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XC5VLX30-1FFG676C
+BOMIC FPGA 400 I/O 676FCBGA
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제조업체AMD
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제조업체 부품 #XC5VLX30-1FFG676C
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사양
| 속성 | 가치 |
| Series | Virtex®-5 LX |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 30720 |
| Total RAM Bits | 1179648 |
| Number of I/O | 400 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Base Product Number | XC5VLX30 |
| Number of LA Bs / CL Bs | 2400 |
개요
Description
With a 676-ball Fine Pitch Ball Grid Array (FBGA) package, the XC5VLX30-1FFG676C supports various I/O standards, enhancing its flexibility for interfacing with different components. Additionally, it incorporates advanced features such as hardened digital signal processing (DSP) blocks, high-speed transceivers, and extensive memory options, enabling complex algorithms and data handling.
The FPGA can be programmed using Hardware Description Languages (HDLs) like VHDL or Verilog, allowing designers to customize its functionality for specific applications. Overall, the XC5VLX30-1FFG676C is a robust choice for developers seeking high performance and versatility in FPGA solutions.
Equivalent
Features
1. Logic Cells: 30,000 logic cells, enabling complex computations and designs.
2. DSP Slices: Equipped with 24 DSP slices for high-performance digital signal processing tasks.
3. Block RAM: 2.6 Mb of Block RAM, providing on-chip memory for data storage and buffering.
4. I/O Pins: 676 I/O pins, offering extensive connectivity options for interfacing with other devices.
5. Transceiver Support: Capable of supporting high-speed serial interfaces, including up to 6.5 Gbps transceivers.
6. Power Consumption: Optimized for low power consumption, essential for energy-sensitive applications.
7. Programmability: Fully reconfigurable, allowing for flexibility in design and updates.
This FPGA is commonly used in various applications, including telecommunications, aerospace, and data processing.
Pinout
In terms of functionality, this FPGA features a range of resources including configurable logic blocks (CLBs), digital signal processing (DSP) slices, and block RAM, making it suitable for various applications such as communications, automotive, and industrial control systems. The 5V technology allows for high-performance applications with significant processing capabilities. The specific "1" indicates the speed grade, and "FFG" denotes the package type (Fine Pitch Ball Grid Array).
Overall, the XC5VLX30 is designed for high-performance digital circuit designs and provides flexibility through reconfigurability.
Manufacturer
Xilinx focuses on innovation in programmable technology, enabling design flexibility and efficiency for engineers and developers. The company's products allow for rapid prototyping and deployment of complex digital circuits and are often used in scenarios where customization and adaptability are essential. In October 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities and market reach within the semiconductor industry.
Application
1. Telecommunications: For high-speed data processing and switching.
2. Aerospace and Defense: In radar and signal processing systems.
3. Industrial Automation: For control systems and robotics.
4. Medical Devices: In imaging and diagnostic equipment.
5. Automotive: For advanced driver-assistance systems (ADAS).
6. Data Processing: In servers and computing platforms for acceleration tasks.
7. Consumer Electronics: In high-definition video processing and graphics.
These applications leverage its high performance, flexibility, and reconfigurability.