applications such as digital signal processing, automotive, and telecommunications due to its flexibility and performance capabilities.
Manufacturer
The XC3SD1800A-4CSG484C is part of the Spartan-3 family of FPGAs, known for their cost-effectiveness and low power consumption, making them suitable for a wide range of applications, including consumer electronics, automotive, industrial automation, and telecommunications. Xilinx focuses on providing solutions that enhance design productivity and performance while meeting the evolving needs of the electronics industry. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities and resources in the semiconductor market.
Application
1. Digital Signal Processing (DSP): For applications requiring real-time data processing, such as audio and video processing.
2. Telecommunications: Used in networking equipment for data routing and management.
3. Embedded Systems: Ideal for custom hardware solutions in consumer electronics and industrial automation.
4. Automotive: Employed in advanced driver-assistance systems (ADAS) and infotainment systems.
5. Aerospace and Defense: Utilized in applications needing high reliability and processing power, such as radar and communications systems.
Its flexibility allows for rapid prototyping and development across these sectors.